Amphenol ICC L77DFEH09SAM4B D-Sub Receptacle Equivalent & Substitute Parts

Part Overview

The L77DFEH09SAM4B is a 9-position D-Sub receptacle connector manufactured by Amphenol ICC (Commercial Products). This connector features female sockets, right-angle mounting, and solder termination, designed for panel-mount and through-hole applications. The part is currently active in production with 980 units in stock. Equivalent and substitute parts are identified for applications requiring alternative packaging, mounting configurations, or contact material specifications while maintaining core electrical and mechanical compatibility.

Substiute Parts

L77DFEH09SAM4B

Amphenol ICC (Commercial Products)In Stock: 995L77DFEH09SAM4B Datasheet

Current PartRFQ

DE09S564TLF

Amphenol ICC (FCI)In Stock: 1187DE09S564TLF Datasheet

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DE09S565MTLF

Amphenol ICC (FCI)In Stock: 865DE09S565MTLF Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the L77DFEH09SAM4B are qualified based on the following core parameters that determine functional and mechanical compatibility:

Critical Matching Parameters:

• Connector style (D-Sub)
• Connector type (Receptacle, Female Sockets)
• Number of positions (9)
• Number of rows (2)
• Shell size and layout (1 / DE, E)
• Mounting type (Right Angle, Through Hole)
• Termination method (Solder)
• Shell material and finish (Steel, Tin Plated)
• Voltage rating (300V)
• Operating temperature range (-55°C ~ 125°C)
• Flammability rating (UL94 V-0)
• RoHS compliance status

Variable Parameters Allowing Substitution:

• Packaging format (Tray vs. Bulk)
• Backset spacing (within connector layout constraints)
• Contact finish specifications (Gold vs. Gold GXT™)
• Contact material (Copper Alloy vs. Phosphor Bronze)
• Current rating per contact (7.5A vs. 5A per Contact)
• Flange feature configuration (Board Side vs. Housing/Shell)
• Dielectric material composition (with or without glass fill)

The substitute parts DE09S564TLF and DE09S565MTLF maintain all critical parameters while offering alternative configurations suitable for different application requirements and inventory availability.

Parameter Comparison

Engineering Selection Recommendations

L77DFEH09SAM4B Selection Criteria:

• Primary choice for applications requiring panel-mount configuration with board-side flange
• Specified when higher current rating of 7.5A per contact is required
• Preferred for designs utilizing glass-filled thermoplastic dielectric material
• Optimal for applications with 0.590" (14.99mm) backset spacing requirement
• Tray packaging suitable for controlled production environments

DE09S564TLF Selection Criteria:

• Alternative for applications not requiring panel-mount capability
• Suitable when bulk packaging is acceptable for manufacturing workflows
• Applicable to designs tolerating 5A per contact current rating
• Specified when flash gold contact finish meets application requirements
• Reduced backset spacing of 0.409" (10.40mm) for compact layouts
• Standard thermoplastic dielectric without glass fill acceptable

DE09S565MTLF Selection Criteria:

• Equivalent for applications requiring tray packaging with panel-mount brackets
• Specified when phosphor bronze contact material is preferred over copper alloy
• Suitable for designs with 0.370" (9.40mm) backset spacing requirement
• Applicable when 5A per contact current rating meets system specifications
• Glass-filled thermoplastic dielectric provides enhanced mechanical properties
• 30.0µin (0.76µm) gold GXT™ finish for enhanced contact durability

All three parts maintain active product status, RoHS compliance, MSL 1 rating, and identical voltage and temperature operating ranges. Selection between parts depends on specific mechanical mounting requirements, current capacity needs, and packaging preferences rather than electrical performance differences.

Frequently Asked Questions (FAQ)

Q: Can DE09S564TLF be used as a direct replacement for L77DFEH09SAM4B?

A: DE09S564TLF is electrically and mechanically compatible for applications not requiring panel-mount configuration. The primary difference is the flange feature: L77DFEH09SAM4B includes board-side flange (4-40), while DE09S564TLF uses housing/shell unthreaded flange. Both maintain identical shell size (1 / DE, E), 9-position layout, solder termination, and operating specifications. Backset spacing differs (0.590" vs. 0.409"), which may affect PCB layout compatibility.

Q: What is the difference between DE09S565MTLF and DE09S564TLF?

A: Both parts share identical connector style, type, positions, rows, shell size, mounting type, and termination. Key differences include: DE09S565MTLF includes mounting brackets and uses phosphor bronze contacts with 30.0µin gold GXT™ finish, while DE09S564TLF uses copper alloy contacts with flash gold finish. DE09S565MTLF has 0.370" backset spacing versus DE09S564TLF's 0.409". DE09S565MTLF includes glass-filled thermoplastic dielectric; DE09S564TLF uses standard thermoplastic.

Q: Are all three parts RoHS compliant?

A: Yes. L77DFEH09SAM4B, DE09S564TLF, and DE09S565MTLF are all RoHS Compliant with MSL 1 (Unlimited) moisture sensitivity level. All parts meet UL94 V-0 flammability requirements and operate across -55°C to 125°C temperature range.

Q: What packaging options are available?

A: L77DFEH09SAM4B and DE09S565MTLF are supplied in Tray packaging. DE09S564TLF is supplied in Bulk packaging. Packaging selection affects inventory management and production workflow but does not impact electrical or mechanical performance.

Q: How do current ratings differ between these parts?

A: L77DFEH09SAM4B is rated for 7.5A total current. DE09S564TLF and DE09S565MTLF are each rated for 5A per contact. Applications requiring higher current capacity should specify L77DFEH09SAM4B. Applications with lower current requirements can utilize either substitute part.

Q: What is the significance of backset spacing differences?

A: Backset spacing (0.590" for L77DFEH09SAM4B, 0.409" for DE09S564TLF, 0.370" for DE09S565MTLF) determines the distance from the connector mounting surface to the contact insertion point. This parameter affects PCB layout and mechanical clearance requirements. Selection must align with specific board design specifications.

Q: Can contact material differences affect performance?

A: L77DFEH09SAM4B and DE09S564TLF use copper alloy contacts; DE09S565MTLF uses phosphor bronze contacts. Both materials are suitable for solder termination and signal-level applications. Contact material selection does not affect voltage rating (300V) or operating temperature range (-55°C ~ 125°C). Material choice may influence contact durability and wear characteristics in specific application environments.

Q: What does GXT™ gold finish indicate?

A: GXT™ is a proprietary gold plating specification used on DE09S564TLF and DE09S565MTLF contacts. DE09S564TLF specifies flash thickness, while DE09S565MTLF specifies 30.0µin (0.76µm) thickness. L77DFEH09SAM4B uses standard gold finish at 20.0µin (0.51µm). All three finishes provide equivalent electrical performance for signal-level applications.

Q: Are these parts suitable for high-reliability applications?

A: All three parts meet UL94 V-0 flammability requirements and maintain RoHS compliance. Compliance certifications and active product status indicate suitability for industrial and commercial applications. Specific high-reliability requirements (such as MIL-spec qualification or extended temperature operation) should be verified against application specifications.