LFECP6E-3FN256C Equivalent & Substitute Parts

Part Overview

The LFECP6E-3FN256C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 6100 logic elements, 94208 total RAM bits, and 195 I/O pins in a 256-BGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support and production continuity. The ECP2 series successor provides functional equivalence with enhanced specifications and active product status.

Substiute Parts

LFECP6E-3FN256C

Lattice Semiconductor CorporationIn Stock: 766LFECP6E-3FN256C Datasheet

Current PartRFQ

LFE2-6E-5FN256C

Lattice Semiconductor CorporationIn Stock: 3379LFE2-6E-5FN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP6E-3FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-FPBGA (17x17) package to ensure mechanical and electrical fit on existing PCBs.

Voltage Supply Range: The substitute must operate within the 1.14V ~ 1.26V supply voltage specification to maintain compatibility with existing power delivery systems.

I/O Pin Count: The substitute must provide a minimum of 195 I/O pins to support the same signal connectivity requirements. The LFE2-6E-5FN256C provides 190 I/O pins, representing a reduction of 5 pins that must be evaluated for specific application requirements.

Logic Capacity: The substitute must provide sufficient logic elements to accommodate the design. The LFECP6E-3FN256C contains 6100 logic elements; the LFE2-6E-5FN256C provides 6000 logic elements, a reduction of 100 elements (1.6%).

RAM Capacity: The substitute must provide adequate embedded RAM. The LFECP6E-3FN256C contains 94208 RAM bits; the LFE2-6E-5FN256C provides 56320 RAM bits, a reduction of 37888 bits (40.2%).

Operating Temperature Range: The substitute must support the 0°C ~ 85°C operating temperature range.

Mounting and Handling: Both parts use surface mount technology with identical MSL rating of 3 (168 Hours).

Parameter Comparison

Engineering Selection Recommendations

The LFE2-6E-5FN256C is the manufacturer-recommended substitute for the obsolete LFECP6E-3FN256C. Both devices share identical package geometry (256-FPBGA 17x17), voltage supply range (1.14V ~ 1.26V), operating temperature range (0°C ~ 85°C), and MSL rating (3). The LFE2-6E-5FN256C is an active product with current manufacturing support, addressing the obsolescence status of the original part.

The LFE2-6E-5FN256C represents a successor technology node within the Lattice FPGA portfolio. Design migration requires evaluation of three capacity reductions: 100 logic elements (1.6%), 37888 RAM bits (40.2%), and 5 I/O pins (2.6%). These reductions must be assessed against specific application requirements. If the design utilizes more than 6000 logic elements, exceeds 56320 RAM bits, or requires all 195 I/O pins, alternative solutions within the ECP2 series with higher capacity may be necessary.

Both parts maintain identical compliance certifications (REACH Unaffected, EAR99 export classification) and handling requirements, ensuring regulatory and supply chain continuity.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256C be used as a direct drop-in replacement for the LFECP6E-3FN256C?

A: Physical and electrical compatibility is confirmed for package, voltage, temperature, and MSL specifications. However, the LFE2-6E-5FN256C has reduced logic element capacity (6000 vs. 6100), RAM capacity (56320 vs. 94208 bits), and I/O count (190 vs. 195 pins). Direct substitution is possible only if the design does not exceed these reduced specifications.

Q: What is the significance of the 40.2% reduction in RAM bits?

A: The LFE2-6E-5FN256C provides 56320 RAM bits compared to 94208 bits in the LFECP6E-3FN256C. Designs utilizing embedded RAM for buffering, caching, or data storage must verify that required memory capacity does not exceed 56320 bits. If higher RAM capacity is required, alternative ECP2 series devices with greater capacity should be evaluated.

Q: Are there differences in I/O pin assignment between these parts?

A: Both devices use the 256-FPBGA (17x17) package with identical footprint geometry. The LFE2-6E-5FN256C provides 190 I/O pins versus 195 in the LFECP6E-3FN256C. Pin assignment compatibility must be verified against the specific design schematic to confirm that all required signals can be routed using the available I/O pins.

Q: What is the product status difference, and why does it matter?

A: The LFECP6E-3FN256C is classified as obsolete, indicating discontinued manufacturing and limited long-term availability. The LFE2-6E-5FN256C is an active product with ongoing manufacturing support, ensuring availability for current and future production requirements.

Q: Are there any compliance or regulatory differences between these parts?

A: Both parts maintain identical REACH status (REACH Unaffected), ECCN classification (EAR99), and MSL rating (3, 168 Hours). No compliance or regulatory differences exist between the two devices.

Q: What should be done if the design requires more than 6000 logic elements or 56320 RAM bits?

A: If design requirements exceed the capacity of the LFE2-6E-5FN256C, higher-capacity devices within the ECP2 series should be evaluated. Lattice Semiconductor provides multiple ECP2 variants with increased logic element and RAM capacity to accommodate larger designs.