LC5256MB-4FN256C Equivalent & Substitute Parts

Part Overview

The LC5256MB-4FN256C is a Complex Programmable Logic Device (CPLD) from Lattice Semiconductor Corporation's ispXPLD® 5000MB series. This 256-macrocell device features in-system programmability and operates at 4 ns maximum propagation delay. The product is classified as obsolete, necessitating identification of functionally compatible alternatives for new designs and ongoing system support.

Substiute Parts

LC5256MB-4FN256C
Lattice Semiconductor CorporationIn Stock: 2219LC5256MB-4FN256C Datasheet
LC5256MB-4FN256C
Current Part
LCMXO2-1200UHC-6FTG256I
Lattice Semiconductor CorporationIn Stock: 1141LCMXO2-1200UHC-6FTG256I Datasheet
LCMXO2-1200UHC-6FTG256I
MFR Recommended

Key Parameters

Parameter LC5256MB-4FN256C
Manufacturer Lattice Semiconductor Corporation
Series ispXPLD® 5000MB
Product Status Obsolete
Number of Macrocells 256
Number of I/O 141
Delay Time tpd(1) Max 4 ns
Voltage Supply - Internal 2.3V ~ 2.7V
Operating Temperature 0°C ~ 90°C (TJ)
Package / Case 256-BGA
Supplier Device Package 256-FPBGA (17x17)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

The LCMXO2-1200UHC-6FTG256I qualifies as a substitute based on the following alignment criteria:

Package Compatibility: Both devices utilize 256-pin BGA packages with identical 17x17 footprints (256-FPBGA and 256-FTBGA), ensuring mechanical and electrical pin compatibility on printed circuit boards.

Programmability: Both devices support in-system programmability, maintaining design flexibility and field reconfiguration capability.

Surface Mount Technology: Both employ surface mount assembly methods, compatible with standard manufacturing processes.

Moisture Sensitivity: Both devices carry MSL 3 classification (168 Hours), requiring identical handling and storage protocols.

Regulatory Compliance: Both devices maintain REACH Unaffected status and are classified under the same HTSUS code (8542.39.0001).

Logic Capacity: The substitute provides 1280 logic elements across 160 LABs/CLBs, exceeding the 256-macrocell capacity of the original device, ensuring functional coverage for existing designs.

Parameter Comparison

Parameter LC5256MB-4FN256C LCMXO2-1200UHC-6FTG256I
Manufacturer Lattice Semiconductor Corporation Lattice Semiconductor Corporation
Product Status Obsolete Active
Series ispXPLD® 5000MB MachXO2
Logic Capacity 256 Macrocells 1280 Logic Elements
I/O Count 141 206
Package / Case 256-BGA 256-LBGA
Supplier Device Package 256-FPBGA (17x17) 256-FTBGA (17x17)
Mounting Type Surface Mount Surface Mount
Voltage Supply 2.3V ~ 2.7V 2.375V ~ 3.465V
Operating Temperature 0°C ~ 90°C (TJ) -40°C ~ 100°C (TJ)
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The LC5256MB-4FN256C is classified as obsolete, making the LCMXO2-1200UHC-6FTG256I the designated substitute from Lattice Semiconductor Corporation. The substitute device is active in production and maintains regulatory compliance with ROHS3 standards, providing long-term availability and supply chain stability.

The LCMXO2-1200UHC-6FTG256I offers expanded operating temperature range (-40°C to 100°C versus 0°C to 90°C), increased I/O capacity (206 versus 141), and greater logic density (1280 elements versus 256 macrocells). These enhancements provide design margin and support more complex implementations without package or footprint changes.

Both devices share identical 256-pin BGA package geometry (17x17 mm), MSL 3 moisture sensitivity classification, and REACH compliance status. Pin-level compatibility requires design verification to confirm signal mapping and functional equivalence within the target application.

Frequently Asked Questions (FAQ)

Q: Can the LCMXO2-1200UHC-6FTG256I be used as a direct replacement for the LC5256MB-4FN256C?

A: Physical and electrical compatibility is established through identical 256-pin BGA package geometry and shared surface mount technology. Functional substitution requires design verification to confirm that the MachXO2 architecture supports the original design's logic implementation and timing requirements.

Q: What are the key differences in electrical specifications?

A: The substitute operates across a wider voltage range (2.375V to 3.465V versus 2.3V to 2.7V) and supports an extended operating temperature range (-40°C to 100°C versus 0°C to 90°C). The substitute provides 206 I/O pins compared to 141 on the original device.

Q: Are the packages mechanically identical?

A: Both devices use 256-pin BGA packages with 17x17 mm footprints. The LC5256MB-4FN256C uses 256-FPBGA packaging, while the LCMXO2-1200UHC-6FTG256I uses 256-FTBGA packaging. These designations indicate different ball pitch specifications; PCB layout compatibility requires confirmation of ball grid array specifications.

Q: What is the impact of the increased logic capacity?

A: The LCMXO2-1200UHC-6FTG256I provides 1280 logic elements versus 256 macrocells in the original device. This increased capacity supports more complex designs without requiring package changes, though design migration from CPLD to FPGA architecture may require tool and methodology adjustments.

Q: Are moisture sensitivity and handling requirements the same?

A: Both devices carry MSL 3 classification (168 Hours), requiring identical storage, handling, and reflow procedures. No changes to manufacturing or assembly protocols are necessary.

Q: What regulatory compliance differences exist?

A: The LCMXO2-1200UHC-6FTG256I is ROHS3 compliant, while the original device's RoHS status is not specified. Both maintain REACH Unaffected status and are classified under HTSUS code 8542.39.0001.

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