Request Quote
(Ships tomorrow)
LFE3-70E-6FN672C Equivalent & Substitute Parts
Part Overview
The LFE3-70E-6FN672C is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 380 I/O pins, 67,000 logic elements, and 4,526,080 total RAM bits in a 672-BBGA package. This device is currently classified as obsolete, making identification of suitable substitute components essential for ongoing design support, production continuity, and system maintenance.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | LFE3-70E-6FN672C |
| Manufacturer | Lattice Semiconductor Corporation |
| Series | ECP3 |
| Number of Logic Elements/Cells | 67,000 |
| Number of I/O | 380 |
| Total RAM Bits | 4,526,080 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Package / Case | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution eligibility for the LFE3-70E-6FN672C is determined by strict equivalence across the following critical parameters:
- Series and Architecture: ECP3 FPGA family
- Logic Capacity: 67,000 logic elements
- I/O Count: 380 I/O pins
- Memory Configuration: 4,526,080 total RAM bits
- Package Type: 672-BBGA (27x27 footprint)
- Voltage Supply Range: 1.14V ~ 1.26V
- Operating Temperature Range: 0°C ~ 85°C (TJ)
- Mounting Technology: Surface Mount
The LFE3-70EA-6FN672C meets all substitution criteria, maintaining identical electrical specifications, pin configuration, and package dimensions while offering improved product availability through active production status.
Parameter Comparison
| Parameter | LFE3-70E-6FN672C | LFE3-70EA-6FN672C |
|---|---|---|
| Manufacturer Part Number | LFE3-70E-6FN672C | LFE3-70EA-6FN672C |
| Series | ECP3 | ECP3 |
| Number of Logic Elements/Cells | 67,000 | 67,000 |
| Number of I/O | 380 | 380 |
| Total RAM Bits | 4,526,080 | 4,526,080 |
| Voltage - Supply | 1.14V ~ 1.26V | 1.14V ~ 1.26V |
| Package / Case | 672-BBGA | 672-BBGA |
| Supplier Device Package | 672-FPBGA (27x27) | 672-FPBGA (27x27) |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount | Surface Mount |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The LFE3-70EA-6FN672C is the direct substitute for the LFE3-70E-6FN672C. Both devices share identical electrical and mechanical specifications, including logic capacity, I/O configuration, memory architecture, voltage requirements, and package dimensions. The primary distinction is product lifecycle status: the original part is obsolete, while the substitute is in active production.
The substitute part offers ROHS3 compliance, providing enhanced environmental and regulatory alignment for new designs and production continuity. The identical parameter set ensures pin-for-pin and functional compatibility without design modification.
Frequently Asked Questions (FAQ)
Q: Are the LFE3-70E-6FN672C and LFE3-70EA-6FN672C pin-compatible?
A: Yes. Both devices use the 672-BBGA package with identical pin assignments, voltage levels, and I/O configuration. No PCB redesign is required for substitution.
Q: What is the difference between these two part numbers?
A: The primary difference is product status and compliance certification. The LFE3-70E-6FN672C is obsolete, while the LFE3-70EA-6FN672C is actively produced and ROHS3 compliant. All electrical and mechanical specifications are identical.
Q: Can I use the LFE3-70EA-6FN672C as a direct replacement in existing designs?
A: Yes. The substitute part maintains identical logic capacity (67,000 elements), I/O count (380 pins), memory configuration (4,526,080 bits), voltage supply range (1.14V ~ 1.26V), and operating temperature range (0°C ~ 85°C). No firmware or design changes are necessary.
Q: What is the package footprint for both parts?
A: Both parts use a 672-FPBGA package with 27x27mm dimensions. The 672-BBGA designation indicates the ball grid array configuration with 672 contact points.
Q: Are there any compliance differences between these parts?
A: The LFE3-70EA-6FN672C includes ROHS3 compliance certification, while the obsolete LFE3-70E-6FN672C does not specify this status. Both parts maintain REACH Unaffected status and identical ECCN and HTSUS classifications.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts
