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LFECP33E-5FN672C Equivalent & Substitute Parts
Part Overview
The LFECP33E-5FN672C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 496 I/O pins, 32,800 logic elements, and 434,176 total RAM bits in a 672-BBGA package. This device is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The ECP series has been superseded by the ECP2 generation, which offers improved performance and active product status while maintaining compatible electrical and mechanical specifications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LFECP33E-5FN672C |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | ECP |
| Product Status | Obsolete |
| Number of Logic Elements/Cells | 32,800 |
| Total RAM Bits | 434,176 |
| Number of I/O | 496 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Package / Case | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Substitute Part Grouping Explanation
Substitution of the LFECP33E-5FN672C is determined by the following critical parameters:
Electrical Compatibility: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) must match or exceed the original specification.
Mechanical Compatibility: Package type (672-BBGA) and physical dimensions (27x27 mm) must be identical to ensure PCB footprint compatibility and assembly process alignment.
Functional Capacity: Logic element count, RAM capacity, and I/O pin count must be sufficient to support the original design requirements. The substitute may exceed these specifications without causing functional issues.
Regulatory Compliance: REACH status and ECCN classification must remain consistent for supply chain and export compliance.
The LFE2-35E-5FN672C qualifies as a direct substitute based on these criteria: identical supply voltage, matching package specifications, compatible operating temperature range, and equivalent regulatory status. The ECP2 series represents the manufacturer's recommended successor to the obsolete ECP series.
Parameter Comparison
| Parameter | LFECP33E-5FN672C (Main Part) | LFE2-35E-5FN672C (Substitute) |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | ECP | ECP2 |
| Product Status | Obsolete | Active |
| Number of Logic Elements/Cells | 32,800 | 32,000 |
| Total RAM Bits | 434,176 | 339,968 |
| Number of I/O | 496 | 450 |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Package / Case | 672-BBGA | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) | 672-FPBGA (27x27) |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | 3A991D | 3A991D |
| HTSUS | 8542.39.0001 | 8542.39.0001 |
Engineering Selection Recommendations
The LFE2-35E-5FN672C is the manufacturer-recommended substitute for the obsolete LFECP33E-5FN672C. Selection of this substitute is supported by:
Product Status: The substitute maintains active product status, ensuring long-term availability and supply chain stability compared to the obsolete main part.
Regulatory Compliance: Both parts share identical REACH status (REACH Unaffected) and ECCN classification (3A991D), maintaining compliance with export and supply chain regulations.
Electrical & Mechanical Specifications: Matching supply voltage range, operating temperature range, package type, and physical dimensions ensure direct compatibility with existing PCB designs and assembly processes.
Functional Considerations: The substitute provides 32,000 logic elements (compared to 32,800 in the main part) and 339,968 RAM bits (compared to 434,176). The I/O count is 450 pins (compared to 496). These differences require design verification to confirm the substitute meets application requirements.
Frequently Asked Questions (FAQ)
Q: Can the LFE2-35E-5FN672C be used as a direct drop-in replacement for the LFECP33E-5FN672C?
A: The LFE2-35E-5FN672C shares identical package specifications (672-BBGA, 27x27 mm), supply voltage (1.14V ~ 1.26V), and operating temperature range (0°C ~ 85°C). PCB footprint and assembly compatibility are maintained. However, the substitute has fewer logic elements (32,000 vs. 32,800), less RAM (339,968 vs. 434,176 bits), and fewer I/O pins (450 vs. 496). Design verification is required to confirm functional compatibility.
Q: What are the key differences between the ECP and ECP2 series?
A: The ECP2 series represents the successor generation to the ECP series. Both series maintain compatible electrical specifications (supply voltage and operating temperature) and package options. The ECP2 series offers active product status and improved manufacturing availability compared to the obsolete ECP series.
Q: Are there any compliance or regulatory differences between these parts?
A: Both parts share identical REACH status (REACH Unaffected), ECCN classification (3A991D), and HTSUS code (8542.39.0001). Moisture sensitivity level is identical at MSL 3 (168 Hours). No compliance differences exist between the main part and substitute.
Q: What should be verified before implementing the LFE2-35E-5FN672C in a design?
A: Verify that the design requirements do not exceed the substitute's specifications: 32,000 logic elements, 339,968 RAM bits, and 450 I/O pins. Confirm that the reduced I/O count (450 vs. 496) does not conflict with board-level signal routing and connector assignments. Functional testing of the design implementation is necessary to ensure performance meets application requirements.
Q: Is the LFE2-35E-5FN672C available in the same packaging options?
A: Yes. Both parts use the 672-BBGA package with identical physical dimensions (27x27 mm). The substitute is available in Tray packaging, ensuring compatibility with standard assembly and handling processes.
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