IXSH30N60BD1 IGBT 600V 55A Equivalent & Substitute Parts

Part Overview

The IXSH30N60BD1 is a 600V, 55A IGBT manufactured by IXYS in a Through Hole TO-247-3 package. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs. The part delivers 200W maximum power dissipation with standard input gate drive characteristics suitable for industrial switching applications.

Due to its obsolete status, equivalent substitute parts with matching or superior electrical and mechanical specifications are required for procurement and design continuity.

Substiute Parts

IXSH30N60BD1
IXYSIn Stock: 5663IXSH30N60BD1 Datasheet
IXSH30N60BD1
Current Part
IXXH30N60B3D1
IXYSIn Stock: 1919IXXH30N60B3D1 Datasheet
IXXH30N60B3D1
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AOK30B60D1
Alpha & Omega Semiconductor Inc.In Stock: 5045AOK30B60D1 Datasheet
AOK30B60D1
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STGW30V60DF
STMicroelectronicsIn Stock: 10234STGW30V60DF Datasheet
STGW30V60DF
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Key Parameters

Parameter Value Unit
Voltage - Collector Emitter Breakdown (Max) 600 V
Current - Collector (Ic) (Max) 55 A
Current - Collector Pulsed (Icm) 110 A
Vce(on) (Max) @ Vge, Ic 2.7V @ 15V, 55A V
Power - Max 200 W
Switching Energy (off) 1.5 mJ
Gate Charge 100 nC
Td (on/off) @ 25°C 30/150 ns
Reverse Recovery Time (trr) 50 ns
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Through Hole -
Package / Case TO-247-3 -
Input Type Standard -
Moisture Sensitivity Level (MSL) 1 (Unlimited) -

Substitute Part Grouping Explanation

Substitution of the IXSH30N60BD1 is determined by the following critical parameters:

Mandatory Matching Criteria:

  • Voltage rating: 600V minimum (Collector Emitter Breakdown)
  • Package type: TO-247-3 Through Hole configuration
  • Input type: Standard gate drive
  • Mounting: Through Hole

Performance Compatibility Criteria:

  • Collector current (Ic): Equal to or greater than 55A
  • Pulsed collector current (Icm): Equal to or greater than 110A
  • Vce(on): Equal to or lower than 2.7V at rated conditions
  • Power dissipation: Equal to or greater than 200W
  • Operating temperature range: Minimum -55°C to 150°C

Acceptable Substitutes:

The following parts meet or exceed all mandatory and performance criteria:

  1. IXXH30N60B3D1 (IXYS) - Active status, enhanced performance
  2. AOK30B60D1 (Alpha & Omega Semiconductor Inc.) - Active status, enhanced performance
  3. STGW30V60DF (STMicroelectronics) - Active status, enhanced performance

All three substitutes are available in active production status with ROHS3 compliance and REACH unaffected certification.

Parameter Comparison

Parameter IXSH30N60BD1 IXXH30N60B3D1 AOK30B60D1 STGW30V60DF Unit
Manufacturer IXYS IXYS Alpha & Omega Semiconductor Inc. STMicroelectronics -
Product Status Obsolete Active Active Active -
Voltage - Collector Emitter Breakdown (Max) 600 600 600 600 V
Current - Collector (Ic) (Max) 55 60 60 60 A
Current - Collector Pulsed (Icm) 110 115 96 120 A
Vce(on) (Max) @ Vge, Ic 2.7V @ 15V, 55A 1.85V @ 15V, 24A 2.4V @ 15V, 26A 2.3V @ 15V, 30A V
Power - Max 200 270 208 258 W
Switching Energy (off) 1.5 500 240 233 µJ
Gate Charge 100 39 34 163 nC
Td (on/off) @ 25°C 30/150 23/97 20/58 45/189 ns
Reverse Recovery Time (trr) 50 25 120 53 ns
Operating Temperature Range -55 to 150 -55 to 175 -55 to 150 -55 to 175 °C (TJ)
Package / Case TO-247-3 TO-247-3 TO-247-3 TO-247-3 -
Mounting Type Through Hole Through Hole Through Hole Through Hole -
Input Type Standard Standard Standard Standard -
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) -
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected -

Engineering Selection Recommendations

IXXH30N60B3D1 (IXYS GenX3™, XPT™ Series)

This substitute is recommended as the primary replacement for the IXSH30N60BD1. The IXXH30N60B3D1 is manufactured by the same supplier (IXYS) and maintains full electrical compatibility. It exceeds the original part specifications with 60A collector current, 270W power dissipation, and an extended operating temperature range to 175°C. The part is ROHS3 compliant and in active production status. Switching performance is improved with reduced gate charge (39nC versus 100nC) and faster switching times.

AOK30B60D1 (Alpha & Omega Semiconductor Inc. Alpha IGBT™ Series)

This substitute provides a cost-effective alternative with active production status and ROHS3 compliance. The AOK30B60D1 meets all mandatory electrical requirements with 60A collector current and 208W power dissipation. Operating temperature range matches the original part at -55°C to 150°C. Switching characteristics show improved turn-off time (58ns versus 150ns) and reduced gate charge (34nC).

STGW30V60DF (STMicroelectronics Trench Field Stop Technology)

This substitute utilizes advanced Trench Field Stop IGBT technology and is available in active production with ROHS3 compliance. The STGW30V60DF delivers 60A collector current, 258W power dissipation, and an extended operating temperature range to 175°C. This part is suitable for applications requiring enhanced thermal performance and is available in high inventory quantities.

All three substitutes are REACH unaffected and carry EAR99 export classification matching the original part.

Frequently Asked Questions (FAQ)

Q: Can the IXXH30N60B3D1 directly replace the IXSH30N60BD1 in existing designs?

A: Yes. The IXXH30N60B3D1 is pin-compatible in the TO-247-3 package and meets or exceeds all electrical specifications of the IXSH30N60BD1. The higher current rating (60A versus 55A), increased power dissipation (270W versus 200W), and improved switching characteristics make it a direct functional replacement. Gate drive requirements are identical (Standard input type, 15V gate voltage).

Q: What are the key differences between the three substitute options?

A: All three substitutes meet the mandatory 600V, 55A minimum specifications and TO-247-3 package requirement. The IXXH30N60B3D1 offers the fastest switching performance with the lowest gate charge (39nC). The AOK30B60D1 provides the shortest turn-off time (58ns) and lowest gate charge (34nC) among the three. The STGW30V60DF uses advanced Trench Field Stop technology and offers the highest pulsed current rating (120A) and extended temperature range to 175°C.

Q: Are there thermal management considerations when substituting these parts?

A: All substitute parts are rated for higher power dissipation than the original IXSH30N60BD1 (208W to 270W versus 200W). Existing thermal management solutions designed for the original part will accommodate the substitutes. The STGW30V60DF and IXXH30N60B3D1 offer extended operating temperature ranges to 175°C, providing additional thermal margin in high-temperature applications.

Q: Do the substitute parts require different gate drive circuits?

A: No. All substitute parts maintain Standard input type gate drive characteristics with 15V gate voltage specification. Existing gate drive circuits designed for the IXSH30N60BD1 are compatible with all three substitutes. However, the reduced gate charge in the IXXH30N60B3D1 (39nC) and AOK30B60D1 (34nC) compared to the original part (100nC) may reduce gate drive power dissipation.

Q: What is the inventory status of these substitute parts?

A: All three substitutes are in active production with substantial inventory availability. IXXH30N60B3D1: 1,873 pieces. AOK30B60D1: 4,992 pieces. STGW30V60DF: 10,200 pieces. The original IXSH30N60BD1 remains available with 5,625 pieces in stock despite obsolete status.

Q: Are all substitutes compliant with current regulatory requirements?

A: Yes. All three substitute parts are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards. The original IXSH30N60BD1 is REACH unaffected but does not carry ROHS3 certification due to its obsolete status.

Q: Can multiple substitutes be used interchangeably within the same system?

A: Yes. All three substitutes are electrically and mechanically compatible with each other and with the original IXSH30N60BD1 in TO-247-3 package applications. System designs can accommodate any of the three substitutes without modification to PCB layout or thermal management.

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