LFEC20E-4FN672C Equivalent & Substitute Parts

Part Overview

The LFEC20E-4FN672C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 400 I/O pins and 19,700 logic elements in a 672-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations. The ECP2 series successor provides enhanced logic capacity and active product status while maintaining electrical and mechanical compatibility.

Substiute Parts

LFEC20E-4FN672C
Lattice Semiconductor CorporationIn Stock: 714LFEC20E-4FN672C Datasheet
LFEC20E-4FN672C
Current Part
LFE2-20E-5FN672C
Lattice Semiconductor CorporationIn Stock: 1224LFE2-20E-5FN672C Datasheet
LFE2-20E-5FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Lattice Semiconductor Corporation
Series EC
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Number of I/O 400
Number of Logic Elements/Cells 19,700
Total RAM Bits 434,176
Voltage - Supply 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution of the LFEC20E-4FN672C is determined by the following critical parameters:

  • Package Compatibility: Both main and substitute parts use the 672-BBGA package with identical 27x27mm footprint, ensuring PCB-level compatibility without layout modifications.
  • Electrical Specifications: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) are identical, confirming power delivery and thermal management compatibility.
  • I/O Pin Count: The substitute part provides 402 I/O pins, exceeding the original 400 I/O requirement, maintaining full signal routing capability.
  • Mounting and Handling: Both devices are surface mount with identical MSL rating (3, 168 Hours), requiring equivalent storage and assembly procedures.
  • Manufacturer Continuity: Both parts are manufactured by Lattice Semiconductor Corporation, ensuring design tool compatibility and technical support consistency.

The LFE2-20E-5FN672C represents the direct successor within Lattice's FPGA portfolio, offering increased logic capacity (21,000 elements vs. 19,700) and enhanced RAM (282,624 bits vs. 434,176 bits) while maintaining full electrical and mechanical compatibility.

Parameter Comparison

Parameter LFEC20E-4FN672C (Main) LFE2-20E-5FN672C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Package / Case 672-BBGA 672-BBGA
Supplier Device Package 672-FPBGA (27x27) 672-FPBGA (27x27)
Number of I/O 400 402
Number of Logic Elements/Cells 19,700 21,000
Total RAM Bits 434,176 282,624
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
RoHS Status Not specified ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2-20E-5FN672C is the qualified substitute for the obsolete LFEC20E-4FN672C based on the following engineering criteria:

  • Product Status Transition: The main part is obsolete; the substitute is active, ensuring long-term availability and manufacturing support.
  • Regulatory Compliance: The substitute achieves ROHS3 compliance, meeting current environmental and hazardous substance restrictions. Both parts maintain REACH Unaffected status and identical ECCN/HTSUS classifications.
  • Electrical Compatibility: Identical supply voltage and operating temperature ranges eliminate power delivery and thermal management redesign requirements.
  • Physical Compatibility: Identical package footprint (672-FPBGA, 27x27mm) and MSL rating permit direct PCB substitution without layout or assembly procedure modifications.
  • Functional Enhancement: Increased logic element count (21,000 vs. 19,700) and additional I/O pins (402 vs. 400) provide design margin without introducing compatibility constraints.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN672C be used as a direct replacement on existing PCBs designed for the LFEC20E-4FN672C?

A: Yes. Both devices use the 672-BBGA package with identical 27x27mm footprint and pin assignments for the 400 common I/O pins. The substitute provides 2 additional I/O pins, which do not affect existing signal routing. No PCB layout modifications are required.

Q: Are the power supply requirements identical between the two parts?

A: Yes. Both the LFEC20E-4FN672C and LFE2-20E-5FN672C operate within the same supply voltage range of 1.14V ~ 1.26V and the same operating temperature range of 0°C ~ 85°C (TJ). Existing power delivery networks require no adjustment.

Q: What is the difference in logic capacity between these two parts?

A: The LFEC20E-4FN672C contains 19,700 logic elements, while the LFE2-20E-5FN672C contains 21,000 logic elements. This represents a 6.6% increase in available logic resources. The substitute also provides 282,624 RAM bits compared to 434,176 RAM bits in the main part.

Q: Does the substitute part require different handling or storage procedures?

A: No. Both parts have identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours), requiring the same storage conditions, handling procedures, and assembly processes.

Q: Are there any regulatory or compliance differences between the two parts?

A: The LFE2-20E-5FN672C is ROHS3 compliant, while the main part does not specify RoHS status. Both parts are REACH Unaffected and share identical ECCN (3A991D) and HTSUS (8542.39.0001) classifications, ensuring equivalent export and import compliance.

Q: Why is the LFEC20E-4FN672C classified as obsolete?

A: The EC series has been superseded by the ECP2 series within Lattice Semiconductor's FPGA portfolio. The LFE2-20E-5FN672C represents the current-generation equivalent, offering enhanced performance and active manufacturing support.

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