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KAI-08052-ABA-JD-BA Equivalent & Substitute Parts
Part Overview
The KAI-08052-ABA-JD-BA is an interline CCD image sensor manufactured by onsemi, featuring a 3296H x 2472V active pixel array with 5.5µm x 5.5µm pixel dimensions. This component operates at 16 frames per second and requires a 14.5V to 15.5V supply voltage. The product is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system design and maintenance applications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | KAI-08052-ABA-JD-BA |
| Manufacturer | onsemi |
| Category | Optical Sensors |
| Product Type | CCD Image Sensor |
| Active Pixel Array | 3296H x 2472V |
| Pixel Size | 5.5µm x 5.5µm |
| Frames per Second | 16 |
| Voltage - Supply | 14.5V ~ 15.5V |
| Operating Temperature | -50°C ~ 70°C |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the KAI-08052-ABA-JD-BA is determined by the following critical parameters:
- Sensor Technology: The main part uses CCD technology. Substitute parts may employ CMOS technology, which represents a different sensor architecture with distinct electrical and operational characteristics.
- Resolution and Pixel Array: The main part provides 3296H x 2472V resolution. Substitute parts must deliver equivalent or superior resolution to maintain image capture capability.
- Pixel Size: The main part specifies 5.5µm x 5.5µm pixels. Smaller pixel sizes in substitutes indicate higher pixel density and potentially different optical requirements.
- Frame Rate: The main part operates at 16 fps. Substitute parts with higher frame rates provide enhanced temporal resolution.
- Supply Voltage: The main part requires 14.5V to 15.5V. Substitute parts with different voltage requirements necessitate power supply modifications.
- Operating Temperature Range: The main part operates from -50°C to 70°C. Substitute parts with different temperature ranges may have application limitations.
- Product Status and Compliance: The main part is obsolete. Active substitute parts with current RoHS3 compliance ensure regulatory adherence and supply chain continuity.
Parameter Comparison
| Parameter | KAI-08052-ABA-JD-BA | NOIX1SN8000B-LTI |
|---|---|---|
| Manufacturer | onsemi | onsemi |
| Category | Optical Sensors | Optical Sensors |
| Sensor Type | CCD | CMOS |
| Active Pixel Array | 3296H x 2472V | 4096H x 2160V |
| Pixel Size | 5.5µm x 5.5µm | 3.2µm x 3.2µm |
| Frames per Second | 16 | 128 |
| Voltage - Supply | 14.5V ~ 15.5V | 1.7V ~ 1.9V, 2.7V ~ 2.9V |
| Operating Temperature | -50°C ~ 70°C | -40°C ~ 85°C (TJ) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 4 (72 Hours) |
| Package / Case | Not specified | 163-BCLGA |
Engineering Selection Recommendations
The NOIX1SN8000B-LTI represents an active substitute for the obsolete KAI-08052-ABA-JD-BA. Both components are manufactured by onsemi and maintain ROHS3 compliance. The substitute part offers the following characteristics:
- Active Product Status: The NOIX1SN8000B-LTI is an active product, ensuring continued availability and supply chain support.
- Technology Transition: The substitute employs CMOS technology rather than CCD, requiring system-level evaluation of sensor architecture compatibility.
- Resolution: The substitute provides 4096H x 2160V resolution, exceeding the main part's 3296H x 2472V specification.
- Frame Rate Enhancement: The substitute operates at 128 fps, providing significantly higher temporal resolution than the main part's 16 fps capability.
- Power Supply Modification: The substitute requires 1.7V to 1.9V and 2.7V to 2.9V supply voltages, necessitating power distribution redesign compared to the main part's 14.5V to 15.5V requirement.
- Operating Temperature: The substitute supports -40°C to 85°C operation, extending the upper temperature limit beyond the main part's 70°C maximum.
- Packaging: The substitute is supplied in 163-BCLGA packaging with specified dimensions (20.88x19.9mm), requiring mechanical integration assessment.
Frequently Asked Questions (FAQ)
Q: Can the NOIX1SN8000B-LTI directly replace the KAI-08052-ABA-JD-BA without modifications?
A: Direct replacement is not possible. The substitute part requires modifications to power supply architecture (different voltage levels), sensor interface circuitry (CCD to CMOS transition), and mechanical mounting due to different packaging specifications.
Q: What are the key differences between CCD and CMOS sensor technologies in this substitution?
A: The main part uses CCD technology, while the substitute uses CMOS technology. These represent distinct sensor architectures with different signal processing requirements, power consumption profiles, and noise characteristics. System integration requires evaluation of these architectural differences.
Q: Does the higher frame rate of the substitute part affect compatibility?
A: The substitute's 128 fps capability exceeds the main part's 16 fps specification. System compatibility depends on whether the application can accommodate higher frame rates and whether the image processing pipeline supports increased data throughput.
Q: What is the impact of different pixel sizes on image quality?
A: The main part features 5.5µm x 5.5µm pixels, while the substitute uses 3.2µm x 3.2µm pixels. Smaller pixels increase pixel density and resolution but may affect light sensitivity and noise performance. Optical system redesign may be necessary.
Q: Are there supply chain considerations for this substitution?
A: The main part is obsolete, making the active NOIX1SN8000B-LTI the appropriate choice for new designs and ongoing production. Both parts maintain ROHS3 compliance and are manufactured by onsemi.
Q: What packaging considerations apply to the substitute part?
A: The NOIX1SN8000B-LTI is supplied in 163-BCLGA packaging (20.88x19.9mm). Mechanical integration assessment is required to ensure compatibility with existing PCB layouts and mounting structures.
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