LFECP33E-3FN484C Equivalent & Substitute Parts

Part Overview

The LFECP33E-3FN484C is an ECP Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 360 I/O pins, 32,800 logic elements, and 434,176 total RAM bits in a 484-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations where legacy functionality must be maintained or upgraded.

Substiute Parts

LFECP33E-3FN484C
Lattice Semiconductor CorporationIn Stock: 2863LFECP33E-3FN484C Datasheet
LFECP33E-3FN484C
Current Part
LFE2-35E-5FN484C
Lattice Semiconductor CorporationIn Stock: 9325LFE2-35E-5FN484C Datasheet
LFE2-35E-5FN484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFECP33E-3FN484C
Manufacturer Lattice Semiconductor Corporation
Series ECP
Product Status Obsolete
Number of Logic Elements/Cells 32,800
Total RAM Bits 434,176
Number of I/O 360
Voltage - Supply 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FPBGA (23x23)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991D
HTSUS 8542.39.0001

Substitute Part Grouping Explanation

Substitution of the LFECP33E-3FN484C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 484-BBGA package with 484-FPBGA (23x23) supplier device package to ensure mechanical and electrical compatibility with existing PCB layouts and sockets.

Electrical Specifications: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C TJ) must be maintained to ensure functional equivalence in the target application.

I/O Pin Count: The number of I/O pins determines circuit connectivity. Substitute parts must provide sufficient I/O capacity to support the original design requirements.

Logic Resources: Logic element count and RAM bit capacity define the functional capacity of the FPGA. Substitute parts must meet or exceed the original specifications to ensure design portability.

Regulatory Compliance: REACH status and ECCN classification must align to maintain compliance with applicable regulations and export controls.

The LFE2-35E-5FN484C qualifies as a substitute based on matching package specifications, electrical parameters, operating temperature range, and regulatory compliance status.

Parameter Comparison

Parameter LFECP33E-3FN484C (Main Part) LFE2-35E-5FN484C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series ECP ECP2
Product Status Obsolete Active
Number of Logic Elements/Cells 32,800 32,000
Total RAM Bits 434,176 339,968
Number of I/O 360 331
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 484-BBGA 484-BBGA
Supplier Device Package 484-FPBGA (23x23) 484-FPBGA (23x23)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2-35E-5FN484C is an active product substitute for the obsolete LFECP33E-3FN484C. Both devices share identical package specifications (484-BBGA), electrical operating parameters (1.14V ~ 1.26V supply, 0°C ~ 85°C operating temperature), and regulatory compliance status (REACH Unaffected, ECCN 3A991D).

The substitute part operates within the same ECP family architecture (ECP2 series) and maintains compatibility with the 484-FPBGA (23x23) footprint. Supply voltage and operating temperature ranges are identical, ensuring thermal and electrical equivalence in system integration.

The LFE2-35E-5FN484C provides 32,000 logic elements and 339,968 RAM bits compared to the original 32,800 logic elements and 434,176 RAM bits. The I/O count is 331 pins versus 360 pins on the original part. These resource differences must be evaluated against specific application requirements to determine functional compatibility.

RoHS3 compliance certification is provided for the substitute part, supporting environmental and regulatory requirements for new designs.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-35E-5FN484C be used as a direct replacement for the LFECP33E-3FN484C?

A: Both parts use the 484-BBGA package with identical 484-FPBGA (23x23) footprints, enabling mechanical compatibility. Electrical parameters (supply voltage and operating temperature) are identical. However, the substitute part provides 29 fewer I/O pins (331 vs. 360) and reduced RAM capacity (339,968 vs. 434,176 bits). Design compatibility depends on whether the application can function with these reduced resources.

Q: What are the key differences between these two parts?

A: The LFECP33E-3FN484C is an obsolete ECP series device, while the LFE2-35E-5FN484C is an active ECP2 series device. The substitute offers lower logic element count (32,000 vs. 32,800), reduced RAM (339,968 vs. 434,176 bits), and fewer I/O pins (331 vs. 360). Both maintain identical supply voltage ranges, operating temperatures, and package specifications.

Q: Are the supply voltage and operating temperature ranges compatible?

A: Yes. Both parts operate at 1.14V ~ 1.26V supply voltage and 0°C ~ 85°C junction temperature, ensuring thermal and electrical equivalence in system design.

Q: What is the significance of the package designation 484-FPBGA (23x23)?

A: This designation specifies a 484-pin Fine-Pitch Ball Grid Array package with 23mm × 23mm dimensions. Both the main part and substitute use this identical package, ensuring PCB footprint and assembly process compatibility.

Q: Does the substitute part meet regulatory requirements?

A: Yes. The LFE2-35E-5FN484C maintains REACH Unaffected status and ECCN 3A991D classification, matching the regulatory profile of the original part. The substitute additionally provides RoHS3 compliance certification.

Q: What is the Moisture Sensitivity Level (MSL) for both parts?

A: Both parts are rated MSL 3 (168 Hours), indicating identical moisture handling and storage requirements during manufacturing and assembly processes.

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