LFEC3E-3FN256C Equivalent & Substitute Parts

Part Overview

The LFEC3E-3FN256C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 160 I/O pins, 3100 logic elements, and 56320 total RAM bits in a 256-BGA package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

LFEC3E-3FN256C

Lattice Semiconductor CorporationIn Stock: 2121LFEC3E-3FN256C Datasheet

Current PartRFQ

LFE2-6E-5FN256C

Lattice Semiconductor CorporationIn Stock: 3379LFE2-6E-5FN256C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the LFEC3E-3FN256C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-BGA package in 256-FPBGA (17x17) form factor to ensure mechanical and electrical compatibility with existing PCB layouts.

Voltage Supply Range: The substitute must operate within the 1.14V ~ 1.26V supply voltage range to maintain compatibility with existing power delivery systems.

Operating Temperature Range: The substitute must support the 0°C ~ 85°C (TJ) operating temperature specification.

Mounting Type: Surface mount technology must be maintained for assembly process compatibility.

Moisture Sensitivity Level: MSL 3 (168 Hours) specification must be met or exceeded.

The LFE2-6E-5FN256C meets all these critical parameters while offering enhanced logic capacity and I/O count, making it a valid substitute for the obsolete LFEC3E-3FN256C.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-6E-5FN256C is a direct substitute for the LFEC3E-3FN256C based on matching critical electrical and mechanical parameters. The substitute part offers the following advantages:

Product Status: The LFE2-6E-5FN256C is active and currently in production, ensuring long-term availability and supply chain stability compared to the obsolete LFEC3E-3FN256C.

Compliance: The LFE2-6E-5FN256C is ROHS3 compliant, meeting current environmental and regulatory requirements.

Enhanced Capacity: The substitute provides increased logic elements (6000 vs. 3100) and additional I/O pins (190 vs. 160), offering design headroom without requiring PCB redesign due to identical package specifications.

Electrical Compatibility: Identical supply voltage range and operating temperature specifications ensure direct compatibility with existing power and thermal management systems.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-6E-5FN256C be used as a direct replacement for the LFEC3E-3FN256C without PCB modifications?

A: Yes. Both parts use the identical 256-FPBGA (17x17) package, identical supply voltage range (1.14V ~ 1.26V), and identical operating temperature range (0°C ~ 85°C). No PCB layout changes are required.

Q: What are the key differences between these two parts?

A: The LFE2-6E-5FN256C belongs to the ECP2 series and provides double the logic elements (6000 vs. 3100) and 30 additional I/O pins (190 vs. 160). Both parts maintain identical RAM capacity (56320 bits) and package form factor.

Q: Is the LFE2-6E-5FN256C available for procurement?

A: Yes. The LFE2-6E-5FN256C is an active product with current inventory availability, unlike the obsolete LFEC3E-3FN256C.

Q: Are there any compliance or certification differences?

A: The LFE2-6E-5FN256C is ROHS3 compliant. Both parts share identical MSL 3 (168 Hours) moisture sensitivity specifications and REACH unaffected status.

Q: Will firmware or design changes be required when switching to the LFE2-6E-5FN256C?

A: Design migration depends on application-specific requirements. The substitute part's increased logic capacity and I/O count provide additional resources but do not mandate design changes if the original design fits within the substitute's specifications.