LFXP10C-3FN256C Equivalent & Substitute Parts

Part Overview

The LFXP10C-3FN256C is an XP series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 10,000 logic elements, 221,184 RAM bits, and 188 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations where XP series functionality is required.

Substiute Parts

LFXP10C-3FN256C

Lattice Semiconductor CorporationIn Stock: 18437LFXP10C-3FN256C Datasheet

Current PartRFQ

LFXP2-17E-5FTN256C

Lattice SemiconductorIn Stock: 1658LFXP2-17E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFXP2-17E-5FTN256C qualifies as a manufacturer-recommended substitute based on the following substitution criteria:

Package Compatibility: Both devices utilize 256-pin BGA packages with identical 17x17mm footprints, ensuring PCB layout compatibility without redesign.

Mounting and Environmental Specifications: Both parts are surface-mount devices with identical operating temperature ranges (0°C ~ 85°C) and equivalent moisture sensitivity levels (MSL 3, 168 hours), supporting identical assembly and storage protocols.

I/O Pin Count Alignment: The substitute provides 201 I/O pins compared to the original 188 pins, offering expanded I/O capacity within the same package footprint.

Functional Capacity: The LFXP2-17E-5FTN256C delivers increased logic resources (17,000 elements vs. 10,000) and greater RAM capacity (282,624 bits vs. 221,184 bits), providing enhanced design headroom.

Supply Voltage Consideration: The substitute operates at a narrower voltage range (1.14V ~ 1.26V) compared to the original (1.71V ~ 3.465V), requiring verification of system power delivery specifications.

Parameter Comparison

Engineering Selection Recommendations

Active Product Status: The LFXP2-17E-5FTN256C maintains active product status with current manufacturing support, ensuring long-term availability and supply chain stability compared to the obsolete LFXP10C-3FN256C.

Regulatory Compliance: The substitute meets ROHS3 compliance requirements, supporting modern environmental and regulatory standards for new designs and procurement cycles.

Physical and Thermal Compatibility: Identical package dimensions, mounting type, and operating temperature ranges eliminate thermal management redesign requirements.

Supply Voltage Specification: System power delivery architecture must accommodate the substitute's narrower voltage range (1.14V ~ 1.26V). Designs currently operating the original part across its full voltage range (1.71V ~ 3.465V) require power supply verification before substitution.

Design Capacity: The increased logic elements and RAM capacity of the substitute provide additional design flexibility without package or thermal constraints.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-17E-5FTN256C be used as a direct replacement for the LFXP10C-3FN256C?

A: Physical and thermal compatibility is confirmed through identical BGA package footprints and operating temperature ranges. However, the substitute's narrower supply voltage range (1.14V ~ 1.26V vs. 1.71V ~ 3.465V) requires verification of system power delivery specifications before implementation.

Q: What are the key differences between these two FPGA devices?

A: The primary differences are product series (XP vs. XP2), logic capacity (10,000 vs. 17,000 elements), RAM capacity (221,184 vs. 282,624 bits), I/O count (188 vs. 201 pins), supply voltage range, and product status (obsolete vs. active). Both share identical package dimensions and operating temperature specifications.

Q: Are there any PCB layout modifications required for substitution?

A: No PCB layout modifications are required. Both devices use 256-pin BGA packages with identical 17x17mm footprints and pin assignments compatible with the same socket or land pattern.

Q: What is the significance of the different package designations (256-BGA vs. 256-FTBGA)?

A: Both designations refer to 256-pin ball grid array packages with 17x17mm dimensions. The FTBGA variant indicates fine-pitch BGA technology used in the XP2 series. The physical footprint and mounting requirements remain identical.

Q: Does the increased I/O count (201 vs. 188) affect compatibility?

A: The additional 13 I/O pins are available for use but do not affect compatibility with existing designs. Designs utilizing only the original 188 I/O pins will function without modification, with the additional pins remaining available for future expansion.

Q: What compliance certifications apply to the substitute part?

A: The LFXP2-17E-5FTN256C is ROHS3 compliant and carries REACH Unaffected status, meeting current environmental and regulatory requirements for component procurement and assembly.