LFE2M20E-6F484C Equivalent & Substitute Parts

Part Overview

The LFE2M20E-6F484C is an ECP2M Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. This device features 304 I/O pins, 19,000 logic elements, and 1,246,208 bits of embedded RAM in a 484-BBGA package. The main part is currently obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new designs requiring this architecture.

Substiute Parts

LFE2M20E-6F484C
Lattice Semiconductor CorporationIn Stock: 863LFE2M20E-6F484C Datasheet
LFE2M20E-6F484C
Current Part
LFE2M20E-6FN484C
Lattice Semiconductor CorporationIn Stock: 2829LFE2M20E-6FN484C Datasheet
LFE2M20E-6FN484C
Direct

Key Parameters

Parameter Value
Manufacturer Lattice Semiconductor Corporation
Series ECP2M
Logic Elements/Cells 19,000
Number of I/O 304
Total RAM Bits 1,246,208
Supply Voltage 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ)
Package Type 484-BBGA (23x23)
Mounting Type Surface Mount
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the LFE2M20E-6F484C is determined by the following critical parameters:

  • Series and Architecture: Must be ECP2M series to ensure functional compatibility with existing designs
  • Logic Element Count: Must match 19,000 logic elements
  • I/O Pin Count: Must provide 304 I/O pins
  • Embedded RAM: Must include 1,246,208 bits of total RAM
  • Package Configuration: Must use 484-BBGA (23x23) form factor for PCB compatibility
  • Electrical Specifications: Supply voltage range 1.14V ~ 1.26V and operating temperature 0°C ~ 85°C must be maintained
  • Moisture Sensitivity: MSL 3 rating must be preserved

The substitute part LFE2M20E-6FN484C meets all these criteria and is therefore a direct functional equivalent.

Parameter Comparison

Parameter LFE2M20E-6F484C (Main) LFE2M20E-6FN484C (Substitute)
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Series ECP2M ECP2M
Logic Elements 19,000 19,000
Number of I/O 304 304
Total RAM Bits 1,246,208 1,246,208
Supply Voltage 1.14V ~ 1.26V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package Type 484-BBGA (23x23) 484-BBGA (23x23)
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The LFE2M20E-6FN484C is the direct substitute for the obsolete LFE2M20E-6F484C. Both parts are functionally identical across all electrical and mechanical parameters. The substitute part offers the advantage of active product status, ensuring continued availability and supply chain reliability. Additionally, the LFE2M20E-6FN484C meets ROHS3 compliance requirements, whereas the original part is RoHS non-compliant. For new designs or system refreshes, the LFE2M20E-6FN484C is the appropriate selection.

Frequently Asked Questions (FAQ)

Q: Can the LFE2M20E-6FN484C be used as a direct replacement for the LFE2M20E-6F484C?

A: Yes. Both parts share identical logic element count (19,000), I/O configuration (304 pins), embedded RAM capacity (1,246,208 bits), package type (484-BBGA), and electrical specifications. No design modifications are required.

Q: What is the difference between these two part numbers?

A: The primary differences are product status and regulatory compliance. The LFE2M20E-6F484C is obsolete, while the LFE2M20E-6FN484C is active. The substitute part is ROHS3 compliant, whereas the original is RoHS non-compliant.

Q: Are there any package or pinout differences?

A: No. Both parts use the 484-BBGA (23x23) package with identical pinout and mechanical dimensions.

Q: What is the supply voltage requirement for these FPGAs?

A: Both parts require a supply voltage range of 1.14V to 1.26V.

Q: What is the operating temperature range?

A: Both parts operate across a junction temperature range of 0°C to 85°C (TJ).

Q: What does MSL 3 (168 Hours) mean?

A: Moisture Sensitivity Level 3 indicates that the component can be exposed to moisture for up to 168 hours at specified humidity conditions before soldering. Both parts carry this rating.

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