LFECP6E-5FN256C Equivalent & Substitute Parts

Part Overview

The LFECP6E-5FN256C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 195 I/O pins, 6100 logic elements, and 94208 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The ECP2 series provides a direct functional successor with maintained electrical and mechanical compatibility.

Substiute Parts

LFECP6E-5FN256C

Lattice Semiconductor CorporationIn Stock: 1020LFECP6E-5FN256C Datasheet

Current PartRFQ

LFE2-6E-5FN256C

Lattice Semiconductor CorporationIn Stock: 3379LFE2-6E-5FN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP6E-5FN256C is determined by the following critical parameters:

• Package Compatibility: Both main and substitute parts use 256-FPBGA (17x17) surface mount packaging, ensuring mechanical and thermal compatibility on PCB layouts.
• Voltage Supply Range: Identical 1.14V ~ 1.26V supply voltage specification maintains power delivery compatibility.
• Operating Temperature Range: Both devices operate within 0°C ~ 85°C (TJ), ensuring thermal envelope compatibility.
• I/O Pin Count: The substitute part provides 190 I/O pins versus 195 on the main part. This 5-pin reduction must be evaluated against specific application requirements.
• Logic Element Capacity: The substitute provides 6000 logic elements compared to 6100 in the main part, representing a 0.8% reduction in programmable logic capacity.
• RAM Capacity: The substitute provides 56320 RAM bits versus 94208 in the main part, representing a 40.2% reduction in embedded memory.
• Moisture Sensitivity: Both devices maintain MSL 3 (168 Hours) classification.

The LFE2-6E-5FN256C is the manufacturer-recommended substitute, representing an upgrade from the obsolete ECP series to the active ECP2 series while maintaining core electrical and mechanical parameters.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-6E-5FN256C is the appropriate substitute for the obsolete LFECP6E-5FN256C based on the following factors:

• Product Status: The substitute is active and currently in production, ensuring long-term availability and supply chain continuity.
• Regulatory Compliance: Both devices maintain identical REACH Unaffected and EAR99 ECCN classifications, preserving export and regulatory compliance status.
• Packaging and Thermal Compatibility: Identical 256-FPBGA (17x17) package specifications and MSL 3 classification ensure direct PCB layout compatibility without redesign.
• Electrical Compatibility: Matching supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) maintain power delivery and thermal management compatibility.
• Design Capacity Considerations: Applications must account for reduced logic element capacity (6000 vs. 6100) and significantly reduced embedded RAM (56320 vs. 94208 bits). Design verification is required to confirm these reductions do not impact application functionality.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256C be used as a direct drop-in replacement for the LFECP6E-5FN256C?

A: The LFE2-6E-5FN256C shares identical package specifications (256-FPBGA 17x17), supply voltage range, and operating temperature range. However, the reduction in I/O pins (190 vs. 195), logic elements (6000 vs. 6100), and embedded RAM (56320 vs. 94208 bits) requires design verification to confirm compatibility with specific application requirements.

Q: What is the significance of the I/O pin reduction from 195 to 190?

A: The 5-pin reduction must be evaluated against the specific I/O utilization in the target application. If the design uses 191 or more I/O pins, the substitute part cannot be used without design modification.

Q: How does the embedded RAM reduction affect substitution feasibility?

A: The substitute provides 56320 RAM bits compared to 94208 bits in the main part, representing a 40.2% reduction. Applications relying on the full embedded memory capacity of the original device require design analysis to determine if this reduction is acceptable or if external memory solutions are necessary.

Q: Are there any compliance or regulatory differences between these parts?

A: Both devices maintain identical REACH Unaffected status and EAR99 ECCN classification. No regulatory or compliance differences exist between the main part and substitute.

Q: What is the packaging and moisture sensitivity consideration?

A: Both devices use 256-FPBGA (17x17) surface mount packaging with MSL 3 (168 Hours) classification. Moisture handling and storage requirements are identical, requiring no changes to component management procedures.