IXSH24N60A IGBT Equivalent & Substitute Parts

Part Overview

The IXSH24N60A is a 600V, 48A punch-through (PT) IGBT manufactured by IXYS in the HiPerFAST™ series, housed in a TO-247-3 package for through-hole mounting. This device is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support, maintenance, and production continuity. The IXSH24N60A delivers 150W maximum power dissipation with switching characteristics optimized for medium-frequency power conversion applications.

Substiute Parts

IXSH24N60A

IXYSIn Stock: 5903IXSH24N60A Datasheet

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IXXH30N60B3

IXYSIn Stock: 3475IXXH30N60B3 Datasheet

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IXXH30N60B3D1

IXYSIn Stock: 1919IXXH30N60B3D1 Datasheet

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STGFW20V60DF

STMicroelectronicsIn Stock: 1586STGFW20V60DF Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the IXSH24N60A is determined by the following critical electrical and mechanical parameters:

Mandatory Matching Criteria:

• Voltage rating: 600V collector-emitter breakdown voltage
• Package type: TO-247-3 through-hole configuration
• Input type: Standard gate drive
• IGBT architecture compatibility: PT or equivalent field-stop technology

Performance Envelope Criteria:

• Collector current (Ic) rating must equal or exceed 48A
• Maximum power dissipation must support 150W or greater
• Switching characteristics (gate charge, delay times) must be compatible with existing gate drive circuits
• Operating temperature range must encompass -55°C to 150°C minimum

Acceptable Variation:

• Collector current may exceed 48A (uprating acceptable)
• Power dissipation may exceed 150W (uprating acceptable)
• Vce(on) may be lower (improved performance)
• Gate charge may be lower (faster switching acceptable)
• Operating temperature maximum may exceed 150°C (extended range acceptable)

The substitute parts listed below meet these criteria while offering improved performance characteristics in active product lines.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitutes (IXYS GenX3™ / XPT™ Series):

The IXXH30N60B3 and IXXH30N60B3D1 are the preferred substitutes for the IXSH24N60A. Both devices are active products with ROHS3 compliance, ensuring long-term availability and regulatory alignment. These parts maintain identical 600V voltage rating and TO-247-3 package configuration, enabling direct mechanical and electrical compatibility. The IXXH30N60B3D1 variant includes specified reverse recovery time (25 ns), providing additional design margin for applications requiring precise switching characterization.

Key advantages of IXXH30N60B3 / IXXH30N60B3D1:

• 60A collector current rating exceeds the 48A requirement
• 270W power dissipation provides 80% additional thermal headroom
• Reduced Vce(on) (1.85V vs. 2.7V) improves efficiency
• Lower gate charge (39 nC vs. 75 nC) reduces gate drive power
• Faster switching times (23/97 ns vs. 100/450 ns) enable higher frequency operation
• Extended operating temperature to 175°C
• Active product status ensures continued supply chain support

Secondary Substitute (STMicroelectronics Trench Field Stop):

The STGFW20V60DF is an obsolete alternative that maintains 600V voltage rating and through-hole mounting. However, this device presents significant limitations:

• 40A collector current falls below the 48A requirement
• 52W power dissipation is insufficient for 150W applications
• TO-3PF package differs from TO-247-3, requiring board redesign
• Obsolete status limits future availability

The STGFW20V60DF is suitable only for applications with reduced current and power requirements, and only when board-level modifications are acceptable.

Recommendation:

Select IXXH30N60B3D1 for new designs and production continuity. This device provides superior performance, active product status, regulatory compliance, and direct package compatibility with the obsolete IXSH24N60A.

Frequently Asked Questions (FAQ)

Q: Can the IXXH30N60B3 directly replace the IXSH24N60A without circuit modifications?

A: Yes. Both devices share identical 600V voltage rating, TO-247-3 package configuration, standard gate drive input type, and through-hole mounting. Electrical parameters of the IXXH30N60B3 (lower Vce(on), reduced gate charge, faster switching) represent performance improvements that do not require circuit redesign. Thermal design may benefit from the increased power rating (270W vs. 150W), but existing thermal management is compatible.

Q: What is the difference between IXXH30N60B3 and IXXH30N60B3D1?

A: Both devices are electrically and mechanically identical. The IXXH30N60B3D1 variant includes specified reverse recovery time (25 ns), providing additional design documentation for applications requiring precise switching characterization. Selection between these variants depends on design documentation requirements; both are functionally equivalent substitutes.

Q: Why is the STGFW20V60DF listed as a substitute if it has lower current and power ratings?

A: The STGFW20V60DF meets the mandatory 600V voltage and standard gate drive criteria, but does not meet the current (40A vs. 48A) and power (52W vs. 150W) requirements of the IXSH24N60A. This device is listed for reference only and is suitable only for applications with reduced electrical requirements. The different package (TO-3PF vs. TO-247-3) requires board-level modifications.

Q: What is the impact of the lower gate charge in the IXXH30N60B3?

A: Gate charge of 39 nC (vs. 75 nC in IXSH24N60A) reduces the charge that must be supplied by the gate drive circuit. This results in lower gate drive power dissipation, reduced switching losses, and potential for faster switching frequencies. Existing gate drive circuits designed for 75 nC will operate with improved performance margins.

Q: Are there thermal considerations when substituting to the IXXH30N60B3?

A: The IXXH30N60B3 has a higher power rating (270W vs. 150W) and lower Vce(on) (1.85V vs. 2.7V), resulting in reduced power dissipation at equivalent operating points. Existing thermal management (heatsinks, thermal interface materials) will provide improved thermal performance. No thermal design changes are required; however, thermal margins will increase.

Q: What is the significance of the extended operating temperature range in the IXXH30N60B3?

A: The IXXH30N60B3 operates to 175°C junction temperature (vs. 150°C for IXSH24N60A), providing 25°C additional thermal margin. This extended range accommodates applications with higher ambient temperatures or transient thermal events without exceeding device ratings.

Q: Is ROHS3 compliance important for this substitution?

A: ROHS3 compliance indicates adherence to current environmental and regulatory standards. The IXXH30N60B3 and IXXH30N60B3D1 are ROHS3 compliant, ensuring compatibility with modern procurement and manufacturing requirements. The obsolete IXSH24N60A may not meet current regulatory standards for new applications.

Q: Can the IXSH24N60A be used in new designs?

A: No. The IXSH24N60A is classified as obsolete, indicating discontinued manufacturing and limited future availability. New designs must use active products such as IXXH30N60B3 or IXXH30N60B3D1 to ensure supply chain continuity and regulatory compliance.