LC75700T-MPB-E Equivalent & Substitute Parts

Part Overview

The LC75700T-MPB-E is a specialized interface IC manufactured by onsemi in a 20-TSSOP surface mount package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The part operates within a 2.7V to 5.5V supply voltage range and is designed for interface applications requiring the 20-TSSOP form factor.

Substiute Parts

LC75700T-MPB-E

onsemiIn Stock: 1296LC75700T-MPB-E Datasheet

Current PartRFQ

ECE1105-HZH

Microchip TechnologyIn Stock: 805ECE1105-HZH Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution for the LC75700T-MPB-E is based on the following criteria derived from the provided parameters:

• Category Match: Interface classification
• Mounting Type: Surface mount technology
• Supply Voltage Compatibility: Operating range of 2.7V to 5.5V or compatible subset
• Regulatory Compliance: REACH Unaffected status
• Product Availability: Active product status preferred for long-term supply assurance

The identified substitute, ECE1105-HZH, is classified as an interface component with active product status. However, note that this substitute employs a different package form factor (48-VFQFN Exposed Pad versus 20-TSSOP), which represents a significant mechanical and electrical interface change requiring design-level evaluation.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The LC75700T-MPB-E is obsolete, while ECE1105-HZH maintains active product status, ensuring continued availability and manufacturing support.

Compliance Profile: Both components maintain REACH Unaffected status. The ECE1105-HZH additionally carries ROHS3 Compliance certification, providing enhanced environmental regulatory alignment.

Moisture Sensitivity: The ECE1105-HZH exhibits superior moisture handling characteristics (MSL 1, Unlimited) compared to the LC75700T-MPB-E (MSL 3, 168 Hours), reducing storage and handling constraints.

Package Transition: The shift from 20-TSSOP to 48-VFQFN represents a substantial change in pin count, footprint geometry, and thermal characteristics. This transition requires PCB redesign and functional validation at the system level.

Frequently Asked Questions (FAQ)

Q: Can ECE1105-HZH be used as a direct pin-for-pin replacement for LC75700T-MPB-E?

A: No. The ECE1105-HZH uses a 48-pin VFQFN package compared to the 20-pin TSSOP package of the LC75700T-MPB-E. Direct substitution is not possible without PCB redesign and functional re-qualification.

Q: What are the key differences in package specifications?

A: The LC75700T-MPB-E employs a 20-TSSOP package with 0.173" width and 4.40mm height. The ECE1105-HZH uses a 48-VFQFN package with exposed pad configuration. These represent different thermal management approaches and board layout requirements.

Q: Is supply voltage compatibility confirmed for ECE1105-HZH?

A: The supply voltage specification for ECE1105-HZH is not provided in the available data. Voltage compatibility must be verified against the ECE1105-HZH datasheet before implementation.

Q: What is the advantage of the ECE1105-HZH regarding moisture sensitivity?

A: The ECE1105-HZH carries MSL 1 (Unlimited) rating, eliminating time-based moisture exposure constraints during storage and assembly. The LC75700T-MPB-E requires management within a 168-hour window at MSL 3 conditions.

Q: Are both components compliant with current environmental regulations?

A: Both maintain REACH Unaffected status. The ECE1105-HZH additionally certifies ROHS3 Compliance, providing broader regulatory alignment for applications subject to RoHS directives.