LFECP6E-3FN256I Equivalent & Substitute Parts

Part Overview

The LFECP6E-3FN256I is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 195 I/O pins, 6100 logic elements, and 94208 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The ECP series has been superseded by newer architectures, requiring careful parameter matching for functional equivalence.

Substiute Parts

LFECP6E-3FN256I

Lattice Semiconductor CorporationIn Stock: 767LFECP6E-3FN256I Datasheet

Current PartRFQ

LFE2-6E-5FN256I

Lattice Semiconductor CorporationIn Stock: 1640LFE2-6E-5FN256I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP6E-3FN256I is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA package format (256-FPBGA 17x17) to ensure mechanical and electrical compatibility with existing PCB layouts and socket designs.

Voltage Supply Range: The substitute must operate within the 1.14V ~ 1.26V supply voltage specification to maintain compatibility with existing power delivery systems.

I/O Pin Count: The substitute must provide a minimum of 195 I/O pins. Devices with equal or greater I/O counts are acceptable, as additional pins do not compromise functionality in designs utilizing fewer pins.

Logic Element Capacity: The substitute must provide a minimum of 6100 logic elements to ensure designs utilizing the full capacity of the original part can be accommodated.

RAM Capacity: The substitute must provide a minimum of 94208 total RAM bits to support designs dependent on the original device's memory resources.

Operating Temperature Range: The substitute must support the -40°C ~ 100°C operating temperature range to maintain thermal compatibility.

Mounting Type: Both devices must use Surface Mount technology for PCB assembly compatibility.

The LFE2-6E-5FN256I meets these substitution criteria as an active product from the same manufacturer with compatible electrical and mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-6E-5FN256I is the manufacturer-recommended substitute for the obsolete LFECP6E-3FN256I. Selection of this substitute is justified by the following factors:

Product Status: The LFE2-6E-5FN256I maintains active product status with current manufacturing support from Lattice Semiconductor Corporation, ensuring long-term availability and supply chain stability compared to the obsolete LFECP6E-3FN256I.

Compliance and Certifications: Both devices share identical REACH status (REACH Unaffected), ECCN classification (EAR99), and HTSUS codes (8542.39.0001), ensuring regulatory and export compliance equivalence.

Electrical and Mechanical Compatibility: Identical voltage supply ranges, operating temperature specifications, package formats, and MSL ratings ensure direct compatibility with existing PCB designs and assembly processes.

Inventory Availability: The LFE2-6E-5FN256I is available in significantly higher quantities (1540 Pcs) compared to the LFECP6E-3FN256I (664 Pcs), providing improved procurement reliability.

Design Capacity Considerations: While the substitute provides reduced logic element, RAM, and I/O capacity, these reductions are acceptable for designs not utilizing the full capacity of the original device. Designs requiring the complete resource set of the LFECP6E-3FN256I must be evaluated for functional compatibility before substitution.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256I be used as a direct replacement for the LFECP6E-3FN256I without PCB modifications?

A: Yes, the LFE2-6E-5FN256I uses the identical 256-FPBGA (17x17) package format and pin count compatibility allows direct PCB socket replacement. However, design validation is required to confirm that reduced logic element and RAM capacity do not impact functionality.

Q: What is the primary difference between these two devices?

A: The LFE2-6E-5FN256I represents a newer generation (ECP2 series) with reduced logic element capacity (6000 vs. 6100), reduced RAM capacity (56320 vs. 94208 bits), and reduced I/O count (190 vs. 195). The substitute maintains identical electrical specifications and package format.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both devices share identical REACH status, ECCN classification, and HTSUS codes, ensuring equivalent regulatory and export compliance.

Q: Why does the substitute have lower I/O and logic element capacity?

A: The LFE2-6E-5FN256I is from a subsequent product generation (ECP2) that represents a different capacity tier within the same package family. Lattice Semiconductor Corporation designated this device as the manufacturer-recommended substitute based on electrical and mechanical compatibility.

Q: What should I verify before implementing this substitution in production?

A: Confirm that your design does not require more than 6000 logic elements, 56320 RAM bits, or 190 I/O pins. Verify that the ECP2 architecture is compatible with your design tools and firmware. Validate thermal and power delivery characteristics under your specific operating conditions.

Q: Is the LFE2-6E-5FN256I available in the same packaging options?

A: The LFE2-6E-5FN256I is supplied in Tray packaging, while the LFECP6E-3FN256I packaging specification was not provided. Both devices use the identical 256-FPBGA (17x17) physical package format.