LFEC15E-4FN484I Equivalent & Substitute Parts

Part Overview

The LFEC15E-4FN484I is an EC series Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation, featuring 352 I/O pins and 15,400 logic elements in a 484-BBGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations where legacy compatibility is required.

Substiute Parts

LFEC15E-4FN484I

Lattice Semiconductor CorporationIn Stock: 783LFEC15E-4FN484I Datasheet

Current PartRFQ

LFE2-20E-5FN484I

Lattice Semiconductor CorporationIn Stock: 770LFE2-20E-5FN484I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFE2-20E-5FN484I qualifies as a manufacturer-recommended substitute based on the following critical parameters:

Matching Parameters:

• Identical package format: 484-BBGA (23x23) surface mount configuration
• Identical supply voltage range: 1.14V ~ 1.26V
• Identical operating temperature range: -40°C ~ 100°C (TJ)
• Identical moisture sensitivity level: MSL 3 (168 Hours)
• Identical export compliance: ECCN 3A991D and HTSUS 8542.39.0001
• Same manufacturer: Lattice Semiconductor Corporation
• Identical mounting type: Surface Mount

Functional Enhancements:

• Increased logic elements: 21,000 (vs. 15,400 in main part)
• Increased RAM capacity: 282,624 bits (vs. 358,400 bits in main part)
• Increased I/O count: 331 pins (vs. 352 pins in main part)
• Active product status with RoHS3 compliance

Parameter Comparison

Engineering Selection Recommendations

The LFE2-20E-5FN484I is the manufacturer-recommended substitute for the obsolete LFEC15E-4FN484I. Selection of this substitute is supported by:

• Active product status ensuring long-term availability and supply chain continuity
• RoHS3 compliance meeting current environmental and regulatory requirements
• Identical electrical specifications (voltage, temperature, MSL) ensuring drop-in compatibility at the board level
• Identical package geometry and pinout compatibility within the 484-BBGA form factor
• Equivalent export classification maintaining compliance with trade regulations

The increase in logic elements (21,000 vs. 15,400) provides additional design capacity for new implementations. The reduction in I/O count (331 vs. 352) and RAM bits (282,624 vs. 358,400) must be evaluated against specific application requirements to confirm functional equivalence.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-20E-5FN484I be used as a direct replacement for the LFEC15E-4FN484I?

A: The LFE2-20E-5FN484I shares identical package geometry (484-BBGA), electrical specifications (voltage, temperature range, MSL), and mounting type. However, differences in I/O count (331 vs. 352), logic elements (21,000 vs. 15,400), and RAM capacity (282,624 vs. 358,400 bits) require design verification to confirm functional compatibility.

Q: What are the key parameters that determine substitution eligibility?

A: Substitution eligibility is determined by: package format (484-BBGA), supply voltage range (1.14V ~ 1.26V), operating temperature range (-40°C ~ 100°C), moisture sensitivity level (MSL 3), and export classification (ECCN 3A991D). All these parameters match between the main part and substitute.

Q: Why is the LFEC15E-4FN484I classified as obsolete?

A: The LFEC15E-4FN484I is an EC series device that has reached end-of-life status. The LFE2-20E-5FN484I from the newer ECP2 series is the active replacement offering improved specifications and ongoing manufacturer support.

Q: Are there any compliance differences between these parts?

A: The LFE2-20E-5FN484I carries RoHS3 compliance certification, while the LFEC15E-4FN484I compliance status is not specified. Both parts maintain identical REACH and export classification status.

Q: What should be considered when migrating from LFEC15E-4FN484I to LFE2-20E-5FN484I?

A: Design migration requires evaluation of: I/O pin utilization (331 available vs. 352 in original), logic element requirements (21,000 available vs. 15,400 in original), and RAM capacity needs (282,624 bits available vs. 358,400 in original). PCB layout compatibility is confirmed by identical package geometry and pinout within the 484-BBGA form factor.