L717DFB25PAM4B D-Sub 25 Position Plug Connector Equivalent & Substitute Parts

Part Overview

The L717DFB25PAM4B is a 25 position D-Sub plug connector manufactured by Amphenol ICC (Commercial Products). This connector features male pins, right-angle mounting, and solder termination, designed for panel mount and through-hole applications. The part is currently in active production status with 880 pieces in stock inventory.

Substitute parts are identified when equivalent D-Sub connectors share the same core functional specifications: 25 positions, 2-row configuration, shell size 3 (DB, B), male pin plug type, right-angle mounting, solder termination, and compatible electrical ratings. Alternative models become necessary when the primary part is unavailable, when specific packaging requirements differ, or when design revisions require validated equivalent components.

Key Parameters

Parameter	Value
Connector Type	D-Sub Plug, Male Pins
Number of Positions	25
Number of Rows	2
Shell Size, Connector Layout	3 (DB, B)
Mounting Type	Panel Mount, Through Hole, Right Angle
Termination Method	Solder
Shell Material, Finish	Steel, Tin Plated
Contact Finish	Gold
Voltage Rating	300V
Current Rating	7.5A
Operating Temperature Range	-55°C to 125°C
Material Flammability Rating	UL94 V-0
RoHS Status	RoHS Compliant
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the L717DFB25PAM4B is determined by strict alignment with the following core parameters:

Critical Matching Parameters:

Connector type: D-Sub plug with male pins
Position count: 25 positions
Row configuration: 2 rows
Shell size: 3 (DB, B)
Mounting style: Right-angle, through-hole compatible
Termination: Solder
Flammability rating: UL94 V-0 minimum
Operating temperature: -55°C to 125°C
Compliance: RoHS and REACH status

Allowable Variations:

Contact finish thickness (Flash vs. specified thickness)
Current rating per contact (5A vs. 7.5A) — substitute acceptable if application current requirement does not exceed substitute rating
Backset spacing (0.409" vs. 0.590") — affects PCB layout compatibility
Packaging format (Tray vs. Bulk)
Specific feature sets (Board Lock, Grounding Indents)

The identified substitutes DB25P564CTXLF and DB25P564GTXLF meet the critical matching parameters and are classified as equivalent alternatives.

Parameter Comparison

Parameter	L717DFB25PAM4B	DB25P564CTXLF	DB25P564GTXLF
Manufacturer	Amphenol ICC (Commercial Products)	Amphenol ICC (FCI)	Amphenol ICC (FCI)
Connector Type	D-Sub Plug, Male Pins	D-Sub Plug, Male Pins	D-Sub Plug, Male Pins
Number of Positions	25	25	25
Number of Rows	2	2	2
Shell Size, Connector Layout	3 (DB, B)	3 (DB, B)	3 (DB, B)
Mounting Type	Panel Mount, Through Hole, Right Angle	Through Hole, Right Angle	Through Hole, Right Angle
Termination	Solder	Solder	Solder
Shell Material, Finish	Steel, Tin Plated	Steel, Tin Plated	Steel, Tin Plated
Contact Finish	Gold	Gold, GXT™	Gold, GXT™
Contact Finish Thickness	20.0µin (0.51µm)	Flash	Flash
Material Flammability Rating	UL94 V-0	UL94 V-0	UL94 V-0
Current Rating (Amps)	7.5A	5A	5A per Contact
Backset Spacing	0.590" (14.99mm)	0.409" (10.40mm)	0.409" (10.40mm)
Voltage Rating	300V	Not specified	300V
Operating Temperature	-55°C to 125°C	-55°C to 125°C	-55°C to 125°C
RoHS Status	RoHS Compliant	ROHS3 Compliant	RoHS Compliant
Packaging	Tray	Tray	Bulk
Inventory Status	880 Pcs New Original In Stock	793 Pcs New Original In Stock	856 Pcs New Original In Stock

Engineering Selection Recommendations

L717DFB25PAM4B Primary Selection: Use the L717DFB25PAM4B when the application requires the specified 7.5A current rating per contact and 0.590" backset spacing. This part is RoHS Compliant and maintains active production status. The 20.0µin gold contact finish thickness provides the specified contact durability.

DB25P564CTXLF Substitute Selection: DB25P564CTXLF is suitable as a substitute when the application current requirement does not exceed 5A per contact and PCB layout can accommodate the 0.409" backset spacing. This part is ROHS3 Compliant and available in tray packaging. The GXT™ gold finish with flash thickness meets equivalent contact performance for lower-current applications. Voltage rating is not specified for this variant; confirm application voltage does not exceed 300V.

DB25P564GTXLF Substitute Selection: DB25P564GTXLF is suitable as a substitute when the application current requirement does not exceed 5A per contact and PCB layout can accommodate the 0.409" backset spacing. This part is RoHS Compliant with explicit 300V voltage rating confirmation. The GXT™ gold finish with flash thickness meets equivalent contact performance. Board Lock feature provides additional mechanical retention. Available in bulk packaging format.

Compliance Considerations: All three parts maintain UL94 V-0 flammability rating, -55°C to 125°C operating temperature range, and MSL 1 (Unlimited) moisture sensitivity level. All parts are REACH Unaffected and classified under ECCN EAR99 and HTSUS 8536.69.4040.

Frequently Asked Questions (FAQ)

Q: Can DB25P564CTXLF or DB25P564GTXLF be used in place of L717DFB25PAM4B in a 7.5A application?

A: No. The substitute parts are rated for 5A per contact maximum. If the application requires 7.5A current per contact, only the L717DFB25PAM4B meets this specification. Verify actual application current draw before selecting a substitute.

Q: What is the difference between DB25P564CTXLF and DB25P564GTXLF?

A: Both parts share identical electrical and mechanical specifications. The primary differences are: DB25P564GTXLF includes Board Lock feature for enhanced mechanical retention; DB25P564GTXLF has explicit 300V voltage rating specification while DB25P564CTXLF voltage rating is not specified; DB25P564CTXLF is packaged in Tray format while DB25P564GTXLF is packaged in Bulk format.

Q: Does the backset spacing difference (0.590" vs. 0.409") affect compatibility?

A: Yes. Backset spacing determines the distance from the connector mounting surface to the contact termination points. This directly affects PCB layout and hole positioning. The L717DFB25PAM4B uses 0.590" spacing while both substitutes use 0.409" spacing. PCB designs must be verified for compatibility with the selected part's backset spacing before substitution.

Q: Are the GXT™ gold finish and flash thickness equivalent to the L717DFB25PAM4B's 20.0µin gold finish?

A: GXT™ is an Amphenol ICC proprietary gold plating technology. Flash thickness indicates a minimal gold coating applied over the base contact material. While both provide gold contact finish, the specified 20.0µin thickness on L717DFB25PAM4B provides greater contact durability. For applications with high mating cycle requirements, verify that flash thickness meets performance expectations.

Q: Can I use DB25P564CTXLF if voltage rating is not specified?

A: DB25P564CTXLF does not have a specified voltage rating in the provided data. For applications requiring 300V rating confirmation, use DB25P564GTXLF (300V rated) or L717DFB25PAM4B (300V rated). Do not assume unspecified voltage ratings are equivalent to 300V.

Q: What is the difference between RoHS Compliant and ROHS3 Compliant?

A: Both indicate compliance with RoHS (Restriction of Hazardous Substances) regulations. ROHS3 refers to RoHS Directive 2011/65/EU as amended. Both compliance statuses are acceptable for equivalent substitution. All three parts are REACH Unaffected.

Q: Which substitute part should I select for new designs?

A: For new designs, confirm the application current requirement. If 7.5A per contact is required, use L717DFB25PAM4B. If maximum 5A per contact is acceptable, select based on packaging preference (Tray: DB25P564CTXLF; Bulk: DB25P564GTXLF) and verify voltage rating requirements (DB25P564GTXLF explicitly rated 300V; DB25P564CTXLF voltage unspecified). Verify PCB layout compatibility with 0.409" backset spacing for substitute parts.

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