LFX200EB-03FN256I Equivalent & Substitute Parts

Part Overview

The LFX200EB-03FN256I is an ispXPGA Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 160 I/O pins, 2704 logic elements, and 113664 total RAM bits in a 256-BGA package. The product is currently obsolete, making identification of compatible substitute parts essential for system redesign, legacy support, and production continuity.

Substiute Parts

LFX200EB-03FN256I

Lattice Semiconductor CorporationIn Stock: 903LFX200EB-03FN256I Datasheet

Current PartRFQ

LFXP2-5E-5FTN256I

Lattice Semiconductor CorporationIn Stock: 1771LFXP2-5E-5FTN256I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFXP2-5E-5FTN256I qualifies as a manufacturer-recommended substitute based on the following substitution criteria:

Allowed Substitution Parameters:

• Same manufacturer (Lattice Semiconductor Corporation)
• Identical package form factor (256-BGA, 17x17 footprint)
• Surface mount mounting type
• Compatible operating temperature range overlap (-40°C to 100°C)
• Identical MSL rating (3, 168 Hours)
• Same regulatory compliance classification (REACH Unaffected, EAR99, HTSUS 8542.39.0001)

Functional Capacity: The LFXP2-5E-5FTN256I provides increased logic capacity (5000 elements vs. 2704), expanded I/O capability (172 pins vs. 160), and greater RAM resources (169984 bits vs. 113664 bits), making it suitable for designs requiring equivalent or enhanced functionality within the same physical footprint.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The LFX200EB-03FN256I is obsolete. The LFXP2-5E-5FTN256I is active and currently in production, ensuring long-term availability and supply chain stability.

Compliance & Certifications: Both devices maintain identical regulatory classifications (REACH Unaffected, EAR99, HTSUS 8542.39.0001) and identical MSL ratings, confirming equivalent environmental and handling requirements.

Physical Compatibility: Both devices use 256-ball BGA packages with identical 17x17mm footprints, enabling direct PCB layout compatibility without redesign.

Supply Chain Status: The LFXP2-5E-5FTN256I is available in active inventory (1713 pcs), whereas the LFX200EB-03FN256I availability is limited to existing stock (878 pcs).

Frequently Asked Questions (FAQ)

Q: Can the LFXP2-5E-5FTN256I be used as a direct replacement for the LFX200EB-03FN256I?

A: Yes, within the constraints of supply voltage requirements. Both devices share identical BGA package dimensions (256-ball, 17x17mm), MSL ratings, and regulatory classifications. However, the LFXP2-5E-5FTN256I operates at 1.14V–1.26V, while the LFX200EB-03FN256I requires 2.3V–3.6V. Power supply circuitry must be redesigned accordingly.

Q: Are there any package differences between these devices?

A: Both use 256-ball BGA packages with identical 17x17mm footprints. The LFX200EB-03FN256I uses 256-FPBGA, while the LFXP2-5E-5FTN256I uses 256-FTBGA. These designations reflect internal ball arrangement differences but maintain identical external dimensions and PCB landing patterns.

Q: What is the maximum operating temperature difference?

A: The LFX200EB-03FN256I operates to 105°C (TJ), while the LFXP2-5E-5FTN256I operates to 100°C (TJ). Applications requiring operation above 100°C require the original device or alternative solutions.

Q: Does the LFXP2-5E-5FTN256I provide sufficient logic capacity for designs using the LFX200EB-03FN256I?

A: The LFXP2-5E-5FTN256I provides 5000 logic elements compared to 2704 in the original device, representing an 85% increase in capacity. This supports designs requiring equivalent or expanded functionality.

Q: What are the moisture sensitivity requirements for both devices?

A: Both devices carry MSL rating 3 (168 Hours), requiring identical handling, storage, and reflow procedures. No additional moisture management is required when transitioning between these parts.