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K472J20C0GF53L2 Equivalent & Substitute Parts
Part Overview
The K472J20C0GF53L2 is a 4700 pF radial ceramic capacitor manufactured by Vishay Beyschlag/Draloric/BC Components, rated for 50V with C0G/NP0 temperature coefficient. This component is classified as Active and suitable for general-purpose applications requiring stable capacitance across the operating temperature range of -55°C to 125°C. Equivalent and substitute parts are identified based on matching electrical specifications (capacitance, voltage rating, tolerance, temperature coefficient) and compatible mechanical parameters (mounting type, lead spacing, package configuration).
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Capacitance | 4700 pF |
| Tolerance | ±5% |
| Voltage Rating | 50V |
| Temperature Coefficient | C0G, NP0 |
| Operating Temperature Range | -55°C ~ 125°C |
| Mounting Type | Through Hole |
| Package Type | Radial |
| Lead Spacing | 0.098" (2.50mm) or 0.197" (5.00mm) |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution eligibility is determined by strict equivalence in the following electrical parameters: capacitance value (4700 pF), tolerance (±5%), voltage rating (50V), and temperature coefficient (C0G/NP0). All substitute parts must maintain Through Hole radial mounting configuration and comply with ROHS3 standards.
Mechanical compatibility is assessed through lead spacing and physical dimensions. Parts are grouped into two lead spacing categories: 0.098" (2.50mm) and 0.197" (5.00mm). Within each category, variations in body dimensions (length, width, height) are acceptable provided the lead spacing matches the application requirement.
The following substitute parts meet these criteria:
TDK Corporation FK Series (Not For New Designs):
- FK14C0G1H472JN020 (0.098" lead spacing)
- FK18C0G1H472JN020 (0.098" lead spacing)
- FK28C0G1H472JN000 (0.197" lead spacing)
Murata Electronics RDE Series (Active):
- RDE5C1H472J1P1H03B (0.098" lead spacing)
- RDE5C1H472J1K1H03B (0.197" lead spacing)
- RDE5C1H472J1S1H03A (0.098" lead spacing)
Parameter Comparison
| Manufacturer Part Number | Manufacturer | Capacitance | Tolerance | Voltage Rating | Temperature Coefficient | Operating Temperature | Lead Spacing | Mounting Type | Product Status | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|
| K472J20C0GF53L2 | Vishay Beyschlag/Draloric/BC Components | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.098" (2.50mm) | Through Hole | Active | ROHS3 Compliant |
| FK14C0G1H472JN020 | TDK Corporation | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.098" (2.50mm) | Through Hole | Not For New Designs | ROHS3 Compliant |
| FK18C0G1H472JN020 | TDK Corporation | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.098" (2.50mm) | Through Hole | Not For New Designs | ROHS3 Compliant |
| FK28C0G1H472JN000 | TDK Corporation | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.197" (5.00mm) | Through Hole | Not For New Designs | ROHS3 Compliant |
| RDE5C1H472J1P1H03B | Murata Electronics | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.098" (2.50mm) | Through Hole | Active | ROHS3 Compliant |
| RDE5C1H472J1K1H03B | Murata Electronics | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.197" (5.00mm) | Through Hole | Active | ROHS3 Compliant |
| RDE5C1H472J1S1H03A | Murata Electronics | 4700 pF | ±5% | 50V | C0G, NP0 | -55°C ~ 125°C | 0.098" (2.50mm) | Through Hole | Active | ROHS3 Compliant |
Engineering Selection Recommendations
All identified substitute parts maintain full electrical equivalence to the K472J20C0GF53L2 across capacitance, voltage rating, tolerance, and temperature coefficient specifications. All parts are ROHS3 compliant and suitable for applications requiring stable capacitance performance in the -55°C to 125°C temperature range.
For new designs, Murata Electronics RDE series parts (RDE5C1H472J1P1H03B, RDE5C1H472J1K1H03B, RDE5C1H472J1S1H03A) are classified as Active and represent the preferred selection path. These parts are available in both 0.098" and 0.197" lead spacing configurations.
TDK Corporation FK series parts (FK14C0G1H472JN020, FK18C0G1H472JN020, FK28C0G1H472JN000) are classified as Not For New Designs and are suitable for legacy system maintenance and repair applications where component continuity is required.
Lead spacing selection is determined by PCB layout requirements. The 0.098" (2.50mm) spacing accommodates compact board designs, while the 0.197" (5.00mm) spacing is used in standard-pitch applications.
Frequently Asked Questions (FAQ)
Q: What determines if a part can substitute for the K472J20C0GF53L2?
A: Substitution requires matching electrical specifications: 4700 pF capacitance, ±5% tolerance, 50V voltage rating, and C0G/NP0 temperature coefficient. The part must also be Through Hole radial mounted with compatible lead spacing (0.098" or 0.197") and ROHS3 compliant.
Q: Can I use a substitute part with different lead spacing?
A: Lead spacing is determined by PCB hole pattern and cannot be changed without board redesign. Select a substitute part matching your application's lead spacing requirement: 0.098" (2.50mm) or 0.197" (5.00mm).
Q: What is the difference between C0G and NP0 temperature coefficients?
A: C0G and NP0 designations refer to the same temperature coefficient specification. C0G is the EIA standard designation, while NP0 is the IEC standard designation. Both indicate zero temperature coefficient performance across the operating range.
Q: Why are some substitute parts marked "Not For New Designs"?
A: Product status reflects manufacturer lifecycle classification. Parts marked "Not For New Designs" are maintained for legacy system support but are not recommended for new product development. Active-status parts are preferred for new designs.
Q: Are all substitute parts ROHS3 compliant?
A: Yes. All identified substitute parts are ROHS3 compliant, matching the compliance status of the K472J20C0GF53L2.
Q: What is the difference between Bulk and Cut Tape packaging?
A: Bulk packaging is supplied in loose form, while Cut Tape (CT) packaging provides components on adhesive tape for automated assembly. Both packaging types contain electrically and mechanically identical components. Selection depends on assembly process requirements.
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