LFEC15E-5FN484C Equivalent & Substitute Parts

Part Overview

The LFEC15E-5FN484C is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 352 I/O pins and 15,400 logic elements in a 484-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production requirements. The ECP2 series provides a direct functional alternative with enhanced logic capacity and active product status.

Substiute Parts

LFEC15E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1174LFEC15E-5FN484C Datasheet
LFEC15E-5FN484C
Current Part
LFE2-20E-5FN484C
Lattice Semiconductor CorporationIn Stock: 1531LFE2-20E-5FN484C Datasheet
LFE2-20E-5FN484C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Lattice Semiconductor Corporation
Series EC
Package Type 484-BBGA (23x23)
Number of I/O 352
Logic Elements 15,400
Total RAM Bits 358,400
Supply Voltage 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the LFEC15E-5FN484C is determined by the following critical parameters:

  • Package Compatibility: Both main and substitute parts use the 484-BBGA (23x23) package, ensuring mechanical and electrical pin compatibility
  • Supply Voltage Range: Identical voltage specification (1.14V ~ 1.26V) allows direct power supply integration
  • Operating Temperature Range: Matching thermal specification (0°C ~ 85°C) ensures equivalent thermal performance
  • Mounting Type: Both devices are surface mount, maintaining assembly process compatibility
  • I/O Pin Count: The substitute part provides 331 I/O pins versus 352 on the main part, representing a reduction in available I/O resources
  • Logic Capacity: The substitute part offers 21,000 logic elements versus 15,400, providing increased computational capacity
  • RAM Capacity: The substitute part provides 282,624 RAM bits versus 358,400, representing a reduction in embedded memory

The LFE2-20E-5FN484C qualifies as a substitute based on matching package, voltage, temperature, and mounting specifications, while offering enhanced logic resources and active product status.

Parameter Comparison

Parameter LFEC15E-5FN484C LFE2-20E-5FN484C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series EC ECP2
Package Type 484-BBGA (23x23) 484-BBGA (23x23)
Number of I/O 352 331
Logic Elements 15,400 21,000
Total RAM Bits 358,400 282,624
Supply Voltage 1.14V ~ 1.26V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
ECCN 3A991D 3A991D
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2-20E-5FN484C is the qualified substitute for the obsolete LFEC15E-5FN484C based on the following engineering criteria:

  • Product Status: The substitute part maintains active product status, ensuring long-term availability and manufacturing support
  • Regulatory Compliance: Both parts share identical ECCN (3A991D) and HTSUS (8542.39.0001) classifications, maintaining export and tariff compliance
  • Package Equivalence: Identical 484-BBGA package specifications ensure direct PCB layout compatibility without redesign
  • Electrical Specifications: Matching supply voltage and operating temperature ranges eliminate power supply and thermal management modifications
  • Moisture Sensitivity: Identical MSL rating (3, 168 Hours) maintains handling and storage requirements

Selection of the LFE2-20E-5FN484C requires verification that the reduced I/O count (331 versus 352) and reduced RAM capacity (282,624 versus 358,400 bits) are compatible with the target application design.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN484C be used as a direct replacement for the LFEC15E-5FN484C?

A: The LFE2-20E-5FN484C is mechanically and electrically compatible due to identical package type, supply voltage, and operating temperature specifications. However, the reduced I/O pin count (331 versus 352) and reduced RAM capacity (282,624 versus 358,400 bits) require design verification to confirm functional compatibility.

Q: What are the key differences between these two parts?

A: The primary differences are: (1) Series designation (EC versus ECP2), (2) I/O pin availability (352 versus 331), (3) Logic element capacity (15,400 versus 21,000), (4) RAM capacity (358,400 versus 282,624 bits), and (5) Product status (Obsolete versus Active).

Q: Are the package dimensions identical?

A: Yes. Both parts use the 484-BBGA (23x23) package, ensuring identical footprint, pin pitch, and PCB layout compatibility.

Q: Do these parts require different power supply specifications?

A: No. Both parts operate on identical supply voltage (1.14V ~ 1.26V) and share the same operating temperature range (0°C ~ 85°C), eliminating power supply modifications.

Q: What is the impact of reduced I/O pins on system design?

A: The substitute part provides 21 fewer I/O pins (331 versus 352). Design verification is required to confirm that all required signal connections can be accommodated within the available I/O resources.

Q: What is the impact of reduced RAM capacity?

A: The substitute part provides 75,776 fewer RAM bits (282,624 versus 358,400). Applications requiring maximum embedded memory capacity require verification that the reduced RAM allocation is sufficient for the target design.

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