LFX200EB-05FN256C Equivalent & Substitute Parts

Part Overview

The LFX200EB-05FN256C is an ispXPGA® Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 160 I/O pins, 2704 logic elements, and 113664 total RAM bits in a 256-BGA package. The product is currently classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations.

Substiute Parts

LFX200EB-05FN256C

Lattice Semiconductor CorporationIn Stock: 787LFX200EB-05FN256C Datasheet

Current PartRFQ

LFXP2-5E-5FTN256C

Lattice Semiconductor CorporationIn Stock: 6496LFXP2-5E-5FTN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFX200EB-05FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA form factor with identical 17x17mm dimensions to ensure PCB footprint compatibility.

Logic Capacity: The substitute must provide equal or greater logic element count (minimum 2704 cells) to accommodate existing designs without architectural modification.

I/O Pin Count: The substitute must provide a minimum of 160 I/O pins to maintain signal routing compatibility.

RAM Capacity: The substitute must provide equal or greater total RAM bits (minimum 113664 bits) to support existing memory requirements.

Supply Voltage: The substitute must operate within or encompass the original supply voltage range (2.3V ~ 3.6V) or be compatible through voltage regulation schemes.

Operating Temperature Range: The substitute must support the industrial temperature range of 0°C ~ 85°C (TJ).

Regulatory Compliance: The substitute must maintain equivalent REACH and ECCN classifications for supply chain continuity.

Parameter Comparison

Engineering Selection Recommendations

The LFXP2-5E-5FTN256C serves as a direct substitute for the obsolete LFX200EB-05FN256C based on the following factors:

Package Compatibility: Both devices utilize identical 256-ball BGA packaging with 17x17mm dimensions, ensuring PCB footprint compatibility without layout redesign.

Functional Capacity: The LFXP2-5E-5FTN256C provides 5000 logic elements and 169984 RAM bits, exceeding the original device specifications and accommodating existing designs without architectural constraints.

I/O Availability: The substitute provides 172 I/O pins compared to the original 160 pins, maintaining full signal routing compatibility with additional capacity for future expansion.

Regulatory Alignment: Both devices maintain identical REACH Unaffected status and EAR99 export classification, ensuring supply chain and compliance continuity.

Production Status: The LFXP2-5E-5FTN256C is in active production with 6430 units in stock, providing reliable long-term availability compared to the obsolete original part.

Temperature and Moisture Specifications: Identical operating temperature range (0°C ~ 85°C) and MSL rating (3, 168 Hours) ensure equivalent environmental performance.

Voltage Consideration: The substitute operates at 1.14V ~ 1.26V supply voltage, which differs from the original 2.3V ~ 3.6V range. System designs must incorporate appropriate voltage regulation or power supply modification to accommodate this lower voltage requirement.

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-5E-5FTN256C be used as a direct drop-in replacement for the LFX200EB-05FN256C?

A: The LFXP2-5E-5FTN256C is mechanically and functionally compatible in terms of package footprint, I/O count, and logic capacity. However, the supply voltage difference (1.14V ~ 1.26V versus 2.3V ~ 3.6V) requires evaluation of the system power delivery architecture. If the original design uses 2.3V ~ 3.6V supply rails, voltage regulation or power supply modification is necessary.

Q: What are the key differences between these two devices?

A: The primary differences are product status (obsolete versus active), supply voltage range, and logic capacity. The LFXP2-5E-5FTN256C provides greater logic elements (5000 versus 2704), more RAM (169984 versus 113664 bits), and additional I/O pins (172 versus 160). Both maintain identical package dimensions, temperature range, and regulatory compliance.

Q: Are there any pin-to-pin compatibility concerns?

A: Both devices use the 256-BGA package with identical 17x17mm dimensions. While the LFXP2-5E-5FTN256C provides additional I/O pins (172 versus 160), the core pinout remains compatible for existing signal routing. Design verification is recommended to confirm pin assignment compatibility with the specific application.

Q: What is the impact of the different supply voltage ranges?

A: The original device operates at 2.3V ~ 3.6V, while the substitute requires 1.14V ~ 1.26V. This difference necessitates evaluation of the system power delivery network. Designs using the original voltage range must implement appropriate voltage regulation to supply the substitute device at its specified voltage level.

Q: Is the LFXP2-5E-5FTN256C available in the same packaging format?

A: Yes. Both devices use 256-ball BGA packaging with identical 17x17mm footprints. The LFXP2-5E-5FTN256C is supplied in Tray packaging, while the original part packaging is not specified. Both maintain identical MSL rating (3, 168 Hours) and handling requirements.

Q: What certifications and compliance standards apply to the substitute?

A: The LFXP2-5E-5FTN256C maintains REACH Unaffected status and EAR99 export classification, identical to the original device. Both devices comply with equivalent regulatory requirements for supply chain and international distribution.