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LFEC3E-3FN256I Equivalent & Substitute Parts
Part Overview
The LFEC3E-3FN256I is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 160 I/O pins, 3100 logic elements, and 56320 total RAM bits in a 256-BGA package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support, design updates, and procurement planning.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LFEC3E-3FN256I |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | EC |
| Number of Logic Elements/Cells | 3100 |
| Total RAM Bits | 56320 |
| Number of I/O | 160 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Product Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the LFEC3E-3FN256I is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use the 256-BGA package in 256-FPBGA (17x17) form factor to ensure mechanical and electrical compatibility with existing PCB layouts.
Supply Voltage: The substitute must operate within the 1.14V ~ 1.26V supply voltage range to maintain compatibility with existing power delivery systems.
I/O Pin Count: The substitute must provide equal or greater I/O capability (minimum 160 I/O pins) to support all signal connections in the original design.
Logic Resources: The substitute must provide equal or greater logic element capacity (minimum 3100 logic elements) and RAM capacity (minimum 56320 RAM bits) to accommodate the original design's functional requirements.
Mounting Type: Surface mount technology must be maintained for PCB assembly compatibility.
Operating Temperature Range: The substitute must support the -40°C ~ 100°C operating range to function in the same thermal environment.
The LFE2-6E-5FN256I meets all substitution criteria with enhanced specifications across logic elements, I/O count, and active product status.
Parameter Comparison
| Parameter | LFEC3E-3FN256I (Main Part) | LFE2-6E-5FN256I (Substitute) |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | EC | ECP2 |
| Number of Logic Elements/Cells | 3100 | 6000 |
| Total RAM Bits | 56320 | 56320 |
| Number of I/O | 160 | 190 |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Package / Case | 256-BGA | 256-BGA |
| Supplier Device Package | 256-FPBGA (17x17) | 256-FPBGA (17x17) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
| Product Status | Obsolete | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The LFE2-6E-5FN256I is the qualified substitute for the LFEC3E-3FN256I based on the following engineering criteria:
Package and Pinout Compatibility: Both devices use identical 256-FPBGA (17x17) packaging, ensuring direct PCB compatibility without layout modifications.
Electrical Specifications: Matching supply voltage range (1.14V ~ 1.26V) and operating temperature range (-40°C ~ 100°C) ensure functional equivalence in the target application environment.
Resource Sufficiency: The substitute provides 6000 logic elements and 190 I/O pins, exceeding the original part's 3100 logic elements and 160 I/O pins. This enhanced capacity accommodates the original design with additional headroom for future enhancements.
Product Status and Compliance: The LFE2-6E-5FN256I is an active product with ROHS3 compliance, providing long-term availability and regulatory alignment compared to the obsolete LFEC3E-3FN256I.
Regulatory Alignment: Both parts share identical REACH status (REACH Unaffected), ECCN (EAR99), and HTSUS classification (8542.39.0001), maintaining compliance requirements.
Frequently Asked Questions (FAQ)
Q: Can the LFE2-6E-5FN256I directly replace the LFEC3E-3FN256I without PCB modifications?
A: Yes. Both devices use the 256-FPBGA (17x17) package with identical physical dimensions and pinout compatibility. No PCB layout changes are required.
Q: Are the supply voltage requirements identical?
A: Yes. Both parts operate within the 1.14V ~ 1.26V supply voltage range, allowing use of existing power delivery infrastructure without modification.
Q: Does the substitute provide sufficient logic resources for the original design?
A: Yes. The LFE2-6E-5FN256I provides 6000 logic elements and 56320 RAM bits, exceeding the original part's 3100 logic elements and 56320 RAM bits. The design will function with additional resource capacity.
Q: What is the difference in I/O pin count?
A: The substitute provides 190 I/O pins compared to the original part's 160 I/O pins. The additional 30 I/O pins are available for design expansion but do not affect compatibility with existing signal connections.
Q: Is the operating temperature range the same?
A: Yes. Both parts operate across -40°C ~ 100°C (TJ), maintaining thermal compatibility with the original application environment.
Q: What is the product status difference?
A: The LFEC3E-3FN256I is obsolete, while the LFE2-6E-5FN256I is an active product. This ensures long-term availability and ongoing manufacturer support for the substitute.
Q: Are there any compliance or regulatory differences?
A: Both parts share identical REACH status, ECCN classification, and HTSUS codes. The substitute adds ROHS3 compliance, providing enhanced regulatory alignment for new designs and procurement.
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