KAI-08051-QXA-JD-BA Equivalent & Substitute Parts

Part Overview

The KAI-08051-QXA-JD-BA is an interline CCD image sensor manufactured by onsemi, featuring a 3296H x 2472V active pixel array with 5.5µm x 5.5µm pixel dimensions. This component operates at 16 frames per second and requires a 14.5V to 15.5V supply voltage. The device is packaged in a 68-pin ball grid array (68-BPGA) configuration.

This part is classified as obsolete. Locating equivalent or substitute components becomes necessary when original inventory is depleted or when system redesign accommodates alternative sensor technologies. The substitute identified maintains optical sensing functionality while offering different performance characteristics and technology platform.

Substiute Parts

KAI-08051-QXA-JD-BA
onsemiIn Stock: 1039KAI-08051-QXA-JD-BA Datasheet
KAI-08051-QXA-JD-BA
Current Part
NOIX1SE8000B-LTI
onsemiIn Stock: 1261NOIX1SE8000B-LTI Datasheet
NOIX1SE8000B-LTI
Similar

Key Parameters

Parameter Value
Manufacturer Part Number KAI-08051-QXA-JD-BA
Manufacturer onsemi
Category Optical Sensors
Sensor Type CCD
Active Pixel Array 3296H x 2472V
Pixel Size 5.5µm x 5.5µm
Frames per Second 16
Voltage - Supply 14.5V ~ 15.5V
Package / Case 68-BPGA
Operating Temperature -50°C ~ 70°C (TA)
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the KAI-08051-QXA-JD-BA is determined by the following criteria:

Functional Category: Both the main part and substitute must operate as image sensors within the optical sensors category.

Technology Platform: The substitute NOIX1SE8000B-LTI represents a transition from interline CCD technology to CMOS technology. This substitution is valid when system architecture permits sensor technology migration.

Compliance & Certification: Both components maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment.

Packaging Consideration: The substitute uses a different package type (163-BCLGA versus 68-BPGA), requiring PCB redesign and mechanical integration modifications.

Supply Voltage: The substitute operates at significantly lower voltage levels (1.7V ~ 1.9V and 2.7V ~ 2.9V) compared to the original 14.5V ~ 15.5V requirement, necessitating power supply circuit redesign.

Parameter Comparison

Parameter KAI-08051-QXA-JD-BA (Main) NOIX1SE8000B-LTI (Substitute)
Manufacturer onsemi onsemi
Category Optical Sensors Optical Sensors
Sensor Type CCD CMOS
Active Pixel Array 3296H x 2472V 4096H x 2160V
Pixel Size 5.5µm x 5.5µm 3.2µm x 3.2µm
Frames per Second 16 128
Voltage - Supply 14.5V ~ 15.5V 1.7V ~ 1.9V, 2.7V ~ 2.9V
Package / Case 68-BPGA 163-BCLGA
Operating Temperature -50°C ~ 70°C (TA) -40°C ~ 85°C (TJ)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 4 (72 Hours)

Engineering Selection Recommendations

Product Status Consideration: The KAI-08051-QXA-JD-BA is obsolete, while the NOIX1SE8000B-LTI is active. Selection of the substitute ensures access to current manufacturing and supply chain availability.

Compliance Alignment: Both components maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for equivalent substitution.

Technology Migration: Transition from CCD to CMOS technology requires evaluation of system-level imaging performance requirements, including noise characteristics, dynamic range, and signal processing compatibility.

Integration Requirements: The substitute necessitates redesign of power supply circuits, PCB layout, and mechanical mounting structures due to different voltage requirements and package geometry.

Inventory Status: The substitute part (NOIX1SE8000B-LTI) maintains active inventory status with 1176 units available, supporting production continuity.

Frequently Asked Questions (FAQ)

Q: Can the NOIX1SE8000B-LTI directly replace the KAI-08051-QXA-JD-BA without modifications?

A: No. The substitute requires system-level modifications including power supply redesign (different voltage levels), PCB layout changes (different package type: 163-BCLGA versus 68-BPGA), and mechanical integration adjustments. Signal processing firmware may require optimization for CMOS technology characteristics.

Q: What are the key differences between CCD and CMOS sensor technologies in this substitution?

A: The main part uses interline CCD technology operating at 16 fps with 5.5µm pixels. The substitute uses CMOS technology operating at 128 fps with 3.2µm pixels. These differences affect power consumption, noise performance, and image processing pipeline requirements.

Q: Are there compliance or certification concerns with this substitution?

A: Both components maintain ROHS3 compliance and REACH unaffected status. The substitute has a higher moisture sensitivity level (MSL 4 versus MSL 1), requiring stricter handling and storage protocols during manufacturing and assembly.

Q: What is the impact of different operating temperature ranges?

A: The main part operates from -50°C to 70°C (TA), while the substitute operates from -40°C to 85°C (TJ). Applications requiring operation below -40°C cannot use the substitute without thermal management modifications.

Q: How do the pixel array dimensions affect substitution feasibility?

A: The main part has 3296H x 2472V pixels at 5.5µm size. The substitute has 4096H x 2160V pixels at 3.2µm size. While total resolution differs, the substitute provides higher horizontal resolution and faster frame rates, requiring image processing algorithm adaptation.

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