LFEC3E-4FN256I Equivalent & Substitute Parts

Part Overview

The LFEC3E-4FN256I is a Lattice Semiconductor EC series Field Programmable Gate Array (FPGA) with 160 I/O pins, 3100 logic elements, and 56320 total RAM bits in a 256-BGA package. This device operates at 1.14V to 1.26V supply voltage across an industrial temperature range of -40°C to 100°C. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement continuity.

Substiute Parts

LFEC3E-4FN256I

Lattice Semiconductor CorporationIn Stock: 1057LFEC3E-4FN256I Datasheet

Current PartRFQ

LFE2-6E-5FN256I

Lattice Semiconductor CorporationIn Stock: 1640LFE2-6E-5FN256I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the obsolete LFEC3E-4FN256I is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA package format (256-FPBGA 17x17) to ensure mechanical fit and PCB layout compatibility.

Electrical Compatibility: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (-40°C ~ 100°C) must be maintained or exceeded to ensure functional operation in the same application environment.

Logic Resource Sufficiency: The substitute part must provide equal or greater logic element capacity, RAM bits, and I/O count to accommodate the original design requirements.

Regulatory Compliance: REACH status and ECCN classification must align with the original part to maintain compliance in target markets.

The LFE2-6E-5FN256I meets these substitution criteria through identical package geometry, matching electrical specifications, and superior logic resources (6000 logic elements vs. 3100, 190 I/O vs. 160, and equivalent 56320 RAM bits).

Parameter Comparison

Engineering Selection Recommendations

The LFE2-6E-5FN256I is the qualified substitute for the obsolete LFEC3E-4FN256I based on the following factors:

Product Status: The substitute is in active production status, ensuring long-term availability and supply chain stability compared to the obsolete main part.

Regulatory Compliance: Both parts maintain identical REACH and ECCN classifications (REACH Unaffected, EAR99), ensuring no change to export control or environmental compliance requirements.

Electrical Specifications: Identical supply voltage range and operating temperature specifications guarantee direct functional compatibility in existing applications without power supply or thermal management modifications.

Package Geometry: Both parts use the 256-FPBGA (17x17) package, enabling direct PCB layout reuse without redesign.

Enhanced Capabilities: The substitute provides increased logic element capacity (6000 vs. 3100) and additional I/O pins (190 vs. 160), offering design headroom for future enhancements while maintaining backward compatibility with the original design footprint.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256I be used as a direct replacement for the LFEC3E-4FN256I?

A: Yes. Both parts share identical package geometry (256-FPBGA 17x17), supply voltage range (1.14V ~ 1.26V), and operating temperature range (-40°C ~ 100°C). The substitute provides equal or greater logic resources, making it functionally compatible for direct substitution.

Q: Are there any differences in pin assignments between these parts?

A: Pin assignment compatibility is determined by the identical 256-BGA package format. However, the substitute provides 190 I/O pins versus 160 on the main part. Unused I/O pins on the substitute can be left unconnected without affecting operation.

Q: What is the impact of the increased logic element count on power consumption?

A: Power consumption depends on design utilization. The substitute's additional logic elements (6000 vs. 3100) do not increase power consumption if the design utilizes only the equivalent 3100 elements. Actual power draw is determined by active logic utilization and switching frequency, not total available resources.

Q: Does the substitute require different firmware or design files?

A: Design files and firmware developed for the LFEC3E-4FN256I may require recompilation for the LFE2-6E-5FN256I due to architectural differences between the EC and ECP2 series. Consult Lattice Semiconductor design tools and documentation for migration guidance.

Q: Are moisture sensitivity and handling requirements identical?

A: Yes. Both parts have MSL rating 3 (168 Hours), requiring identical moisture control and storage procedures during manufacturing and assembly.

Q: What is the availability status of the substitute part?

A: The LFE2-6E-5FN256I is in active production status with current inventory of 1540 pieces, ensuring reliable long-term availability compared to the obsolete main part.