Amphenol ICC L77DFE09S1APN D-Sub 9-Position Receptacle Equivalent & Substitute Parts

Part Overview

The L77DFE09S1APN is a 9-position D-Sub receptacle connector manufactured by Amphenol ICC (Commercial Products). This connector features right-angle solder termination, panel mount through-hole installation, and is designed for signal applications requiring 300V operation across industrial and commercial equipment interfaces. The part maintains Active product status with full RoHS compliance and unlimited moisture sensitivity rating (MSL 1). Equivalent and substitute parts are identified to support procurement flexibility, inventory management, and supply chain continuity for applications where the primary part number becomes unavailable or where alternative packaging or performance specifications align with system requirements.

Substiute Parts

L77DFE09S1APN

Amphenol ICC (Commercial Products)In Stock: 911L77DFE09S1APN Datasheet

Current PartRFQ

DE09S564TLF

Amphenol ICC (FCI)In Stock: 1187DE09S564TLF Datasheet

SimilarRFQ

DE09S565MTLF

Amphenol ICC (FCI)In Stock: 865DE09S565MTLF Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the L77DFE09S1APN is determined by strict alignment across the following critical parameters:

Mandatory Matching Parameters:

• Connector Style: D-Sub
• Connector Type: Receptacle, Female Sockets
• Number of Positions: 9
• Shell Size, Connector Layout: 1 (DE, E)
• Mounting Type: Right Angle, Through Hole
• Termination: Solder
• Voltage Rating: 300V
• Operating Temperature Range: -55°C ~ 125°C
• RoHS Status: RoHS Compliant
• Material Flammability Rating: UL94 V-0

Allowable Variation Parameters:

• Packaging format (Tray vs. Bulk)
• Current rating per contact (5A to 7.5A)
• Contact finish specification (Gold vs. Gold GXT™)
• Contact finish thickness (Flash, 20.0µin, 30.0µin)
• Backset spacing tolerance (±0.04")
• Dielectric material composition (Thermoplastic vs. Thermoplastic Glass Filled)
• Contact material (Copper Alloy vs. Phosphor Bronze)
• Presence or absence of mounting brackets

The identified substitute parts DE09S564TLF and DE09S565MTLF satisfy all mandatory matching parameters and fall within allowable variation ranges for the specified application categories.

Parameter Comparison

Engineering Selection Recommendations

Primary Selection Criteria:

All three parts maintain Active product status and full RoHS compliance, qualifying them for applications requiring regulatory adherence in EU and global markets. The L77DFE09S1APN, DE09S564TLF, and DE09S565MTLF are electrically and mechanically compatible within the D-Sub 9-position receptacle category.

Current Rating Consideration:

The L77DFE09S1APN supports 7.5A per contact, while both substitute parts (DE09S564TLF and DE09S565MTLF) support 5A per contact. Applications requiring current levels between 5A and 7.5A per contact must verify that the 5A rating of substitute parts meets system requirements.

Backset Spacing Tolerance:

The L77DFE09S1APN specifies 0.406" (10.30mm) backset spacing. DE09S564TLF provides 0.409" (10.40mm), representing a 0.003" variation within typical manufacturing tolerance. DE09S565MTLF specifies 0.370" (9.40mm), representing a 0.036" reduction. PCB layout and connector alignment must accommodate these spacing differences.

Contact Finish and Material:

The L77DFE09S1APN uses standard gold plating (20.0µin) on copper alloy contacts. DE09S564TLF uses gold GXT™ (flash thickness) on copper alloy. DE09S565MTLF uses gold GXT™ (30.0µin) on phosphor bronze. All finishes and materials maintain 300V voltage rating and -55°C to 125°C operating range.

Packaging and Inventory:

The L77DFE09S1APN is supplied in Tray packaging (899 pcs in stock). DE09S564TLF is supplied in Bulk packaging (1142 pcs in stock). DE09S565MTLF is supplied in Tray packaging (768 pcs in stock). Packaging selection depends on procurement volume and handling requirements.

Mounting Bracket Feature:

The L77DFE09S1APN and DE09S565MTLF include mounting brackets. DE09S564TLF does not specify this feature. Applications requiring mechanical bracket support should prioritize L77DFE09S1APN or DE09S565MTLF.

Frequently Asked Questions (FAQ)

Q: Can DE09S564TLF and DE09S565MTLF be used interchangeably with L77DFE09S1APN in the same application?

A: Electrical and mechanical compatibility exists across all three parts for D-Sub 9-position receptacle applications. However, differences in current rating (5A vs. 7.5A), backset spacing (0.370" to 0.409"), and mounting bracket availability require verification against specific system requirements before substitution.

Q: What is the significance of the 0.036" backset spacing difference between L77DFE09S1APN (0.406") and DE09S565MTLF (0.370")?

A: Backset spacing defines the distance from the connector mounting face to the contact plane. A 0.036" reduction in DE09S565MTLF may affect PCB layout, connector alignment, and mating depth. PCB design must accommodate this variation to ensure proper connector seating and electrical contact.

Q: Are the gold GXT™ contact finishes on DE09S564TLF and DE09S565MTLF equivalent to the standard gold finish on L77DFE09S1APN?

A: GXT™ is a proprietary gold plating specification. While both finishes provide corrosion resistance and electrical conductivity suitable for 300V operation, the flash thickness on DE09S564TLF differs from the 30.0µin thickness on DE09S565MTLF. Contact finish thickness affects long-term durability and wear resistance. Applications with high mating cycle requirements should verify finish specifications against expected service life.

Q: Why does L77DFE09S1APN support 7.5A per contact while the substitute parts support only 5A?

A: Current rating depends on contact material composition, contact geometry, and thermal design. The L77DFE09S1APN achieves higher current capacity through its specific copper alloy formulation and contact design. Applications requiring sustained current above 5A per contact must use L77DFE09S1APN or verify that substitute parts meet reduced current requirements.

Q: What is the difference between Tray and Bulk packaging?

A: Tray packaging provides organized, protective storage for individual components, suitable for automated assembly and controlled handling. Bulk packaging supplies components in larger quantities with minimal individual protection, typically for high-volume manufacturing environments. Selection depends on procurement volume, handling equipment, and assembly process requirements.

Q: Do all three parts meet the same regulatory and compliance standards?

A: Yes. All three parts are RoHS Compliant, carry UL94 V-0 material flammability rating, operate across -55°C to 125°C, support 300V operation, and maintain MSL 1 (Unlimited) moisture sensitivity rating. Regulatory compliance is equivalent across all three parts.

Q: Can mounting brackets from L77DFE09S1APN be used with DE09S564TLF?

A: Mounting bracket compatibility depends on mechanical interface design. DE09S564TLF does not specify mounting bracket features. Mechanical compatibility cannot be confirmed without detailed dimensional drawings. Consult manufacturer documentation before attempting bracket adaptation.

Q: What contact material difference exists between L77DFE09S1APN and DE09S565MTLF?

A: L77DFE09S1APN uses copper alloy contacts, while DE09S565MTLF uses phosphor bronze contacts. Both materials provide adequate electrical conductivity and mechanical durability for D-Sub applications. Phosphor bronze offers enhanced spring properties and wear resistance in high-cycle mating applications. Material selection should align with expected connector mating frequency and contact force requirements.