LE25U40CQH-AH Equivalent & Substitute Parts

Part Overview

The LE25U40CQH-AH is a 4Mbit SPI FLASH memory IC manufactured by onsemi, packaged in an 8-VDFN (3x4) surface mount configuration. This non-volatile memory device operates at 40 MHz and is designed for embedded storage applications requiring SPI interface connectivity. The product is classified as obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations.

Key Parameters

Parameter	Value
Memory Type	Non-Volatile FLASH
Memory Size	4Mbit
Memory Organization	512K x 8
Memory Interface	SPI
Clock Frequency	40 MHz
Write Cycle Time	5ms
Supply Voltage Range	2.3V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
Package	8-WDFN Exposed Pad
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution compatibility for the LE25U40CQH-AH is determined by the following critical parameters:

Memory Capacity: 4Mbit capacity with 512K x 8 organization is mandatory for functional equivalence
Interface Protocol: SPI interface is required for circuit compatibility
Supply Voltage: 2.3V ~ 3.6V operating range ensures power supply compatibility
Operating Temperature Range: -40°C ~ 85°C maintains thermal specification alignment
Package Type: 8-WDFN Exposed Pad surface mount configuration for PCB layout compatibility
RoHS Compliance: ROHS3 Compliant status for regulatory alignment
MSL Rating: 3 (168 Hours) for moisture sensitivity handling during assembly

The W25X40CLZPIG TR from Winbond Electronics meets all mandatory substitution criteria. While this substitute operates at a higher clock frequency (104 MHz versus 40 MHz) and features faster write cycle time (800µs versus 5ms), these enhanced specifications do not prevent functional substitution in applications designed for the LE25U40CQH-AH.

Parameter Comparison

Parameter	LE25U40CQH-AH (onsemi)	W25X40CLZPIG TR (Winbond)	Compatibility
Memory Type	Non-Volatile FLASH	Non-Volatile FLASH	Match
Memory Size	4Mbit	4Mbit	Match
Memory Organization	512K x 8	512K x 8	Match
Memory Interface	SPI	SPI	Match
Clock Frequency	40 MHz	104 MHz	Compatible (higher frequency)
Write Cycle Time	5ms	800µs	Compatible (faster performance)
Supply Voltage Range	2.3V ~ 3.6V	2.3V ~ 3.6V	Match
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	Match
Mounting Type	Surface Mount	Surface Mount	Match
Package	8-WDFN Exposed Pad (3x4)	8-WDFN Exposed Pad (6x5)	Compatible (same pinout, different footprint)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Match
MSL Rating	3 (168 Hours)	3 (168 Hours)	Match
Product Status	Obsolete	Active	Substitute is actively manufactured

Engineering Selection Recommendations

The W25X40CLZPIG TR is a valid substitute for the obsolete LE25U40CQH-AH based on the following engineering criteria:

Regulatory Compliance: Both components maintain ROHS3 compliance and identical MSL ratings, ensuring compatibility with current manufacturing and environmental standards.

Functional Equivalence: Identical memory capacity, organization, and SPI interface protocol provide direct functional substitution. The substitute's enhanced performance specifications (104 MHz clock frequency and 800µs write cycle time) represent improvements over the original component and do not introduce incompatibility.

Supply and Thermal Specifications: Matching voltage range (2.3V ~ 3.6V) and operating temperature range (-40°C ~ 85°C) ensure seamless integration into existing power distribution and thermal management designs.

Product Availability: The W25X40CLZPIG TR maintains active manufacturing status with documented inventory availability, addressing the obsolescence of the original LE25U40CQH-AH component.

Package Consideration: While both components use 8-WDFN Exposed Pad packages, the physical footprint dimensions differ (3x4mm versus 6x5mm). PCB layout verification is required to confirm mechanical fit within existing designs.

Frequently Asked Questions (FAQ)

Q: Can the W25X40CLZPIG TR directly replace the LE25U40CQH-AH without firmware modifications?

A: Yes. Both components implement identical SPI protocol, memory organization (512K x 8), and electrical specifications. The substitute's higher clock frequency and faster write cycle time are backward compatible with designs specified for the original component.

Q: What is the primary difference between these two components?

A: The W25X40CLZPIG TR operates at 104 MHz with 800µs write cycle time, compared to the LE25U40CQH-AH at 40 MHz with 5ms write cycle time. The substitute also features a larger physical footprint (6x5mm versus 3x4mm).

Q: Are there any voltage or temperature compatibility concerns?

A: No. Both components share identical supply voltage range (2.3V ~ 3.6V) and operating temperature range (-40°C ~ 85°C), ensuring full electrical compatibility.

Q: Does the package size difference affect substitution feasibility?

A: The larger footprint of the W25X40CLZPIG TR (6x5mm) requires PCB layout verification. Existing designs with the 3x4mm LE25U40CQH-AH footprint may require layout modifications to accommodate the substitute component.

Q: Are both components RoHS compliant?

A: Yes. Both the LE25U40CQH-AH and W25X40CLZPIG TR are ROHS3 compliant with identical MSL ratings of 3 (168 Hours).

Q: Why is the LE25U40CQH-AH classified as obsolete?

A: Obsolescence reflects the manufacturer's discontinuation of this product line. The W25X40CLZPIG TR represents the active equivalent from Winbond Electronics, ensuring continued availability for new designs and legacy system support.

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