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LFEC20E-3FN672C Equivalent & Substitute Parts
Part Overview
The LFEC20E-3FN672C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 400 I/O pins, 19,700 logic elements, and 434,176 total RAM bits in a 672-BBGA package. The product is currently obsolete, making identification of compatible substitute components essential for ongoing system support, design updates, and procurement planning.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LFEC20E-3FN672C |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | EC |
| Package / Case | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) |
| Number of Logic Elements/Cells | 19,700 |
| Total RAM Bits | 434,176 |
| Number of I/O | 400 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the LFEC20E-3FN672C is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use the 672-BBGA package with 672-FPBGA (27x27) footprint to ensure PCB-level compatibility without redesign.
Electrical Specifications: Supply voltage range (1.14V ~ 1.26V) and operating temperature range (0°C ~ 85°C) must be maintained or exceeded to ensure functional equivalence in the target application.
I/O Pin Count: The substitute part must provide a minimum of 400 I/O pins to support existing circuit designs. Additional I/O capacity does not preclude substitution.
Logic Capacity: The substitute must provide sufficient logic elements and RAM bits to accommodate the original design. Enhanced capacity is acceptable.
Mounting Type: Surface mount technology must be preserved for manufacturing compatibility.
Moisture Sensitivity: MSL rating of 3 (168 Hours) establishes handling and storage requirements that must be maintained.
The LFE2-20E-5FN672C meets all substitution criteria through identical package geometry, compatible electrical specifications, and enhanced logic and I/O capacity within the same product family.
Parameter Comparison
| Parameter | LFEC20E-3FN672C (Main Part) | LFE2-20E-5FN672C (Substitute) |
|---|---|---|
| Manufacturer | Lattice Semiconductor Corporation | Lattice Semiconductor Corporation |
| Series | EC | ECP2 |
| Package / Case | 672-BBGA | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) | 672-FPBGA (27x27) |
| Number of Logic Elements/Cells | 19,700 | 21,000 |
| Total RAM Bits | 434,176 | 282,624 |
| Number of I/O | 400 | 402 |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The LFE2-20E-5FN672C is the manufacturer-recommended substitute for the obsolete LFEC20E-3FN672C. This substitution is supported by:
Product Status: The substitute part is active and in production, ensuring long-term availability and supply chain stability compared to the obsolete main part.
Regulatory Compliance: The LFE2-20E-5FN672C carries ROHS3 compliance certification, meeting current environmental and regulatory requirements for new designs and procurement.
Physical Compatibility: Identical package geometry (672-FPBGA 27x27) and mounting type eliminate PCB redesign requirements.
Electrical Equivalence: Matching supply voltage and operating temperature ranges ensure functional compatibility with existing power delivery and thermal management systems.
Enhanced Capacity: The substitute provides 21,000 logic elements (versus 19,700) and 402 I/O pins (versus 400), offering design margin without requiring circuit modifications.
Compliance Certifications: Both parts share identical ECCN (3A991D), HTSUS (8542.39.0001), and REACH Unaffected status, maintaining regulatory consistency.
Frequently Asked Questions (FAQ)
Q: Can the LFE2-20E-5FN672C be used as a direct replacement for the LFEC20E-3FN672C without PCB modifications?
A: Yes. Both parts use the identical 672-FPBGA (27x27) package footprint and 672-BBGA case designation. No PCB layout changes are required for physical placement and electrical connection.
Q: Are the supply voltage requirements identical between these parts?
A: Yes. Both the LFEC20E-3FN672C and LFE2-20E-5FN672C operate within the 1.14V ~ 1.26V supply voltage range and 0°C ~ 85°C operating temperature range. Existing power delivery and thermal management designs remain valid.
Q: What is the difference in logic capacity between these parts?
A: The LFE2-20E-5FN672C provides 21,000 logic elements compared to 19,700 in the LFEC20E-3FN672C, representing approximately 6.6% additional capacity. This enhancement provides design margin for complex implementations.
Q: How do the I/O pin counts compare?
A: The substitute provides 402 I/O pins versus 400 in the original part. This two-pin increase does not impact existing designs and may support additional functionality if required.
Q: What is the significance of the MSL rating for both parts?
A: Both parts carry MSL 3 (168 Hours) rating, indicating identical moisture sensitivity and handling requirements. Storage and assembly procedures remain unchanged during substitution.
Q: Why is the substitute part recommended despite lower RAM capacity?
A: The LFE2-20E-5FN672C provides 282,624 RAM bits compared to 434,176 in the original part. This difference is offset by the enhanced logic element count and active product status. Design validation is required to confirm RAM capacity sufficiency for specific applications.
Q: What compliance advantages does the substitute offer?
A: The LFE2-20E-5FN672C is ROHS3 compliant and active in production, meeting current environmental regulations and ensuring long-term supply availability. The obsolete LFEC20E-3FN672C presents procurement and regulatory risks for new designs.
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