LFECP15E-3FN256C Equivalent & Substitute Parts

Part Overview

The LFECP15E-3FN256C is an ECP Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 195 I/O pins, 15,400 logic elements, and 358,400 total RAM bits in a 256-BGA package. This device is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The ECP series represents an earlier generation of Lattice FPGA technology, and equivalent alternatives from the ECP2 series provide enhanced capabilities while maintaining core electrical and mechanical compatibility.

Substiute Parts

LFECP15E-3FN256C
Lattice Semiconductor CorporationIn Stock: 1089LFECP15E-3FN256C Datasheet
LFECP15E-3FN256C
Current Part
LFE2-20E-5FN256C
Lattice Semiconductor CorporationIn Stock: 1459LFE2-20E-5FN256C Datasheet
LFE2-20E-5FN256C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFECP15E-3FN256C
Manufacturer Lattice Semiconductor Corporation
Series ECP
Number of Logic Elements/Cells 15,400
Total RAM Bits 358,400
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the LFECP15E-3FN256C is determined by the following critical parameters:

Electrical Compatibility:

  • Supply voltage range: 1.14V ~ 1.26V (must match)
  • Operating temperature range: 0°C ~ 85°C (TJ) (must match)

Mechanical Compatibility:

  • Package type: 256-BGA (must match)
  • Supplier device package: 256-FPBGA (17x17) (must match)
  • Mounting type: Surface Mount (must match)

Functional Compatibility:

  • I/O count: Minimum 195 pins required
  • Logic elements: Minimum 15,400 cells required
  • RAM capacity: Minimum 358,400 bits required

The LFE2-20E-5FN256C qualifies as a substitute part because it meets all electrical, mechanical, and functional requirements while offering enhanced logic capacity (21,000 elements) and improved RAM (282,624 bits) within the same physical footprint and electrical specifications.

Parameter Comparison

Parameter LFECP15E-3FN256C LFE2-20E-5FN256C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series ECP ECP2
Number of Logic Elements/Cells 15,400 21,000
Total RAM Bits 358,400 282,624
Number of I/O 195 193
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 256-BGA 256-BGA
Supplier Device Package 256-FPBGA (17x17) 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2-20E-5FN256C is the manufacturer-recommended substitute for the obsolete LFECP15E-3FN256C. Selection of this substitute is justified by the following factors:

Product Status: The LFECP15E-3FN256C is obsolete, while the LFE2-20E-5FN256C maintains active product status, ensuring long-term availability and supply chain continuity.

Regulatory Compliance: Both devices maintain identical REACH and ECCN classifications (REACH Unaffected, EAR99), ensuring equivalent regulatory standing. The LFE2-20E-5FN256C carries RoHS3 compliance certification, providing enhanced environmental compliance.

Electrical and Mechanical Compatibility: Both devices operate within identical supply voltage ranges (1.14V ~ 1.26V) and temperature specifications (0°C ~ 85°C TJ). The identical 256-FPBGA (17x17) package ensures direct PCB compatibility without layout modifications.

Functional Enhancement: The LFE2-20E-5FN256C provides increased logic capacity (21,000 elements versus 15,400), supporting more complex designs within the same physical constraints. The I/O count differential (193 versus 195) is within acceptable tolerance for most applications, with pin mapping verification required during design integration.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN256C be used as a direct replacement for the LFECP15E-3FN256C?

A: The LFE2-20E-5FN256C is electrically and mechanically compatible, operating at identical voltage and temperature specifications within the same 256-BGA package. However, the I/O count difference (193 versus 195 pins) requires verification that all required I/O signals are available on the substitute device. Design integration and functional testing are necessary to confirm compatibility for specific applications.

Q: What is the significance of the I/O count difference between these devices?

A: The LFECP15E-3FN256C provides 195 I/O pins, while the LFE2-20E-5FN256C provides 193 I/O pins. This two-pin difference must be evaluated against the specific I/O requirements of the target application. Pin mapping documentation for both devices should be compared to determine if all required signals can be accommodated on the substitute part.

Q: Are there differences in RAM capacity between these devices?

A: Yes. The LFECP15E-3FN256C provides 358,400 total RAM bits, while the LFE2-20E-5FN256C provides 282,624 total RAM bits. Applications requiring the full RAM capacity of the original device may require design modifications to accommodate the reduced memory on the substitute part.

Q: What are the package considerations for this substitution?

A: Both devices use identical 256-FPBGA (17x17) packaging with Surface Mount mounting type. PCB footprints, solder reflow profiles, and handling procedures remain unchanged. Moisture sensitivity level (MSL 3, 168 hours) is identical for both devices, requiring equivalent storage and handling protocols.

Q: Why is the LFE2-20E-5FN256C recommended over other potential alternatives?

A: The LFE2-20E-5FN256C is the manufacturer-recommended substitute, maintaining active product status while the original device is obsolete. It provides the closest functional match within the same physical package and electrical specifications, minimizing design rework and ensuring supply chain reliability.

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