LFE3-70E-6FN672C Equivalent & Substitute Parts

Part Overview

The LFE3-70E-6FN672C is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 380 I/O pins, 67,000 logic elements, and 4,526,080 total RAM bits in a 672-BBGA package. This device is currently classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.

Substiute Parts

LFE3-70E-6FN672C
Lattice Semiconductor CorporationIn Stock: 1686LFE3-70E-6FN672C Datasheet
LFE3-70E-6FN672C
Current Part
LFE3-70EA-6FN672C
Lattice Semiconductor CorporationIn Stock: 1445LFE3-70EA-6FN672C Datasheet
LFE3-70EA-6FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LFE3-70E-6FN672C
Manufacturer Lattice Semiconductor Corporation
Series ECP3
Number of Logic Elements/Cells 67,000
Number of I/O 380
Total RAM Bits 4,526,080
Voltage - Supply 1.14V ~ 1.26V
Package / Case 672-BBGA
Supplier Device Package 672-FPBGA (27x27)
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the LFE3-70E-6FN672C is determined by strict equivalence across the following critical parameters:

  • Series and Architecture: ECP3 FPGA family
  • Logic Capacity: 67,000 logic elements
  • I/O Count: 380 I/O pins
  • Memory Configuration: 4,526,080 total RAM bits
  • Package Type: 672-BBGA (27x27 footprint)
  • Voltage Supply Range: 1.14V ~ 1.26V
  • Operating Temperature Range: 0°C ~ 85°C (TJ)
  • Mounting Technology: Surface Mount

The LFE3-70EA-6FN672C meets all substitution criteria, maintaining identical electrical specifications, pin configuration, and package dimensions while offering improved product availability through active production status.

Parameter Comparison

Parameter LFE3-70E-6FN672C LFE3-70EA-6FN672C
Manufacturer Part Number LFE3-70E-6FN672C LFE3-70EA-6FN672C
Series ECP3 ECP3
Number of Logic Elements/Cells 67,000 67,000
Number of I/O 380 380
Total RAM Bits 4,526,080 4,526,080
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 672-BBGA 672-BBGA
Supplier Device Package 672-FPBGA (27x27) 672-FPBGA (27x27)
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LFE3-70EA-6FN672C is the direct substitute for the LFE3-70E-6FN672C. Both devices share identical electrical and mechanical specifications, including logic capacity, I/O configuration, memory architecture, voltage requirements, and package dimensions. The primary distinction is product lifecycle status: the original part is obsolete, while the substitute is in active production.

The substitute part offers ROHS3 compliance, providing enhanced environmental and regulatory alignment for new designs and production continuity. The identical parameter set ensures pin-for-pin and functional compatibility without design modification.

Frequently Asked Questions (FAQ)

Q: Are the LFE3-70E-6FN672C and LFE3-70EA-6FN672C pin-compatible?

A: Yes. Both devices use the 672-BBGA package with identical pin assignments, voltage levels, and I/O configuration. No PCB redesign is required for substitution.

Q: What is the difference between these two part numbers?

A: The primary difference is product status and compliance certification. The LFE3-70E-6FN672C is obsolete, while the LFE3-70EA-6FN672C is actively produced and ROHS3 compliant. All electrical and mechanical specifications are identical.

Q: Can I use the LFE3-70EA-6FN672C as a direct replacement in existing designs?

A: Yes. The substitute part maintains identical logic capacity (67,000 elements), I/O count (380 pins), memory configuration (4,526,080 bits), voltage supply range (1.14V ~ 1.26V), and operating temperature range (0°C ~ 85°C). No firmware or design changes are necessary.

Q: What is the package footprint for both parts?

A: Both parts use a 672-FPBGA package with 27x27mm dimensions. The 672-BBGA designation indicates the ball grid array configuration with 672 contact points.

Q: Are there any compliance differences between these parts?

A: The LFE3-70EA-6FN672C includes ROHS3 compliance certification, while the obsolete LFE3-70E-6FN672C does not specify this status. Both parts maintain REACH Unaffected status and identical ECCN and HTSUS classifications.

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