LFE2M35E-7FN256C Equivalent & Substitute Parts

Part Overview

The LFE2M35E-7FN256C is an ECP2M Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This embedded component features 140 I/O pins, 34,000 logic elements, and 2,151,424 total RAM bits in a 256-BGA package. The device is actively supported and ROHS3 compliant, making it suitable for applications requiring mid-range programmable logic density with surface mount integration.

Substitute parts are identified when design requirements permit relaxed operating temperature ranges or alternative packaging configurations while maintaining core functional specifications.

Substiute Parts

LFE2M35E-7FN256C

Lattice Semiconductor CorporationIn Stock: 32989LFE2M35E-7FN256C Datasheet

Current PartRFQ

LFE2M35E-6FN256I

Lattice Semiconductor CorporationIn Stock: 1000LFE2M35E-6FN256I Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The LFE2M35E-6FN256I qualifies as a direct substitute based on the following criteria:

Identical Core Specifications:

• Same base product number (LFE2M35)
• Identical logic element count (34,000)
• Identical RAM capacity (2,151,424 bits)
• Identical I/O count (140 pins)
• Identical package configuration (256-BGA, 17x17)
• Identical supply voltage range (1.14V ~ 1.26V)
• Identical mounting type (Surface Mount)
• Identical RoHS and REACH compliance status

Allowable Variation:

• Operating temperature range: LFE2M35E-6FN256I supports -40°C ~ 100°C versus the main part's 0°C ~ 85°C, providing extended low-temperature and high-temperature capability
• Packaging format: Tray packaging versus standard packaging

These variations do not affect functional compatibility when the extended temperature range is acceptable for the application.

Parameter Comparison

Engineering Selection Recommendations

Primary Part Selection (LFE2M35E-7FN256C): Select this part when operating temperature requirements are limited to 0°C ~ 85°C and standard packaging is preferred. Both parts maintain identical ROHS3 compliance and active product status.

Substitute Selection (LFE2M35E-6FN256I): Select this part when extended operating temperature range (-40°C ~ 100°C) is required for the application. This variant provides identical functional specifications and maintains all compliance certifications. Tray packaging is suitable for high-volume production environments.

Both parts are actively supported by Lattice Semiconductor Corporation and carry equivalent compliance credentials (ROHS3, REACH Unaffected, EAR99 classification).

Frequently Asked Questions (FAQ)

Q: Can LFE2M35E-6FN256I be used as a direct replacement for LFE2M35E-7FN256C?

A: Yes, when the extended operating temperature range (-40°C ~ 100°C) is acceptable for your application. All functional parameters, I/O configuration, logic density, and memory capacity are identical. Both devices use the same 256-BGA package footprint.

Q: What is the primary difference between these two parts?

A: The operating temperature range differs. LFE2M35E-6FN256I supports -40°C ~ 100°C, while LFE2M35E-7FN256C is rated for 0°C ~ 85°C. Packaging format also differs (Tray versus standard).

Q: Are there any pin compatibility concerns?

A: No. Both parts use identical 256-BGA (17x17) package configuration with 140 I/O pins. PCB footprints and pinouts are identical.

Q: Do both parts meet the same compliance standards?

A: Yes. Both LFE2M35E-7FN256C and LFE2M35E-6FN256I are ROHS3 compliant, REACH unaffected, and classified as EAR99 for export purposes.

Q: Which part should I select for industrial temperature applications?

A: LFE2M35E-6FN256I is suitable for applications requiring operation below 0°C or above 85°C, as it supports -40°C ~ 100°C operating range.

Q: Is the logic capacity identical between both parts?

A: Yes. Both parts contain 34,000 logic elements and 2,151,424 RAM bits. Design files and configurations are compatible.