LFEC3E-3FN256I Equivalent & Substitute Parts

Part Overview

The LFEC3E-3FN256I is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 160 I/O pins, 3100 logic elements, and 56320 total RAM bits in a 256-BGA package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

LFEC3E-3FN256I
Lattice Semiconductor CorporationIn Stock: 776LFEC3E-3FN256I Datasheet
LFEC3E-3FN256I
Current Part
LFE2-6E-5FN256I
Lattice Semiconductor CorporationIn Stock: 1640LFE2-6E-5FN256I Datasheet
LFE2-6E-5FN256I
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFEC3E-3FN256I
Manufacturer Lattice Semiconductor Corporation
Series EC
Number of Logic Elements/Cells 3100
Total RAM Bits 56320
Number of I/O 160
Voltage - Supply 1.14V ~ 1.26V
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the LFEC3E-3FN256I is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA package in 256-FPBGA (17x17) form factor to ensure mechanical and electrical compatibility with existing PCB layouts.

Supply Voltage: The substitute must operate within the 1.14V ~ 1.26V supply voltage range to maintain compatibility with existing power delivery systems.

I/O Pin Count: The substitute must provide equal or greater I/O capability (minimum 160 I/O pins) to support all signal connections in the original design.

Logic Resources: The substitute must provide equal or greater logic element capacity (minimum 3100 logic elements) and RAM capacity (minimum 56320 RAM bits) to accommodate the original design's functional requirements.

Mounting Type: Surface mount technology must be maintained for PCB assembly compatibility.

Operating Temperature Range: The substitute must support the -40°C ~ 100°C operating range to function in the same thermal environment.

The LFE2-6E-5FN256I meets all substitution criteria with enhanced specifications across logic elements, I/O count, and active product status.

Parameter Comparison

Parameter LFEC3E-3FN256I (Main Part) LFE2-6E-5FN256I (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Number of Logic Elements/Cells 3100 6000
Total RAM Bits 56320 56320
Number of I/O 160 190
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 256-BGA 256-BGA
Supplier Device Package 256-FPBGA (17x17) 256-FPBGA (17x17)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Product Status Obsolete Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFE2-6E-5FN256I is the qualified substitute for the LFEC3E-3FN256I based on the following engineering criteria:

Package and Pinout Compatibility: Both devices use identical 256-FPBGA (17x17) packaging, ensuring direct PCB compatibility without layout modifications.

Electrical Specifications: Matching supply voltage range (1.14V ~ 1.26V) and operating temperature range (-40°C ~ 100°C) ensure functional equivalence in the target application environment.

Resource Sufficiency: The substitute provides 6000 logic elements and 190 I/O pins, exceeding the original part's 3100 logic elements and 160 I/O pins. This enhanced capacity accommodates the original design with additional headroom for future enhancements.

Product Status and Compliance: The LFE2-6E-5FN256I is an active product with ROHS3 compliance, providing long-term availability and regulatory alignment compared to the obsolete LFEC3E-3FN256I.

Regulatory Alignment: Both parts share identical REACH status (REACH Unaffected), ECCN (EAR99), and HTSUS classification (8542.39.0001), maintaining compliance requirements.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256I directly replace the LFEC3E-3FN256I without PCB modifications?

A: Yes. Both devices use the 256-FPBGA (17x17) package with identical physical dimensions and pinout compatibility. No PCB layout changes are required.

Q: Are the supply voltage requirements identical?

A: Yes. Both parts operate within the 1.14V ~ 1.26V supply voltage range, allowing use of existing power delivery infrastructure without modification.

Q: Does the substitute provide sufficient logic resources for the original design?

A: Yes. The LFE2-6E-5FN256I provides 6000 logic elements and 56320 RAM bits, exceeding the original part's 3100 logic elements and 56320 RAM bits. The design will function with additional resource capacity.

Q: What is the difference in I/O pin count?

A: The substitute provides 190 I/O pins compared to the original part's 160 I/O pins. The additional 30 I/O pins are available for design expansion but do not affect compatibility with existing signal connections.

Q: Is the operating temperature range the same?

A: Yes. Both parts operate across -40°C ~ 100°C (TJ), maintaining thermal compatibility with the original application environment.

Q: What is the product status difference?

A: The LFEC3E-3FN256I is obsolete, while the LFE2-6E-5FN256I is an active product. This ensures long-term availability and ongoing manufacturer support for the substitute.

Q: Are there any compliance or regulatory differences?

A: Both parts share identical REACH status, ECCN classification, and HTSUS codes. The substitute adds ROHS3 compliance, providing enhanced regulatory alignment for new designs and procurement.

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