Equivalent & Substitute Parts for L177DFE09SAM4B

Part Overview

The L177DFE09SAM4B is a 9-position D-Sub receptacle connector manufactured by Amphenol ICC (Commercial Products). This connector features female sockets, right-angle mounting, and solder termination, designed for panel-mount and through-hole applications. The part is currently active in production with 827 units in stock. Alternative equivalent parts are available to support procurement flexibility, supply chain continuity, and application-specific requirements where mechanical or electrical parameters align with system specifications.

Substiute Parts

L177DFE09SAM4B

Amphenol ICC (Commercial Products)In Stock: 922L177DFE09SAM4B Datasheet

Current PartRFQ

DE09S564TLF

Amphenol ICC (FCI)In Stock: 1187DE09S564TLF Datasheet

SimilarRFQ

DE09S565MTLF

Amphenol ICC (FCI)In Stock: 865DE09S565MTLF Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the L177DFE09SAM4B is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

• Connector Style: D-Sub
• Connector Type: Receptacle, Female Sockets
• Number of Positions: 9
• Number of Rows: 2
• Shell Size, Connector Layout: 1 (DE, E)
• Termination: Solder
• Voltage Rating: 300V
• Operating Temperature Range: -55°C to 125°C
• Material Flammability Rating: UL94 V-0
• RoHS Status: RoHS Compliant

Allowable Variation Parameters:

• Mounting Type: Through Hole and Right Angle configurations are compatible; Panel Mount is optional
• Current Rating: Substitute parts rated at 5A per contact are acceptable where system design does not require the full 7.5A capacity
• Backset Spacing: Variations in backset spacing (0.590", 0.409", 0.370") are permitted based on PCB layout requirements
• Contact Finish Thickness: Flash or 30.0µin (0.76µm) are both acceptable
• Dielectric Material: Thermoplastic with or without glass filling are compatible
• Contact Material: Copper Alloy or Phosphor Bronze are both acceptable
• Packaging: Tray or Bulk packaging does not affect electrical or mechanical compatibility

The substitute parts DE09S564TLF and DE09S565MTLF meet all mandatory matching parameters and are therefore electrically and mechanically equivalent to the L177DFE09SAM4B.

Parameter Comparison

Engineering Selection Recommendations

L177DFE09SAM4B Selection Criteria:

• Primary choice when system design requires 7.5A current capacity per contact
• Specified when panel mount capability is a design requirement
• Preferred when backset spacing of 0.590" (14.99mm) is mandated by PCB layout
• Appropriate for applications requiring glass-filled thermoplastic dielectric material
• Active product status with established supply chain

DE09S564TLF Selection Criteria:

• Suitable for applications with current requirements up to 5A per contact
• Appropriate when bulk packaging is acceptable for manufacturing processes
• Compatible with PCB designs requiring 0.409" (10.40mm) backset spacing
• Acceptable where flash contact finish thickness meets specification
• Higher inventory availability (1142 units) supports rapid procurement

DE09S565MTLF Selection Criteria:

• Suitable for applications with current requirements up to 5A per contact
• Specified when tray packaging is required for component handling
• Compatible with PCB designs requiring 0.370" (9.40mm) backset spacing
• Appropriate when phosphor bronze contact material is acceptable
• Glass-filled thermoplastic dielectric material matches L177DFE09SAM4B specification
• REACH Unaffected status provides additional regulatory documentation

All three parts maintain RoHS compliance, UL94 V-0 flammability rating, 300V voltage rating, and -55°C to 125°C operating temperature range. Selection between substitute parts depends on current capacity requirements, backset spacing constraints, and packaging specifications for the target application.

Frequently Asked Questions (FAQ)

Q: Can DE09S564TLF or DE09S565MTLF be used as direct replacements for L177DFE09SAM4B?

A: Both substitute parts are electrically and mechanically equivalent for applications where the current requirement does not exceed 5A per contact. The L177DFE09SAM4B is rated for 7.5A, while both substitutes are rated for 5A per contact. If your application requires the full 7.5A capacity, the L177DFE09SAM4B is the appropriate selection. All other electrical parameters, including voltage rating, operating temperature range, and flammability rating, are identical across all three parts.

Q: What is the significance of backset spacing differences?

A: Backset spacing defines the distance from the connector mounting surface to the contact insertion point. The L177DFE09SAM4B has 0.590" (14.99mm) backset spacing, DE09S564TLF has 0.409" (10.40mm), and DE09S565MTLF has 0.370" (9.40mm). These differences affect PCB layout and mounting depth. Selection must align with your specific PCB design and available mounting space. Backset spacing is not interchangeable without PCB redesign.

Q: Are there differences in contact material between these parts?

A: The L177DFE09SAM4B and DE09S564TLF use Copper Alloy contacts, while DE09S565MTLF uses Phosphor Bronze contacts. Both materials are acceptable for D-Sub receptacle applications and provide equivalent electrical performance. Contact material selection does not affect compatibility with standard D-Sub plug connectors.

Q: What is the difference between flash and 30.0µin contact finish thickness?

A: Both contact finish thicknesses provide gold plating for corrosion resistance and electrical conductivity. Flash plating is a minimal thickness coating, while 30.0µin (0.76µm) is a thicker specification. Both are acceptable for standard D-Sub applications. The L177DFE09SAM4B and DE09S565MTLF specify 30.0µin thickness, while DE09S564TLF specifies flash thickness. This difference does not affect electrical compatibility.

Q: Does packaging type affect connector performance?

A: Packaging type (Tray versus Bulk) affects component handling, storage, and manufacturing processes but does not affect electrical or mechanical performance. The L177DFE09SAM4B and DE09S565MTLF are supplied in Tray packaging, while DE09S564TLF is supplied in Bulk packaging. Selection should align with your manufacturing and inventory management requirements.

Q: Are all three parts RoHS compliant?

A: Yes, all three parts are RoHS compliant. The L177DFE09SAM4B, DE09S564TLF, and DE09S565MTLF all meet RoHS requirements. Additionally, DE09S565MTLF carries REACH Unaffected status, providing additional regulatory documentation for applications requiring enhanced compliance verification.

Q: What is the difference between glass-filled and non-glass-filled thermoplastic dielectric material?

A: The L177DFE09SAM4B and DE09S565MTLF use glass-filled thermoplastic dielectric material, which provides enhanced mechanical strength and thermal stability. DE09S564TLF uses standard thermoplastic dielectric material. Both materials meet UL94 V-0 flammability requirements and are suitable for standard D-Sub applications. Material selection does not affect electrical compatibility.

Q: Can I use DE09S564TLF or DE09S565MTLF if my application requires panel mount capability?

A: The L177DFE09SAM4B explicitly includes panel mount capability in its mounting type specification. DE09S564TLF and DE09S565MTLF are specified for through-hole and right-angle mounting only, without panel mount capability. If panel mount is a design requirement, the L177DFE09SAM4B is the appropriate selection.