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LB1845L-E Equivalent & Substitute Parts
Part Overview
The LB1845L-E is a motor driver IC manufactured by onsemi in 28-DIP packaging, designed for integrated motor control applications. This component is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. The LB1845L-E operates as a fully integrated motor driver solution with control and power stage functionality integrated into a single package.
Substiute Parts
Key Parameters
| Parameter | LB1845L-E |
|---|---|
| Manufacturer | onsemi |
| Category | Power Management (PMIC) |
| Description | IC MOTOR DRIVER 28DIP |
| Mounting Type | Through Hole |
| Package / Case | 28-SDIP (0.500", 12.70mm) |
| Product Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
Substitute Part Grouping Explanation
Substitution of the LB1845L-E is based on the following critical parameters:
- Functional Category: Power Management (PMIC) - Motor Driver
- Function Type: Driver with fully integrated control and power stage
- Compliance & Certification: REACH Unaffected, ECCN EAR99
- Regulatory Status: Both main and substitute parts maintain equivalent compliance profiles
The A3966SLBTR-T qualifies as a substitute based on matching functional classification as a fully integrated motor driver with control and power stage architecture. Both components serve equivalent roles in motor control applications, though with different packaging and electrical specifications.
Parameter Comparison
| Parameter | LB1845L-E | A3966SLBTR-T |
|---|---|---|
| Manufacturer | onsemi | Allegro MicroSystems |
| Category | Power Management (PMIC) | Power Management (PMIC) |
| Function | Driver - Fully Integrated, Control and Power Stage | Driver - Fully Integrated, Control and Power Stage |
| Mounting Type | Through Hole | Surface Mount |
| Package / Case | 28-SDIP (0.500", 12.70mm) | 16-PowerSOIC (0.295", 7.50mm Width) |
| Product Status | Obsolete | Active |
| REACH Status | REACH Unaffected | REACH Unaffected |
| ECCN | EAR99 | EAR99 |
| RoHS Status | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
The A3966SLBTR-T is an active product from Allegro MicroSystems and maintains equivalent compliance certifications (REACH Unaffected, ECCN EAR99) to the obsolete LB1845L-E. Selection of this substitute requires evaluation of the following factors:
- Packaging Transition: The substitute requires transition from through-hole (28-DIP) to surface-mount (16-SOIC) technology, necessitating PCB redesign
- Product Status: The A3966SLBTR-T is active and supported, providing long-term availability compared to the obsolete LB1845L-E
- Regulatory Compliance: Both components maintain equivalent REACH and ECCN classifications, suitable for equivalent regulatory environments
Frequently Asked Questions (FAQ)
Q: Can the A3966SLBTR-T directly replace the LB1845L-E without PCB modification?
A: No. The A3966SLBTR-T uses surface-mount packaging (16-SOIC) while the LB1845L-E uses through-hole packaging (28-DIP). PCB redesign is required for physical and electrical integration.
Q: Are the compliance certifications equivalent between these parts?
A: Yes. Both the LB1845L-E and A3966SLBTR-T maintain REACH Unaffected and ECCN EAR99 classifications. The A3966SLBTR-T additionally carries ROHS3 compliance.
Q: What is the primary reason for substitution?
A: The LB1845L-E is obsolete. The A3966SLBTR-T is an active product from Allegro MicroSystems, ensuring continued availability and manufacturer support.
Q: Are there electrical parameter differences between these motor drivers?
A: Yes. Electrical specifications including voltage supply ranges, output current ratings, and operating temperature ranges differ between the two components. Detailed electrical datasheets must be consulted for application-specific compatibility verification.
Q: What mounting considerations apply to the A3966SLBTR-T?
A: The A3966SLBTR-T is a surface-mount component in 16-PowerSOIC packaging. Assembly requires surface-mount soldering processes and compatible PCB footprint design.
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