LB11683H-MPB-E Equivalent & Substitute Parts

Part Overview

The LB11683H-MPB-E is a motor driver IC manufactured by onsemi, designed for brushless DC (BLDC) motor control applications. It integrates control and power stage functionality in a 28-HSOP package with three half-bridge output configurations. The device operates across a supply voltage range of 5.5V to 13.8V with 1.5A output current capability.

This part is classified as obsolete, making equivalent and substitute parts necessary for ongoing production and maintenance applications. Identifying compatible alternatives ensures design continuity and supply chain reliability.

Substiute Parts

LB11683H-MPB-E
onsemiIn Stock: 1096LB11683H-MPB-E Datasheet
LB11683H-MPB-E
Current Part
BA6840BFS-E2
Rohm SemiconductorIn Stock: 1713BA6840BFS-E2 Datasheet
BA6840BFS-E2
Similar
BA6859AFP-YE2
Rohm SemiconductorIn Stock: 16046BA6859AFP-YE2 Datasheet
BA6859AFP-YE2
Similar

Key Parameters

Parameter Value
Manufacturer Part Number LB11683H-MPB-E
Manufacturer onsemi
Category Power Management (PMIC)
Motor Type Brushless DC (BLDC)
Function Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge (3)
Interface Parallel
Technology Bipolar
Current - Output 1.5A
Voltage - Supply 5.5V ~ 13.8V
Voltage - Load 5.5V ~ 13.8V
Operating Temperature -30°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOP (0.311", 7.90mm Width) Exposed Pad + 2 Heat Tabs
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution compatibility for the LB11683H-MPB-E is determined by the following critical parameters:

Motor driver function with fully integrated control and power stage capability, half-bridge output configuration (3 outputs), parallel interface, and bipolar technology form the functional baseline for substitution.

Electrical compatibility requires output current rating of 1.5A or greater, supply voltage range that encompasses or exceeds 5.5V to 13.8V operation, and load voltage compatibility within the specified range.

Package and mounting considerations include surface mount technology and physical form factor compatibility with the 28-HSOP footprint or equivalent alternatives.

Operating temperature range and environmental compliance (REACH, RoHS status) must meet or exceed the original specification requirements.

Parameter Comparison

Parameter LB11683H-MPB-E (Main) BA6859AFP-YE2 BA6840BFS-E2
Manufacturer onsemi Rohm Semiconductor Rohm Semiconductor
Motor Type Brushless DC (BLDC) Brushless DC (BLDC) Brushless DC (BLDC)
Function Driver - Fully Integrated, Control and Power Stage Motor Driver Driver - Fully Integrated, Control and Power Stage
Output Configuration Half Bridge (3) Half Bridge (3) Half Bridge (3)
Interface Parallel Parallel Parallel
Technology Bipolar Bipolar Bipolar
Current - Output 1.5A Not specified 1.3A
Voltage - Supply 5.5V ~ 13.8V 4.5V ~ 5.5V 4.25V ~ 5.5V
Voltage - Load 5.5V ~ 13.8V Not specified 3V ~ 15V
Operating Temperature -30°C ~ 85°C (TA) Not specified -20°C ~ 75°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 28-SOP (0.311", 7.90mm Width) 25-HSOP 20-SOP (0.213", 5.40mm Width)
Product Status Obsolete Not For New Designs Active
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

BA6859AFP-YE2 (Rohm Semiconductor) shares the same functional architecture as the LB11683H-MPB-E with half-bridge output configuration and parallel interface. This part is classified as "Not For New Designs," indicating limited long-term availability. It carries ROHS3 compliance and MSL 1 rating, providing superior moisture handling compared to the original part. Supply voltage range (4.5V ~ 5.5V) is narrower than the original specification.

BA6840BFS-E2 (Rohm Semiconductor) is actively produced and maintains full ROHS3 compliance with MSL 1 rating. Output current (1.3A) is slightly below the original 1.5A specification. Supply voltage range (4.25V ~ 5.5V) is narrower than the original. Operating temperature range (-20°C ~ 75°C) is more limited than the original (-30°C ~ 85°C). Load voltage range (3V ~ 15V) provides broader compatibility than the original specification. Package footprint (20-SOP) differs from the original 28-SOP, requiring PCB layout modification.

For applications requiring the full voltage and temperature range of the original LB11683H-MPB-E, neither substitute provides complete parameter coverage. Selection should be based on specific application voltage and temperature requirements, with PCB layout considerations for package differences.

Frequently Asked Questions (FAQ)

Q: Can BA6859AFP-YE2 directly replace LB11683H-MPB-E without PCB modification?

A: BA6859AFP-YE2 uses a 25-HSOP package compared to the original 28-SOP package. Pinout compatibility must be verified before direct substitution. PCB layout modification may be required.

Q: What is the primary limitation of BA6840BFS-E2 as a substitute?

A: BA6840BFS-E2 has a narrower supply voltage range (4.25V ~ 5.5V) compared to the original (5.5V ~ 13.8V). Applications requiring operation above 5.5V supply voltage cannot use this substitute. Additionally, output current is rated at 1.3A versus the original 1.5A.

Q: Why is the LB11683H-MPB-E classified as obsolete?

A: Obsolete classification indicates the manufacturer has discontinued production and support. This necessitates identifying equivalent parts for ongoing production requirements and maintenance applications.

Q: Are both substitute parts suitable for new design implementations?

A: BA6840BFS-E2 is actively produced and suitable for new designs. BA6859AFP-YE2 carries "Not For New Designs" status, limiting its use to legacy system maintenance or short-term production runs.

Q: How do moisture sensitivity levels affect component handling?

A: The original part (MSL 3, 168 hours) requires more stringent moisture control during storage and assembly compared to substitute parts (MSL 1, unlimited). Lower MSL ratings provide greater flexibility in manufacturing environments.

Q: What package considerations apply when selecting a substitute?

A: Package differences between 28-SOP, 25-HSOP, and 20-SOP require verification of pinout compatibility and PCB footprint redesign. Thermal performance may vary due to package geometry differences.

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