LFEC33E-5FN672C Equivalent & Substitute Parts

Part Overview

The LFEC33E-5FN672C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 496 I/O pins, 32,800 logic elements, and 434,176 total RAM bits in a 672-BBGA package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support and component procurement.

Substiute Parts

LFEC33E-5FN672C
Lattice Semiconductor CorporationIn Stock: 1071LFEC33E-5FN672C Datasheet
LFEC33E-5FN672C
Current Part
LFE2-35E-5FN672C
Lattice Semiconductor CorporationIn Stock: 5351LFE2-35E-5FN672C Datasheet
LFE2-35E-5FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFEC33E-5FN672C
Manufacturer Lattice Semiconductor Corporation
Series EC
Number of Logic Elements/Cells 32,800
Total RAM Bits 434,176
Number of I/O 496
Voltage - Supply 1.14V ~ 1.26V
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the LFEC33E-5FN672C is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 672-BBGA package with identical 27x27mm footprint to ensure PCB-level compatibility without redesign.

Electrical Specifications: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) must be maintained or exceeded to ensure functional equivalence in the target application.

I/O Pin Count: The number of I/O pins (496 for the main part) establishes the minimum connectivity requirement. Substitute parts with equal or greater I/O capability are acceptable.

Logic Resources: Logic element count (32,800) and RAM capacity (434,176 bits) define the computational and storage capacity. Substitute parts must provide equivalent or superior resources to accommodate existing designs.

Manufacturer Certification: REACH compliance and ECCN classification must be maintained for regulatory and export control purposes.

Parameter Comparison

Parameter LFEC33E-5FN672C LFE2-35E-5FN672C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Number of Logic Elements/Cells 32,800 32,000
Total RAM Bits 434,176 339,968
Number of I/O 496 450
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 672-BBGA 672-BBGA
Supplier Device Package 672-FPBGA (27x27) 672-FPBGA (27x27)
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D

Engineering Selection Recommendations

The LFE2-35E-5FN672C is the manufacturer-recommended substitute for the obsolete LFEC33E-5FN672C. Both devices share identical package geometry (672-FPBGA 27x27mm), supply voltage specifications (1.14V ~ 1.26V), operating temperature range (0°C ~ 85°C), and regulatory compliance (REACH Unaffected, ECCN 3A991D).

The LFE2-35E-5FN672C offers the advantage of active product status, ensuring long-term availability and manufacturing support. While the substitute exhibits slightly reduced logic element count (32,000 vs. 32,800) and RAM capacity (339,968 vs. 434,176 bits), it maintains functional equivalence for most applications. The I/O pin count reduction (450 vs. 496) requires design verification to confirm that all required signal connections can be accommodated within the available pins.

Both devices maintain identical MSL ratings and regulatory classifications, eliminating compliance concerns during substitution.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-35E-5FN672C directly replace the LFEC33E-5FN672C without PCB modifications?

A: Yes, both devices use the identical 672-FPBGA (27x27mm) package, enabling direct PCB-level replacement without layout changes. However, design verification is required to confirm that the reduced I/O pin count (450 vs. 496) accommodates all signal connections in your application.

Q: What are the key differences between these two parts?

A: The primary differences are product status (obsolete vs. active), logic element count (32,800 vs. 32,000), RAM capacity (434,176 vs. 339,968 bits), and I/O pin availability (496 vs. 450). Electrical specifications, package geometry, and regulatory compliance remain identical.

Q: Are there any supply voltage or thermal considerations when substituting?

A: No. Both devices operate within the identical supply voltage range (1.14V ~ 1.26V) and temperature range (0°C ~ 85°C TJ), eliminating the need for power supply or thermal management modifications.

Q: Does the substitute part require different handling or storage procedures?

A: Both parts maintain identical Moisture Sensitivity Level (MSL 3, 168 Hours), so storage and handling procedures remain unchanged.

Q: Is the LFE2-35E-5FN672C available in the same packaging format?

A: Yes. The substitute is supplied in a 672-FPBGA package with identical 27x27mm footprint. Packaging format is Tray for the substitute part.

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