LFECP20E-5FN484C Equivalent & Substitute Parts

Part Overview

The LFECP20E-5FN484C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 360 I/O pins, 19700 logic elements, and 434176 total RAM bits in a 484-BBGA package. This device is classified as obsolete, making identification of compatible alternatives essential for ongoing system support and new design implementations.

Substiute Parts

LFECP20E-5FN484C

Lattice Semiconductor CorporationIn Stock: 1243LFECP20E-5FN484C Datasheet

Current PartRFQ

LFE2-20E-5FN484C

Lattice Semiconductor CorporationIn Stock: 1531LFE2-20E-5FN484C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFECP20E-5FN484C is determined by the following critical parameters:

• Package Compatibility: Both devices must use the 484-BBGA package format with identical 23x23mm physical dimensions to ensure PCB footprint compatibility
• Voltage Supply Range: Substitute parts must operate within the 1.14V ~ 1.26V supply voltage specification
• Operating Temperature Range: Substitute parts must support the 0°C ~ 85°C (TJ) operating temperature range
• Mounting Type: Surface mount technology must be maintained
• Moisture Sensitivity Level: MSL 3 (168 Hours) classification must be preserved for assembly process compatibility

The LFE2-20E-5FN484C meets all critical substitution criteria, representing the manufacturer-recommended upgrade path from the obsolete ECP series to the active ECP2 series.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-20E-5FN484C is the designated substitute for the obsolete LFECP20E-5FN484C. Selection of this substitute is supported by:

• Active Product Status: The LFE2-20E-5FN484C maintains active production status, ensuring long-term availability and supply chain stability
• Identical Electrical Specifications: Both devices share identical voltage supply range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C TJ)
• Package Compatibility: Identical 484-BBGA package format and 23x23mm physical dimensions ensure direct PCB footprint compatibility without layout modifications
• Regulatory Compliance: Both devices maintain REACH Unaffected status and identical ECCN/HTSUS classifications
• Moisture Sensitivity Alignment: Identical MSL 3 (168 Hours) classification ensures compatibility with standard assembly processes

The LFE2-20E-5FN484C provides increased logic capacity (21000 elements versus 19700) while maintaining backward compatibility with the electrical and mechanical interface requirements of the original design.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN484C be used as a direct replacement for the LFECP20E-5FN484C?

A: Yes. Both devices use the identical 484-BBGA package format with 23x23mm dimensions, identical voltage supply range (1.14V ~ 1.26V), and identical operating temperature range (0°C ~ 85°C TJ). No PCB modifications are required for package compatibility.

Q: What are the differences in I/O count between these devices?

A: The LFECP20E-5FN484C provides 360 I/O pins, while the LFE2-20E-5FN484C provides 331 I/O pins. Design implementations must account for this 29-pin reduction in available I/O resources.

Q: Are there differences in RAM capacity?

A: Yes. The LFECP20E-5FN484C contains 434176 total RAM bits, while the LFE2-20E-5FN484C contains 282624 total RAM bits. Designs requiring maximum RAM capacity must evaluate this reduction.

Q: Do both devices support the same supply voltage?

A: Yes. Both devices operate within the 1.14V ~ 1.26V supply voltage range and support identical operating temperature specifications (0°C ~ 85°C TJ).

Q: What is the significance of the product status difference?

A: The LFECP20E-5FN484C is classified as obsolete, indicating discontinued production and limited future availability. The LFE2-20E-5FN484C maintains active production status, ensuring ongoing supply chain support and long-term component availability.

Q: Are assembly process requirements identical for both devices?

A: Yes. Both devices share identical Moisture Sensitivity Level (MSL 3, 168 Hours) classification, ensuring compatibility with standard surface mount assembly processes without process modifications.