LC5256MB-5F256I Equivalent & Substitute Parts

Part Overview

The LC5256MB-5F256I is a Complex Programmable Logic Device (CPLD) from Lattice Semiconductor Corporation's ispXPLD® 5000MB series. This device features 256 macrocells, 141 I/O pins, and a maximum propagation delay of 5 ns, housed in a 256-pin BGA package. The product is classified as obsolete, making identification of functionally compatible alternatives essential for ongoing system support and new design implementations.

Substiute Parts

LC5256MB-5F256I
Lattice Semiconductor CorporationIn Stock: 1047LC5256MB-5F256I Datasheet
LC5256MB-5F256I
Current Part
LCMXO2-1200UHC-6FTG256I
Lattice Semiconductor CorporationIn Stock: 1141LCMXO2-1200UHC-6FTG256I Datasheet
LCMXO2-1200UHC-6FTG256I
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number LC5256MB-5F256I
Manufacturer Lattice Semiconductor Corporation
Series ispXPLD® 5000MB
Product Category Embedded, Integrated Circuits (ICs)
Device Type CPLD
Number of Macrocells 256
Number of I/O 141
Delay Time tpd(1) Max 5 ns
Voltage Supply - Internal 2.3V ~ 2.7V
Operating Temperature -40°C ~ 105°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Programmable Type In System Programmable
Product Status Obsolete
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the LC5256MB-5F256I is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 256-pin BGA package format (256-FPBGA/256-FTBGA, 17x17 mm) to ensure PCB footprint compatibility.

Programmable Architecture: The substitute must support in-system programmability to maintain design flexibility and field reconfiguration capability.

I/O Pin Count: The substitute device must provide sufficient I/O pins to accommodate the original design's signal routing requirements.

Voltage Supply Range: The substitute's internal supply voltage must be compatible with or encompass the original specification to ensure proper operation within existing power distribution networks.

Operating Temperature Range: The substitute must support the full industrial temperature range (-40°C to 105°C) required by the original application.

Logic Capacity: The substitute must provide equivalent or greater logic resources (macrocells or logic elements) to support the original design's functional requirements.

The LCMXO2-1200UHC-6FTG256I meets these substitution criteria as a Lattice Semiconductor device with compatible package geometry, programmable architecture, and enhanced logic capacity.

Parameter Comparison

Parameter LC5256MB-5F256I LCMXO2-1200UHC-6FTG256I
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Device Type CPLD FPGA
Package / Case 256-BGA 256-LBGA
Supplier Device Package 256-FPBGA (17x17) 256-FTBGA (17x17)
Number of I/O 141 206
Logic Resources 256 Macrocells 1280 Logic Elements
Voltage Supply - Internal 2.3V ~ 2.7V 2.375V ~ 3.465V
Operating Temperature -40°C ~ 105°C (TJ) -40°C ~ 100°C (TJ)
Mounting Type Surface Mount Surface Mount
Programmable Type In System Programmable In System Programmable
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

The LC5256MB-5F256I is classified as obsolete, necessitating transition to active alternatives for new production and long-term system support. The LCMXO2-1200UHC-6FTG256I is an active product from the same manufacturer, providing a direct path for design migration.

Compliance Considerations: The LCMXO2-1200UHC-6FTG256I achieves ROHS3 compliance, whereas the original LC5256MB-5F256I is RoHS non-compliant. This distinction is significant for applications subject to regulatory requirements in markets enforcing RoHS directives.

Package Geometry: Both devices utilize identical 256-pin BGA packages with 17x17 mm footprints, enabling direct PCB layout reuse without redesign.

Logic Capacity: The substitute provides 1280 logic elements compared to the original's 256 macrocells, offering substantially greater design flexibility and headroom for future enhancements.

I/O Availability: The substitute provides 206 I/O pins versus the original's 141 pins, increasing available signal routing options.

Temperature Range: The substitute supports -40°C to 100°C, which covers the majority of industrial applications. Applications requiring operation above 100°C must retain the original device or identify alternative solutions.

Voltage Supply: The substitute's supply voltage range (2.375V ~ 3.465V) encompasses the original specification (2.3V ~ 2.7V), ensuring compatibility with existing power delivery networks.

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-1200UHC-6FTG256I be used as a direct replacement for the LC5256MB-5F256I?

A: Yes, for applications operating within -40°C to 100°C. Both devices share identical 256-pin BGA package geometry (17x17 mm), enabling direct PCB footprint compatibility. The substitute provides greater logic capacity and I/O availability. Applications requiring operation above 100°C must evaluate alternative solutions.

Q: What are the key differences between these devices?

A: The LC5256MB-5F256I is a CPLD with 256 macrocells and 141 I/O pins. The LCMXO2-1200UHC-6FTG256I is an FPGA with 1280 logic elements and 206 I/O pins. Both support in-system programmability and identical package geometry. The substitute is an active product with ROHS3 compliance, while the original is obsolete and RoHS non-compliant.

Q: Are there any voltage supply compatibility issues?

A: The substitute's supply voltage range (2.375V ~ 3.465V) encompasses the original specification (2.3V ~ 2.7V). Existing power delivery networks designed for the original device will operate the substitute within specification.

Q: Does the increased I/O count on the substitute create any design concerns?

A: No. The additional I/O pins (206 versus 141) provide expanded routing options. Unused pins can remain unconnected without affecting device operation. The identical package footprint ensures no PCB layout modifications are required.

Q: What is the impact of the substitute's lower maximum operating temperature?

A: The substitute operates to 100°C maximum junction temperature, compared to the original's 105°C. For applications with thermal margins below 100°C, this difference is negligible. Applications requiring sustained operation above 100°C must identify alternative solutions or implement enhanced thermal management.

Q: How does the FPGA architecture of the substitute compare to the CPLD architecture of the original?

A: Both architectures support in-system programmability and are suitable for logic implementation. The FPGA architecture of the substitute provides greater logic density (1280 elements versus 256 macrocells) and more I/O resources, enabling more complex designs within the same package footprint.

Q: Is the moisture sensitivity level identical between these devices?

A: Yes. Both devices specify MSL 3 (168 Hours), requiring identical handling and storage protocols during manufacturing and assembly operations.

Request Quote (Ships tomorrow)