IXSH35N120B IGBT Equivalent & Substitute Parts

Part Overview

The IXSH35N120B is a 1200V, 70A IGBT manufactured by IXYS in a TO-247-3 through-hole package. This PT-type IGBT is rated for 300W maximum power dissipation and features a collector-emitter breakdown voltage of 1200V with a maximum collector current of 70A. The device is classified as obsolete, necessitating identification of active equivalent and substitute components that maintain functional compatibility within the same voltage and current class while meeting modern compliance requirements.

Substiute Parts

IXSH35N120B

IXYSIn Stock: 773IXSH35N120B Datasheet

Current PartRFQ

IXA55I1200HJ

IXYSIn Stock: 1479IXA55I1200HJ Datasheet

SimilarRFQ

STGWA40H120DF2

STMicroelectronicsIn Stock: 15429STGWA40H120DF2 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the IXSH35N120B is determined by the following critical parameters:

Mandatory Matching Criteria:

• Voltage - Collector Emitter Breakdown (Max): 1200V
• Package / Case: TO-247-3 through-hole configuration
• Mounting Type: Through Hole
• Input Type: Standard

Performance Compatibility Criteria:

• Current - Collector (Ic) (Max): Equal to or greater than 70A
• Power - Max: Equal to or greater than 300W
• Operating Temperature Range: Must encompass or exceed -55°C to 150°C

Acceptable Variation Parameters:

• Vce(on) (Max): Lower values indicate improved efficiency
• Gate Charge: Variation acceptable within switching application requirements
• Switching Energy: Lower values indicate improved switching performance
• IGBT Type: PT-type or advanced variants (Trench Field Stop) acceptable

The substitute parts identified meet all mandatory matching criteria and equal or exceed performance specifications, ensuring direct functional replacement capability.

Parameter Comparison

Engineering Selection Recommendations

IXA55I1200HJ (IXYS)

The IXA55I1200HJ is an active IXYS product that maintains the same 1200V voltage class and TO-247-3 package configuration as the IXSH35N120B. This device provides 84A collector current, exceeding the original 70A specification, and delivers improved on-state voltage performance (2.1V versus 3.6V at comparable test conditions). The IXA55I1200HJ is ROHS3 compliant and carries active product status, ensuring long-term availability and supply chain stability. The operating temperature range of -40°C to 150°C covers the primary operating window of the original device. This substitute is suitable for applications where IXYS component continuity is required.

STGWA40H120DF2 (STMicroelectronics)

The STGWA40H120DF2 is an active STMicroelectronics product featuring Trench Field Stop IGBT technology within the same 1200V voltage class and TO-247-3 package. This device provides 80A collector current and significantly enhanced power handling capability (468W versus 300W), with substantially lower switching energy losses (1mJ on, 1.32mJ off versus 5mJ off for the original). The extended operating temperature range of -55°C to 175°C exceeds the original specification. The STGWA40H120DF2 is ROHS3 compliant with active product status. This substitute is suitable for applications requiring improved thermal performance and reduced switching losses.

Both substitute parts satisfy mandatory compatibility criteria and provide enhanced performance characteristics relative to the obsolete IXSH35N120B.

Frequently Asked Questions (FAQ)

Q: Can the IXA55I1200HJ directly replace the IXSH35N120B in existing circuit designs?

A: The IXA55I1200HJ maintains identical voltage rating (1200V), package configuration (TO-247-3), and through-hole mounting type. The higher collector current rating (84A versus 70A) and improved on-state voltage (2.1V versus 3.6V) provide enhanced performance margins. Direct pin-compatible substitution is supported. Verification of gate drive circuit compatibility with the higher gate charge (190nC versus 120nC) is required.

Q: What are the key differences between the IXA55I1200HJ and STGWA40H120DF2?

A: Both devices share the 1200V voltage rating and TO-247-3 package. The STGWA40H120DF2 employs Trench Field Stop technology, delivering significantly lower switching energy (1mJ on, 1.32mJ off) compared to the PT-type IXA55I1200HJ (4.5mJ on, 5.5mJ off). The STGWA40H120DF2 provides higher power dissipation capability (468W versus 290W) and extended temperature range (-55°C to 175°C versus -40°C to 150°C). The STGWA40H120DF2 is manufactured by STMicroelectronics, while the IXA55I1200HJ is manufactured by IXYS.

Q: Are there temperature range limitations when substituting the IXSH35N120B?

A: The original IXSH35N120B operates from -55°C to 150°C. The IXA55I1200HJ operates from -40°C to 150°C, which covers the primary operating range but does not extend to the lower -55°C limit. The STGWA40H120DF2 operates from -55°C to 175°C, fully encompassing the original temperature specification. For applications requiring operation below -40°C, the STGWA40H120DF2 is the appropriate selection.

Q: What compliance certifications apply to the substitute parts?

A: Both the IXA55I1200HJ and STGWA40H120DF2 are ROHS3 compliant and REACH unaffected. Both carry MSL rating of 1 (Unlimited). Both are classified under ECCN EAR99 and HTSUS 8541.29.0095, matching the original device classification.

Q: How do switching characteristics compare between the three devices?

A: The IXSH35N120B exhibits turn-on delay of 36ns and turn-off delay of 160ns at 25°C. The STGWA40H120DF2 provides faster switching with 18ns turn-on and 152ns turn-off delay, resulting in lower switching energy losses. The IXA55I1200HJ switching delay specifications are not provided in available data. Applications sensitive to switching speed should reference the STGWA40H120DF2 for improved performance.

Q: Is the ISOPLUS247™ package of the IXA55I1200HJ compatible with TO-247-3 footprints?

A: The IXA55I1200HJ is specified with ISOPLUS247™ supplier device package designation, while the standard package case is TO-247-3. ISOPLUS247™ is a variant of the TO-247 standard. Pin compatibility with standard TO-247-3 footprints requires verification of specific pin assignments and mechanical dimensions against the application PCB layout.