LFECP20E-5FN672C Equivalent & Substitute Parts

Part Overview

The LFECP20E-5FN672C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 400 I/O pins, 19,700 logic elements, and 434,176 total RAM bits in a 672-BBGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations. The ECP series has been succeeded by the ECP2 generation, which maintains electrical and mechanical compatibility while offering enhanced performance characteristics.

Substiute Parts

LFECP20E-5FN672C

Lattice Semiconductor CorporationIn Stock: 881LFECP20E-5FN672C Datasheet

Current PartRFQ

LFE2-20E-5FN672C

Lattice Semiconductor CorporationIn Stock: 1224LFE2-20E-5FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP20E-5FN672C is determined by the following critical parameters:

Electrical Compatibility: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) must be maintained.

Mechanical Compatibility: Package type (672-BBGA) and physical footprint (27x27) must remain identical to ensure PCB-level compatibility without redesign.

Functional Capacity: The substitute part must provide equal or greater I/O count, logic element capacity, and RAM bit allocation to support the original design requirements.

Manufacturer Continuity: Parts must originate from Lattice Semiconductor Corporation to ensure design tool compatibility, firmware support, and supply chain consistency.

The LFE2-20E-5FN672C qualifies as a direct substitute based on these criteria. It maintains identical electrical specifications, package geometry, and mounting characteristics while providing enhanced logic resources (21,000 logic elements vs. 19,700) and I/O capacity (402 I/O vs. 400 I/O).

Parameter Comparison

Engineering Selection Recommendations

The LFE2-20E-5FN672C is the designated substitute for the obsolete LFECP20E-5FN672C. Selection is justified on the following grounds:

Product Status: The main part is classified as obsolete, while the substitute maintains active product status, ensuring long-term availability and supply chain stability.

Regulatory Compliance: Both parts maintain identical REACH and ECCN classifications, confirming equivalent regulatory standing for export and environmental compliance purposes.

Certification Alignment: Both devices share identical Moisture Sensitivity Level (MSL 3) and thermal specifications, eliminating the need for revised handling, storage, or assembly procedures.

Electrical and Mechanical Equivalence: Identical supply voltage range, operating temperature range, package type, and physical footprint ensure direct substitution without circuit redesign or PCB modification.

Enhanced Capability: The substitute provides additional logic elements and I/O capacity, supporting design scalability without introducing compatibility constraints.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN672C be used as a direct replacement for the LFECP20E-5FN672C without PCB modification?

A: Yes. Both devices use the 672-BBGA package with identical 27x27 footprint dimensions, electrical specifications, and mounting requirements. No PCB redesign is necessary.

Q: Are there differences in supply voltage or operating temperature requirements?

A: No. Both parts operate within the identical voltage range (1.14V ~ 1.26V) and temperature range (0°C ~ 85°C TJ), requiring no changes to power delivery or thermal management systems.

Q: What is the significance of the increased logic element count in the substitute part?

A: The LFE2-20E-5FN672C provides 21,000 logic elements compared to 19,700 in the main part. This additional capacity supports more complex designs without introducing compatibility issues for existing implementations.

Q: Does the substitute part require different handling or storage procedures?

A: No. Both parts maintain identical Moisture Sensitivity Level (MSL 3, 168 Hours), requiring the same handling, storage, and assembly protocols.

Q: Are design tool and firmware support considerations relevant to this substitution?

A: Both parts are Lattice Semiconductor FPGA devices within the ECP product family. Design tool compatibility and firmware support are maintained through Lattice's development environment and documentation.

Q: What is the impact of the RAM bit difference between the two parts?

A: The main part provides 434,176 RAM bits while the substitute provides 282,624 RAM bits. Design implementations must account for this reduction in embedded memory capacity.