LFE2M35SE-7F256C Equivalent & Substitute Parts

Part Overview

The LFE2M35SE-7F256C is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, featuring 140 I/O pins, 34,000 logic elements, and 2,151,424 total RAM bits in a 256-BGA package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing system support and procurement planning. The primary substitute maintains identical electrical and mechanical specifications while offering improved product status and compliance certifications.

Substiute Parts

LFE2M35SE-7F256C
Lattice Semiconductor CorporationIn Stock: 752LFE2M35SE-7F256C Datasheet
LFE2M35SE-7F256C
Current Part
LFE2M35SE-7FN256C
Lattice SemiconductorIn Stock: 816LFE2M35SE-7FN256C Datasheet
LFE2M35SE-7FN256C
Direct

Key Parameters

Parameter Value
Series ECP2M
Number of Logic Elements/Cells 34,000
Number of I/O 140
Total RAM Bits 2,151,424
Voltage - Supply 1.14V ~ 1.26V
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount

Substitute Part Grouping Explanation

The LFE2M35SE-7FN256C qualifies as a direct substitute based on matching core electrical and mechanical parameters. Substitution eligibility is determined by the following criteria:

  • Identical series designation (ECP2M)
  • Matching logic element count (34,000)
  • Identical I/O pin count (140)
  • Identical RAM capacity (2,151,424 bits)
  • Identical supply voltage range (1.14V ~ 1.26V)
  • Identical package type and pin configuration (256-FPBGA, 17x17)
  • Identical operating temperature range (0°C ~ 85°C)
  • Identical mounting technology (Surface Mount)

The substitute part differs only in packaging format (Tray vs. unspecified for main part) and product status/compliance certifications, with no impact on functional or electrical compatibility.

Parameter Comparison

Parameter LFE2M35SE-7F256C LFE2M35SE-7FN256C
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor
Series ECP2M ECP2M
Number of Logic Elements/Cells 34,000 34,000
Number of I/O 140 140
Total RAM Bits 2,151,424 2,151,424
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 256-BGA 256-BGA
Supplier Device Package 256-FPBGA (17x17) 256-FPBGA (17x17)
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

The LFE2M35SE-7FN256C is the appropriate selection for new designs and ongoing procurement due to its active product status and ROHS3 compliance certification. The main part (LFE2M35SE-7F256C) is classified as obsolete, creating supply chain risk and limiting long-term availability.

For existing systems currently using the LFE2M35SE-7F256C, the substitute part provides functional and electrical equivalence with no design modifications required. The identical electrical specifications, pin configuration, and operating parameters ensure drop-in compatibility at the component level.

The ROHS3 compliance of the substitute part aligns with current regulatory requirements for electronic components in most markets, whereas the non-compliant status of the main part may present procurement or certification challenges for new applications.

Frequently Asked Questions (FAQ)

Q: Can the LFE2M35SE-7FN256C replace the LFE2M35SE-7F256C in existing designs?

A: Yes. Both parts are ECP2M FPGAs with identical logic element counts (34,000), I/O pin counts (140), RAM capacity (2,151,424 bits), supply voltage (1.14V ~ 1.26V), and package configuration (256-FPBGA, 17x17). No design modifications are required.

Q: What is the difference between the two part numbers?

A: The primary differences are product status (obsolete vs. active) and RoHS compliance (non-compliant vs. ROHS3 compliant). Electrical and mechanical specifications are identical.

Q: Are the packages physically identical?

A: Yes. Both parts use the 256-FPBGA package in a 17x17 configuration. Pin assignments and mechanical dimensions are identical, enabling direct board-level substitution.

Q: Does the packaging format (Tray vs. unspecified) affect compatibility?

A: No. Packaging format refers to how components are supplied for handling and storage. It does not affect electrical performance or board-level compatibility.

Q: What is the Moisture Sensitivity Level (MSL) for both parts?

A: Both parts have MSL 3 with a 168-hour floor life. Identical handling and storage requirements apply to both components.

Q: Are there any supply voltage or operating temperature differences?

A: No. Both parts operate at 1.14V ~ 1.26V supply voltage and 0°C ~ 85°C junction temperature range. Electrical operating conditions are identical.

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