LFXP10C-3FN388C Equivalent & Substitute Parts

Part Overview

The LFXP10C-3FN388C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor, featuring 244 I/O pins and 10,000 logic elements in a 388-BBGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations. The XP series represents an earlier generation of Lattice FPGA technology, and substitute parts are necessary to maintain design continuity and access current manufacturing support.

Substiute Parts

LFXP10C-3FN388C

Lattice SemiconductorIn Stock: 1674LFXP10C-3FN388C Datasheet

Current PartRFQ

LFXP2-17E-5FN484C

Lattice Semiconductor CorporationIn Stock: 1505LFXP2-17E-5FN484C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFXP10C-3FN388C is determined by the following critical parameters:

Primary Substitution Criteria:

• Manufacturer: Lattice Semiconductor (same manufacturer required for design compatibility)
• Logic Element Capacity: Minimum 10,000 elements (equal or greater capacity)
• I/O Pin Count: Minimum 244 pins (equal or greater I/O capability)
• RAM Capacity: Minimum 221,184 bits (equal or greater memory)
• Supply Voltage Compatibility: Overlapping or compatible voltage ranges
• Package Type: Ball Grid Array (BGA) format with compatible pinout
• Operating Temperature Range: 0°C ~ 85°C (TJ) or broader

The LFXP2-17E-5FN484C qualifies as a substitute because it exceeds the minimum requirements across all critical parameters while maintaining Lattice Semiconductor manufacturing and BGA packaging standards.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-17E-5FN484C is the qualified substitute for the LFXP10C-3FN388C based on the following engineering factors:

Product Status Advantage: The substitute part maintains Active product status with current manufacturing support, whereas the main part is Obsolete. This ensures long-term availability and supply chain reliability.

Compliance and Certifications: The LFXP2-17E-5FN484C carries ROHS3 compliance certification, providing environmental and regulatory advantages over the main part specification. Both parts maintain identical REACH Unaffected status and ECCN/HTSUS classifications.

Capacity Margins: The substitute provides 70% greater logic element capacity (17,000 vs. 10,000), 28% additional RAM (282,624 vs. 221,184 bits), and 47% more I/O pins (358 vs. 244). These margins accommodate design growth and future feature expansion.

Thermal and Packaging Compatibility: Both parts operate within the same temperature range (0°C ~ 85°C TJ) and maintain identical Moisture Sensitivity Level (MSL 3). The 484-BBGA package preserves the 23x23mm footprint, enabling direct PCB layout compatibility with minor routing adjustments for additional I/O.

Voltage Supply Consideration: The substitute operates at a lower voltage range (1.14V ~ 1.26V) compared to the main part (1.71V ~ 3.465V). System power supply architecture must be evaluated to ensure compatibility with the substitute's voltage requirements.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FN484C be used as a direct pin-for-pin replacement?

A: The LFXP2-17E-5FN484C is not a direct pin-for-pin replacement. The main part uses a 388-BBGA package with 244 I/O pins, while the substitute uses a 484-BBGA package with 358 I/O pins. Both packages maintain the same 23x23mm footprint, but PCB layout modifications are required to accommodate the additional pins and updated pinout assignments.

Q: What are the key differences in electrical specifications?

A: The primary electrical difference is the supply voltage range. The LFXP10C-3FN388C operates at 1.71V ~ 3.465V, while the LFXP2-17E-5FN484C requires 1.14V ~ 1.26V. System power delivery networks must be redesigned to meet the substitute's lower voltage requirements. Both parts maintain identical operating temperature ranges and moisture sensitivity levels.

Q: Why is the substitute part recommended despite voltage differences?

A: The substitute's Active product status, ROHS3 compliance, and significantly greater capacity (logic elements, RAM, and I/O) outweigh the voltage specification difference. The voltage change is manageable through power supply redesign, whereas the obsolete status of the main part creates long-term supply and support risks.

Q: Are there any package compatibility considerations?

A: Both parts use BGA packaging with identical 23x23mm dimensions, but the pin count increase (244 to 358) requires PCB routing modifications. The additional I/O pins provide expanded functionality but demand careful layout planning to avoid signal integrity issues.

Q: What certifications and compliance standards apply to the substitute?

A: The LFXP2-17E-5FN484C is ROHS3 compliant and maintains REACH Unaffected status. Both parts share identical ECCN (3A991D) and HTSUS (8542.39.0001) classifications, ensuring regulatory consistency for export and procurement purposes.

Q: Is design validation required before implementing the substitute?

A: Yes. While the substitute meets all substitution criteria, system-level validation is necessary to confirm voltage supply compatibility, verify pinout assignments, and validate signal routing on the updated PCB layout. Functional testing should confirm that the increased logic element and RAM capacity do not introduce timing or resource allocation issues.