KMPC8358CVRAGDDA Equivalent & Substitute Parts

Part Overview

The KMPC8358CVRAGDDA is a PowerPC e300 microprocessor IC from the MPC83xx series manufactured by NXP USA Inc. This 32-bit, single-core processor operates at 400MHz and integrates communications capabilities through a QUICC Engine, DDR/DDR2 memory controllers, and multiple interface options including Gigabit Ethernet, USB, and serial protocols. The part is classified as obsolete, making identification of functionally equivalent alternatives essential for system redesign, legacy support, and production continuity.

Substiute Parts

KMPC8358CVRAGDDA
NXP USA Inc.In Stock: 1040KMPC8358CVRAGDDA Datasheet
KMPC8358CVRAGDDA
Current Part
MPC8358CVRAGDDA
Freescale SemiconductorIn Stock: 1108MPC8358CVRAGDDA Datasheet
MPC8358CVRAGDDA
Direct

Key Parameters

Parameter Value
Manufacturer Part Number KMPC8358CVRAGDDA
Manufacturer NXP USA Inc.
Series MPC83xx
Core Processor PowerPC e300
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 400MHz
Co-Processors/DSP Communications; QUICC Engine
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (1)
USB USB 1.x (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Package / Case 668-BBGA Exposed Pad
Supplier Device Package 668-PBGA-PGE (29x29)
Additional Interfaces DUART, HDLC, I2C, PCI, SPI, UART
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the KMPC8358CVRAGDDA is determined by the following critical parameters:

  • Processor Architecture: PowerPC e300 core with 32-bit bus width
  • Performance: 400MHz clock speed
  • Integrated Peripherals: QUICC Engine, DDR/DDR2 memory controllers, Gigabit Ethernet, USB 1.x
  • Interface Protocols: DUART, HDLC, I2C, PCI, SPI, UART support
  • Package Compatibility: 668-PBGA-PGE (29x29) ball grid array form factor
  • Electrical Specifications: I/O voltage levels (1.8V, 2.5V, 3.3V) and operating temperature range (-40°C to 105°C)
  • Regulatory Compliance: RoHS3 compliance and REACH status

The substitute part MPC8358CVRAGDDA maintains functional equivalence through identical processor core architecture, clock speed, integrated communications engine, memory controller support, and peripheral interface set. Both parts operate within the same electrical and thermal specifications and share the same package footprint.

Parameter Comparison

Parameter KMPC8358CVRAGDDA (Main) MPC8358CVRAGDDA (Substitute)
Manufacturer NXP USA Inc. Freescale Semiconductor
Series MPC83xx MPC83xx
Core Processor PowerPC e300 PowerPC e300
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 400MHz
Co-Processors/DSP Communications; QUICC Engine Communications; QUICC Engine
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (1) 10/100/1000Mbps (1)
USB USB 1.x (1) USB 1.x (1)
Additional Interfaces DUART, HDLC, I2C, PCI, SPI, UART DUART, HDLC, I2C, PCI, SPI, UART
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The MPC8358CVRAGDDA from Freescale Semiconductor is a direct functional equivalent to the obsolete KMPC8358CVRAGDDA. Both parts share identical processor architecture, clock frequency, integrated peripheral set, and package specifications. The substitute part maintains full RoHS3 compliance and REACH compliance status, ensuring regulatory alignment with the original design.

The primary distinction is product status: the original part is obsolete while the substitute remains active, providing supply chain availability. The substitute part carries a higher Moisture Sensitivity Level (MSL 3 versus MSL 1), requiring adherence to 168-hour moisture exposure limits during storage and handling. This difference necessitates implementation of appropriate moisture control procedures during component procurement, storage, and assembly operations.

Both parts are suitable for direct pin-for-pin replacement in existing PCB designs without circuit modification, provided that moisture handling protocols are observed for the substitute part.

Frequently Asked Questions (FAQ)

Q: Can MPC8358CVRAGDDA directly replace KMPC8358CVRAGDDA in existing designs?

A: Yes. Both parts feature identical PowerPC e300 core architecture, 400MHz clock speed, 32-bit bus width, QUICC Engine integration, DDR/DDR2 memory controller support, and 668-PBGA-PGE (29x29) package footprint. Pin-for-pin replacement is supported without circuit redesign.

Q: What is the significance of the different Moisture Sensitivity Levels?

A: The original part (MSL 1) has unlimited moisture exposure tolerance, while the substitute (MSL 3) is limited to 168 hours of exposure above 30% relative humidity. Organizations must implement moisture control procedures including dry storage, desiccant packaging, and bake-out procedures prior to assembly to maintain component reliability.

Q: Are there differences in electrical specifications between the two parts?

A: No. Both parts operate at identical I/O voltage levels (1.8V, 2.5V, 3.3V) and the same operating temperature range (-40°C to 105°C). Electrical performance and thermal characteristics are equivalent.

Q: Do both parts meet current regulatory requirements?

A: Yes. Both the original and substitute parts are RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards for electronic components.

Q: What is the primary reason to select the substitute part?

A: The original KMPC8358CVRAGDDA is classified as obsolete, creating supply chain risk. The MPC8358CVRAGDDA substitute maintains active product status, ensuring component availability for new production runs and legacy system support.

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