LFEC6E-3FN256C Equivalent & Substitute Parts

Part Overview

The LFEC6E-3FN256C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 195 I/O pins, 6100 logic elements, and 94208 total RAM bits in a 256-BGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

LFEC6E-3FN256C
Lattice Semiconductor CorporationIn Stock: 3668LFEC6E-3FN256C Datasheet
LFEC6E-3FN256C
Current Part
LFE2-6E-5FN256C
Lattice Semiconductor CorporationIn Stock: 3379LFE2-6E-5FN256C Datasheet
LFE2-6E-5FN256C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFEC6E-3FN256C
Manufacturer Lattice Semiconductor Corporation
Series EC
Number of Logic Elements/Cells 6100
Total RAM Bits 94208
Number of I/O 195
Voltage - Supply 1.14V ~ 1.26V
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the LFEC6E-3FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA package format with identical 17x17 footprint dimensions to ensure PCB-level compatibility without redesign.

Electrical Specifications: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) must be maintained or exceeded to ensure functional equivalence in the target application.

I/O Pin Count: The substitute part must provide sufficient I/O pins to accommodate the design requirements. The main part provides 195 I/O pins; substitutes with equal or greater I/O capability are acceptable.

Logic Resources: Logic element count and RAM bit capacity should be comparable to support equivalent design complexity and functionality.

Manufacturer Compliance: Both parts are manufactured by Lattice Semiconductor Corporation, ensuring consistent design support and documentation standards.

The LFE2-6E-5FN256C meets these substitution criteria through identical package specifications, matching voltage and temperature ranges, and comparable logic resources within the same manufacturer ecosystem.

Parameter Comparison

Parameter LFEC6E-3FN256C (Main Part) LFE2-6E-5FN256C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Number of Logic Elements/Cells 6100 6000
Total RAM Bits 94208 56320
Number of I/O 195 190
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 256-BGA 256-BGA
Supplier Device Package 256-FPBGA (17x17) 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2-6E-5FN256C is the manufacturer-recommended substitute for the obsolete LFEC6E-3FN256C. Selection of this substitute is supported by the following factors:

Product Status: The LFE2-6E-5FN256C maintains active product status with current manufacturing and supply chain availability, addressing the obsolescence of the original EC series part.

Regulatory Compliance: Both parts share identical REACH status (REACH Unaffected), ECCN classification (EAR99), and HTSUS codes (8542.39.0001), ensuring consistent regulatory treatment across procurement and export documentation.

Package and Electrical Equivalence: Identical 256-BGA package specifications, matching supply voltage ranges, and equivalent operating temperature ranges enable direct substitution at the PCB assembly level without design modifications.

Resource Availability: The substitute part is currently in stock (3286 Pcs New Original), providing immediate procurement capability compared to the obsolete main part.

Design Considerations: The LFE2-6E-5FN256C provides 6000 logic elements and 190 I/O pins, representing a minor reduction from the main part's 6100 logic elements and 195 I/O pins. Design validation is required to confirm that these resource reductions do not impact the target application's functional requirements.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256C be used as a direct replacement without PCB redesign?

A: Yes. Both parts use the identical 256-BGA package format with 17x17 footprint dimensions, enabling direct substitution at the PCB assembly level without layout modifications.

Q: Are there differences in logic resources between the main part and substitute?

A: The LFE2-6E-5FN256C provides 6000 logic elements compared to the main part's 6100 logic elements, and 56320 RAM bits compared to 94208 RAM bits. Design validation is required to confirm these resource levels are sufficient for the target application.

Q: What is the difference in I/O pin count?

A: The main part provides 195 I/O pins, while the substitute provides 190 I/O pins. Applications requiring all 195 pins must be evaluated to determine if the 5-pin reduction impacts functionality.

Q: Are the electrical specifications identical?

A: Yes. Both parts operate at 1.14V ~ 1.26V supply voltage and 0°C ~ 85°C operating temperature range, ensuring electrical equivalence in the target system.

Q: What is the moisture sensitivity level for both parts?

A: Both parts are classified as MSL 3 (168 Hours), requiring identical handling and storage protocols during manufacturing and assembly.

Q: Are there compliance or regulatory differences?

A: No. Both parts share identical REACH status, ECCN classification, and HTSUS codes, ensuring consistent regulatory treatment.

Q: Why is the main part obsolete?

A: The LFEC6E-3FN256C is an older EC series device. Lattice Semiconductor has transitioned to the ECP2 series, represented by the LFE2-6E-5FN256C, which provides improved performance and continued manufacturing support.

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