LFEC6E-4FN256C Equivalent & Substitute Parts

Part Overview

The LFEC6E-4FN256C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 195 I/O pins, 6100 logic elements, and 94208 total RAM bits in a 256-BGA package. The part is classified as obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations.

Substiute Parts

LFEC6E-4FN256C
Lattice Semiconductor CorporationIn Stock: 1227LFEC6E-4FN256C Datasheet
LFEC6E-4FN256C
Current Part
LFE2-6E-5FN256C
Lattice Semiconductor CorporationIn Stock: 3379LFE2-6E-5FN256C Datasheet
LFE2-6E-5FN256C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFEC6E-4FN256C
Manufacturer Lattice Semiconductor Corporation
Series EC
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

The LFE2-6E-5FN256C is identified as a manufacturer-recommended substitute for the LFEC6E-4FN256C. Substitution eligibility is determined by the following critical parameters:

Matching Parameters:

  • Package / Case: 256-BGA (identical physical footprint)
  • Supplier Device Package: 256-FPBGA (17x17) (identical pin configuration)
  • Voltage - Supply: 1.14V ~ 1.26V (identical supply voltage range)
  • Mounting Type: Surface Mount (identical mounting method)
  • Operating Temperature: 0°C ~ 85°C (TJ) (identical thermal operating range)
  • Moisture Sensitivity Level (MSL): 3 (168 Hours) (identical moisture handling requirements)

Functional Differences: The LFE2-6E-5FN256C belongs to the ECP2 series and provides comparable but not identical logic capacity. The substitute contains 6000 logic elements (versus 6100 in the original) and 56320 RAM bits (versus 94208 in the original). The I/O count is 190 pins (versus 195 in the original). These differences require design verification to confirm functional compatibility within specific applications.

Parameter Comparison

Parameter LFEC6E-4FN256C LFE2-6E-5FN256C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Number of Logic Elements/Cells 6100 6000
Total RAM Bits 94208 56320
Number of I/O 195 190
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 256-BGA 256-BGA
Supplier Device Package 256-FPBGA (17x17) 256-FPBGA (17x17)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFEC6E-4FN256C is obsolete, necessitating component replacement for new procurements and long-term system support. The LFE2-6E-5FN256C is the manufacturer-recommended substitute and is currently in active production status, ensuring availability and supply chain continuity.

Physical compatibility is confirmed: both devices share identical 256-BGA packaging, 17x17 footprint dimensions, surface mount mounting type, and identical supply voltage and operating temperature ranges. Moisture sensitivity levels are equivalent.

The LFE2-6E-5FN256C carries ROHS3 compliance certification, meeting current environmental and regulatory requirements. Both devices share identical REACH status (REACH Unaffected) and ECCN classification (EAR99).

Functional capacity differences exist: the substitute provides 100 fewer logic elements, 37888 fewer RAM bits, and 5 fewer I/O pins. Design validation is required to confirm that these reductions do not impact application performance or functionality.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256C directly replace the LFEC6E-4FN256C in existing designs?

A: Physical and electrical compatibility is confirmed through matching package specifications, supply voltage ranges, and operating temperature ranges. However, functional compatibility depends on design-specific requirements. The substitute contains reduced logic element count, RAM capacity, and I/O pin count. Design review is necessary to confirm these reductions do not exceed application margins.

Q: Are the 256-BGA packages identical between these two parts?

A: Yes. Both devices use 256-FPBGA (17x17) packaging with identical physical footprints and pin configurations, enabling direct PCB-level compatibility without layout modifications.

Q: What is the significance of the product status difference?

A: The LFEC6E-4FN256C is obsolete and no longer manufactured. The LFE2-6E-5FN256C is in active production, ensuring long-term availability, supply chain stability, and manufacturer support for new designs and system maintenance.

Q: Are there compliance or certification differences?

A: The LFE2-6E-5FN256C carries ROHS3 compliance certification. Both devices share identical REACH status and ECCN classification. Compliance requirements for specific applications should be verified against design specifications.

Q: What are the key functional differences?

A: The LFE2-6E-5FN256C provides 6000 logic elements (100 fewer than the original 6100), 56320 RAM bits (37888 fewer than the original 94208), and 190 I/O pins (5 fewer than the original 195). These differences require design validation to confirm suitability for specific applications.

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