KMPC8315EVRAGDA Equivalent & Substitute Parts

Part Overview

The KMPC8315EVRAGDA is a PowerPC e300c3 microprocessor IC from the MPC83xx series, featuring a single 32-bit core operating at 400MHz in a 620-HBGA package. This embedded processor integrates dual Gigabit Ethernet ports, dual SATA 3Gbps interfaces, USB 2.0 connectivity, and security co-processors including cryptography and random number generation capabilities. The main part is classified as obsolete, necessitating identification of active equivalent alternatives to maintain supply chain continuity for legacy system support and production requirements.

Substiute Parts

KMPC8315EVRAGDA
NXP USA Inc.In Stock: 1205KMPC8315EVRAGDA Datasheet
KMPC8315EVRAGDA
Current Part
MPC8315EVRAGDA
NXP USA Inc.In Stock: 2024MPC8315EVRAGDA Datasheet
MPC8315EVRAGDA
MFR Recommended

Key Parameters

Parameter Value
Core Processor PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 400MHz
Co-Processors/DSP Security; SEC 3.3
RAM Controllers DDR, DDR2
Ethernet 10/100/1000Mbps (2)
SATA SATA 3Gbps (2)
USB USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Package / Case 620-BBGA Exposed Pad
Mounting Type Surface Mount
Additional Interfaces DUART, I2C, PCI, SPI, TDM

Substitute Part Grouping Explanation

The MPC8315EVRAGDA qualifies as a direct equivalent to the KMPC8315EVRAGDA based on strict parameter alignment. Substitution eligibility is determined by the following critical parameters:

  • Core processor architecture: PowerPC e300c3
  • Processing capability: 1 Core, 32-Bit, 400MHz
  • Security co-processor: SEC 3.3
  • Memory controller support: DDR and DDR2
  • Network interface: Dual 10/100/1000Mbps Ethernet
  • Storage interface: Dual SATA 3Gbps
  • USB connectivity: USB 2.0 with PHY
  • I/O voltage levels: 1.8V, 2.5V, 3.3V
  • Thermal operating range: 0°C ~ 105°C
  • Physical form factor: 620-BBGA Exposed Pad surface mount package
  • Peripheral interfaces: DUART, I2C, PCI, SPI, TDM

The MPC8315EVRAGDA maintains identical electrical, functional, and mechanical specifications across all parameters. The primary distinction is product status: the main part (KMPC8315EVRAGDA) is obsolete, while the substitute (MPC8315EVRAGDA) maintains active production status.

Parameter Comparison

Parameter KMPC8315EVRAGDA (Main) MPC8315EVRAGDA (Substitute)
Manufacturer NXP USA Inc. NXP USA Inc.
Series MPC83xx MPC83xx
Product Status Obsolete Active
Core Processor PowerPC e300c3 PowerPC e300c3
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 400MHz 400MHz
Co-Processors/DSP Security; SEC 3.3 Security; SEC 3.3
RAM Controllers DDR, DDR2 DDR, DDR2
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
SATA SATA 3Gbps (2) SATA 3Gbps (2)
USB USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I/O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA) 0°C ~ 105°C (TA)
Security Features Cryptography, Random Number Generator Cryptography, Random Number Generator
Mounting Type Surface Mount Surface Mount
Package / Case 620-BBGA Exposed Pad 620-BBGA Exposed Pad
Supplier Device Package 620-HBGA (29x29) 620-HBGA (29x29)
Additional Interfaces DUART, I2C, PCI, SPI, TDM DUART, I2C, PCI, SPI, TDM
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 5A002A1 FRE 5A002A1 FRE
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The MPC8315EVRAGDA is the direct functional equivalent for the obsolete KMPC8315EVRAGDA. Both parts maintain identical electrical specifications, processing architecture, peripheral integration, and physical packaging. The substitute part carries active product status from NXP USA Inc., ensuring ongoing availability and supply chain support.

Both parts satisfy ROHS3 compliance requirements and maintain equivalent environmental certifications (REACH Unaffected status). Moisture sensitivity classification (MSL 3, 168 Hours) and export control designations (ECCN 5A002A1 FRE) are identical, eliminating compliance considerations in the substitution decision.

The 620-HBGA (29x29) package geometry and 620-BBGA Exposed Pad form factor are identical, confirming mechanical and thermal interface compatibility with existing PCB designs and thermal management solutions.

Frequently Asked Questions (FAQ)

Q: Are KMPC8315EVRAGDA and MPC8315EVRAGDA pin-compatible?

A: Yes. Both parts use the 620-HBGA (29x29) package with 620-BBGA Exposed Pad configuration. Pin assignments, signal definitions, and mechanical footprints are identical.

Q: Can MPC8315EVRAGDA replace KMPC8315EVRAGDA in existing designs without PCB modification?

A: Yes. The substitute part maintains identical electrical specifications, operating voltage ranges (1.8V, 2.5V, 3.3V), thermal operating range (0°C ~ 105°C), and all peripheral interface definitions. No design changes are required.

Q: What is the difference between these two part numbers?

A: The primary difference is product lifecycle status. KMPC8315EVRAGDA is classified as obsolete, while MPC8315EVRAGDA maintains active production status. All technical specifications, performance characteristics, and compliance certifications are identical.

Q: Are there any packaging differences between these parts?

A: No. Both parts are supplied in 620-HBGA (29x29) packages with exposed pad configuration. Packaging specifications, moisture sensitivity levels (MSL 3), and handling requirements are identical.

Q: Do both parts support the same memory controllers?

A: Yes. Both KMPC8315EVRAGDA and MPC8315EVRAGDA integrate identical DDR and DDR2 memory controllers with equivalent timing and configuration capabilities.

Q: Are the security features identical?

A: Yes. Both parts include SEC 3.3 security co-processors with cryptography and random number generation functionality. Security feature sets and performance are equivalent.

Q: What compliance certifications apply to the substitute part?

A: MPC8315EVRAGDA maintains ROHS3 compliance, REACH Unaffected status, and identical ECCN (5A002A1 FRE) and HTSUS (8542.31.0001) classifications as the main part.

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