L0806C1R0MDMIT Equivalent & Substitute Parts

Part Overview

The L0806C1R0MDMIT is a 1 µH shielded multilayer ferrite inductor manufactured by KEMET in the 0806 (2016 Metric) surface mount package. This component is rated for 1.3 A continuous current with a maximum DC resistance of 120 mOhm and operates across the temperature range of -40°C to 85°C. The part is classified as obsolete, necessitating identification of active equivalent components that maintain functional compatibility for new designs and production continuity.

Substiute Parts

L0806C1R0MDMIT

KEMETIn Stock: 4029L0806C1R0MDMIT Datasheet

Current PartRFQ

ASMPH-0806-1R0M-T

Abracon LLCIn Stock: 910ASMPH-0806-1R0M-T Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the L0806C1R0MDMIT is determined by strict equivalence across the following critical parameters:

Mandatory Matching Parameters:

• Inductance value: 1 µH
• Package / Case: 0806 (2016 Metric)
• Shielding type: Shielded
• Core material: Ferrite
• Operating temperature range: -40°C ~ 85°C
• Mounting type: Surface Mount
• Tolerance: ±20%

Allowable Variation Parameters:

• Current Rating: Substitute must equal or exceed 1.3 A
• DC Resistance (DCR): Substitute must be equal to or lower than 120 mOhm

The ASMPH-0806-1R0M-T from Abracon LLC meets all mandatory matching criteria and exceeds performance in current rating (1.4 A vs. 1.3 A) and DC resistance (90 mOhm vs. 120 mOhm maximum), making it a direct functional equivalent.

Parameter Comparison

Engineering Selection Recommendations

The ASMPH-0806-1R0M-T from Abracon LLC is a direct functional equivalent to the obsolete L0806C1R0MDMIT. Both components are ROHS3 compliant, REACH unaffected, and classified under the same HTSUS code. The substitute part is currently in active production status, ensuring long-term availability and supply chain continuity.

The Abracon part demonstrates superior electrical performance with a lower DC resistance (90 mOhm versus 120 mOhm maximum) and higher current rating (1.4 A versus 1.3 A), providing additional design margin without requiring circuit modifications. Physical dimensions and thermal operating range are identical, enabling direct PCB footprint compatibility.

Selection of the ASMPH-0806-1R0M-T eliminates obsolescence risk while maintaining full functional compatibility with existing circuit designs specified for the L0806C1R0MDMIT.

Frequently Asked Questions (FAQ)

Q: Can the ASMPH-0806-1R0M-T be used as a direct replacement for the L0806C1R0MDMIT without PCB modifications?

A: Yes. Both components share identical physical dimensions (0.079" L x 0.063" W, 0.039" maximum seated height), package designation (0806 / 2016 Metric), and mounting type (Surface Mount). No PCB layout changes are required.

Q: What are the key differences between these two inductors?

A: The primary differences are product status and electrical performance. The L0806C1R0MDMIT is obsolete, while the ASMPH-0806-1R0M-T is active. The Abracon part offers lower DC resistance (90 mOhm versus 120 mOhm) and higher current rating (1.4 A versus 1.3 A). Both maintain identical inductance (1 µH), tolerance (±20%), and operating temperature range (-40°C to 85°C).

Q: Are there any compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and carry the same ECCN (EAR99) and HTSUS (8504.50.8000) classifications. Moisture sensitivity level is identical at MSL 1 (Unlimited).

Q: What is the inductance frequency test point for these components?

A: Both inductors are tested at 1 MHz for inductance measurement.

Q: Can the substitute part handle the same current levels as the original?

A: The ASMPH-0806-1R0M-T exceeds the original specification, rated for 1.4 A compared to the L0806C1R0MDMIT's 1.3 A. This provides additional current capacity margin for the application.

Q: Are the packaging options compatible?

A: The original L0806C1R0MDMIT is supplied in Cut Tape (CT) & Digi-Reel format. The substitute ASMPH-0806-1R0M-T is supplied in Tape & Reel (TR) format. Both are standard surface mount packaging formats suitable for automated assembly processes.