LB1845L-E Equivalent & Substitute Parts

Part Overview

The LB1845L-E is a motor driver IC manufactured by onsemi in 28-DIP packaging, designed for integrated motor control applications. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. The LB1845L-E operates as a fully integrated motor driver solution with control and power stage functionality integrated into a single package.

Substiute Parts

LB1845L-E
onsemiIn Stock: 3878LB1845L-E Datasheet
LB1845L-E
Current Part
A3966SLBTR-T
Allegro MicroSystemsIn Stock: 18503A3966SLBTR-T Datasheet
A3966SLBTR-T
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Key Parameters

Parameter LB1845L-E
Manufacturer onsemi
Category Power Management (PMIC)
Description IC MOTOR DRIVER 28DIP
Mounting Type Through Hole
Package / Case 28-SDIP (0.500", 12.70mm)
Product Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Substitute Part Grouping Explanation

Substitution of the LB1845L-E is based on the following critical parameters:

  • Functional Category: Power Management (PMIC) - Motor Driver
  • Function Type: Driver with fully integrated control and power stage
  • Compliance & Certification: REACH Unaffected, ECCN EAR99
  • Regulatory Status: Both main and substitute parts maintain equivalent compliance profiles

The A3966SLBTR-T qualifies as a substitute based on matching functional classification as a fully integrated motor driver with control and power stage architecture. Both components serve equivalent roles in motor control applications, though with different packaging and electrical specifications.

Parameter Comparison

Parameter LB1845L-E A3966SLBTR-T
Manufacturer onsemi Allegro MicroSystems
Category Power Management (PMIC) Power Management (PMIC)
Function Driver - Fully Integrated, Control and Power Stage Driver - Fully Integrated, Control and Power Stage
Mounting Type Through Hole Surface Mount
Package / Case 28-SDIP (0.500", 12.70mm) 16-PowerSOIC (0.295", 7.50mm Width)
Product Status Obsolete Active
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
RoHS Status Not specified ROHS3 Compliant

Engineering Selection Recommendations

The A3966SLBTR-T is an active product from Allegro MicroSystems and maintains equivalent compliance certifications (REACH Unaffected, ECCN EAR99) to the obsolete LB1845L-E. Selection of this substitute requires evaluation of the following factors:

  • Packaging Transition: The substitute requires transition from through-hole (28-DIP) to surface-mount (16-SOIC) technology, necessitating PCB redesign
  • Product Status: The A3966SLBTR-T is active and supported, providing long-term availability compared to the obsolete LB1845L-E
  • Regulatory Compliance: Both components maintain equivalent REACH and ECCN classifications, suitable for equivalent regulatory environments

Frequently Asked Questions (FAQ)

Q: Can the A3966SLBTR-T directly replace the LB1845L-E without PCB modification?

A: No. The A3966SLBTR-T uses surface-mount packaging (16-SOIC) while the LB1845L-E uses through-hole packaging (28-DIP). PCB redesign is required for physical and electrical integration.

Q: Are the compliance certifications equivalent between these parts?

A: Yes. Both the LB1845L-E and A3966SLBTR-T maintain REACH Unaffected and ECCN EAR99 classifications. The A3966SLBTR-T additionally carries ROHS3 compliance.

Q: What is the primary reason for substitution?

A: The LB1845L-E is obsolete. The A3966SLBTR-T is an active product from Allegro MicroSystems, ensuring continued availability and manufacturer support.

Q: Are there electrical parameter differences between these motor drivers?

A: Yes. Electrical specifications including voltage supply ranges, output current ratings, and operating temperature ranges differ between the two components. Detailed electrical datasheets must be consulted for application-specific compatibility verification.

Q: What mounting considerations apply to the A3966SLBTR-T?

A: The A3966SLBTR-T is a surface-mount component in 16-PowerSOIC packaging. Assembly requires surface-mount soldering processes and compatible PCB footprint design.

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