LFECP6E-4FN484C Equivalent & Substitute Parts

Part Overview

The LFECP6E-4FN484C is an ECP Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 224 I/O pins, 6100 logic elements, and 94208 total RAM bits in a 484-BBGA package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

Substiute Parts

LFECP6E-4FN484C

Lattice Semiconductor CorporationIn Stock: 1212LFECP6E-4FN484C Datasheet

Current PartRFQ

LFE2-12E-5FN484C

Lattice SemiconductorIn Stock: 2188LFE2-12E-5FN484C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP6E-4FN484C is determined by the following critical parameters:

• Package compatibility: 484-BBGA form factor with identical 23x23mm footprint
• Supply voltage range: 1.14V ~ 1.26V operational requirement
• Mounting type: Surface Mount configuration
• Operating temperature range: 0°C ~ 85°C (TJ)
• Moisture sensitivity level: MSL 3 (168 Hours)

The LFE2-12E-5FN484C qualifies as a substitute part because it maintains identical package specifications, voltage requirements, mounting type, temperature range, and MSL rating. While the substitute offers enhanced logic capacity (12000 elements vs. 6100) and increased I/O count (297 vs. 224), these represent functional improvements rather than incompatibilities, as the substitute remains pin-compatible within the same package family.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-12E-5FN484C is the manufacturer-recommended substitute for the obsolete LFECP6E-4FN484C. Selection of this substitute is supported by:

• Identical package footprint and pinout compatibility within the 484-BBGA form factor
• Matching supply voltage specifications (1.14V ~ 1.26V)
• Identical operating temperature range (0°C ~ 85°C TJ)
• Equivalent moisture sensitivity level (MSL 3, 168 Hours)
• Active product status ensuring long-term availability and supply chain continuity
• RoHS3 compliance of the substitute part meets current regulatory requirements
• Shared export control classification (ECCN 3A991D) and tariff codes (HTSUS 8542.39.0001)

The LFE2-12E-5FN484C represents the next-generation ECP2 architecture from Lattice Semiconductor, offering increased logic capacity and I/O count while maintaining full package and electrical compatibility with the original ECP series device.

Frequently Asked Questions (FAQ)

Q: Is the LFE2-12E-5FN484C a direct pin-for-pin replacement?

A: The LFE2-12E-5FN484C maintains identical package specifications (484-BBGA, 23x23mm footprint) and operates within the same voltage range (1.14V ~ 1.26V). However, design validation is required to confirm functional compatibility, as the substitute belongs to the ECP2 architecture rather than the original ECP series.

Q: What are the key differences between the LFECP6E-4FN484C and LFE2-12E-5FN484C?

A: The primary differences are logic capacity (6100 vs. 12000 elements), total RAM (94208 vs. 226304 bits), and I/O count (224 vs. 297 pins). The substitute offers enhanced capabilities within the same package envelope. Product status differs, with the original obsolete and the substitute active.

Q: Are there compliance or regulatory differences between these parts?

A: Both parts share identical REACH status (REACH Unaffected) and export control classification (ECCN 3A991D). The substitute part carries RoHS3 compliance certification, whereas the original part's RoHS status is not specified. Both are classified under HTSUS code 8542.39.0001.

Q: What is the moisture sensitivity level, and does it affect handling?

A: Both parts carry MSL 3 rating with a 168-hour floor life. This classification requires controlled storage conditions and limits the time between package opening and soldering. Handling procedures must comply with IPC-A-610 standards for MSL 3 components.

Q: Can I use the LFE2-12E-5FN484C in existing designs without modification?

A: Physical and electrical compatibility exists due to matching package specifications and voltage requirements. However, design review and testing are necessary to validate functional compatibility, as the substitute represents a different FPGA architecture (ECP2 vs. ECP) with different internal resources and capabilities.