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IXKC23N60C5 Equivalent & Substitute Parts
Part Overview
The IXKC23N60C5 is an N-Channel 600V 23A MOSFET manufactured by IXYS in the ISOPLUS220™ package. This device is classified as Last Time Buy, indicating that the manufacturer has discontinued or will discontinue production. The part operates across a temperature range of -55°C to 150°C and is designed for through-hole mounting applications requiring high-voltage switching capability.
Due to its Last Time Buy status, identifying equivalent substitute parts with compatible electrical and mechanical specifications is necessary for design continuity and long-term component availability.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain to Source Voltage (Vdss) | 600 | V |
| Continuous Drain Current (Id) @ 25°C | 23 | A |
| Rds On (Max) @ 18A, 10V | 100 | mOhm |
| Gate Threshold Voltage (Vgs(th)) @ 1.2mA | 3.9 | V |
| Gate Charge (Qg) @ 10V | 80 | nC |
| Input Capacitance (Ciss) @ 100V | 2800 | pF |
| Operating Temperature Range | -55 to 150 | °C |
| Mounting Type | Through Hole | — |
| Package | ISOPLUS220™ | — |
Substitute Part Grouping Explanation
Substitution of the IXKC23N60C5 is determined by the following critical parameters:
Electrical Compatibility Criteria:
- Drain to Source Voltage (Vdss) must equal or exceed 600V
- Continuous Drain Current (Id) must meet or exceed 23A at 25°C
- Rds On (Max) must not significantly exceed 100mOhm to maintain thermal performance
- Gate Threshold Voltage (Vgs(th)) must be within acceptable switching range
- Gate Charge (Qg) and Input Capacitance (Ciss) must be compatible with existing gate drive circuitry
Mechanical Compatibility Criteria:
- Mounting type must be Through Hole
- Package must provide equivalent thermal and electrical performance
- Pin configuration must be compatible with existing PCB layouts
The substitute parts identified (STF40N60M2 and AOTF42S60L) meet these electrical specifications while offering higher current ratings and improved thermal characteristics. However, package differences require mechanical evaluation.
Parameter Comparison
| Parameter | IXKC23N60C5 | STF40N60M2 | AOTF42S60L | Unit |
|---|---|---|---|---|
| Manufacturer | IXYS | STMicroelectronics | Alpha & Omega Semiconductor Inc. | — |
| Drain to Source Voltage (Vdss) | 600 | 600 | 600 | V |
| Continuous Drain Current (Id) @ 25°C | 23 | 34 | 39 | A |
| Rds On (Max) @ 10V | 100 @ 18A | 88 @ 17A | 99 @ 21A | mOhm |
| Gate Threshold Voltage (Vgs(th)) | 3.9 @ 1.2mA | 4.0 @ 250µA | 3.8 @ 250µA | V |
| Gate Charge (Qg) @ 10V | 80 | 57 | 40 | nC |
| Input Capacitance (Ciss) @ 100V | 2800 | 2500 | 2154 | pF |
| Operating Temperature Range | -55 to 150 | -55 to 150 | -55 to 150 | °C |
| Mounting Type | Through Hole | Through Hole | Through Hole | — |
| Package | ISOPLUS220™ | TO-220FP | TO-220-3 Full Pack | — |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | — |
| Product Status | Last Time Buy | Active | Not For New Designs | — |
Engineering Selection Recommendations
STF40N60M2 (STMicroelectronics)
The STF40N60M2 is classified as Active product status, ensuring continued availability and manufacturer support. This device exceeds the electrical specifications of the IXKC23N60C5 with 34A continuous drain current, lower Rds On (88mOhm), and reduced gate charge (57nC). The TO-220FP package differs from the ISOPLUS220™ package; PCB layout modification is required. All compliance certifications (ROHS3, REACH Unaffected, EAR99) match the original part.
AOTF42S60L (Alpha & Omega Semiconductor Inc.)
The AOTF42S60L provides the highest current rating (39A) and lowest gate charge (40nC) among the substitutes, with Rds On of 99mOhm. However, this device carries Not For New Designs status, limiting its suitability for long-term applications. The TO-220-3 Full Pack differs from ISOPLUS220™, requiring mechanical redesign. Compliance certifications are equivalent to the original part.
For applications requiring long-term component availability and manufacturer support, STF40N60M2 is the preferred substitute. For existing designs with established thermal management and gate drive circuits, either substitute may be evaluated based on package compatibility and mechanical constraints.
Frequently Asked Questions (FAQ)
Q: Can the STF40N60M2 directly replace the IXKC23N60C5 without circuit modification?
A: Electrical substitution is valid; the STF40N60M2 meets all voltage and current requirements with improved performance characteristics. However, package differences (TO-220FP versus ISOPLUS220™) require PCB layout modification. Gate drive circuitry compatibility must be verified due to differences in gate charge (57nC versus 80nC) and input capacitance (2500pF versus 2800pF).
Q: What are the thermal implications of substituting with a higher-rated device?
A: The STF40N60M2 (34A) and AOTF42S60L (39A) have higher current ratings than the IXKC23N60C5 (23A). Lower Rds On values reduce conduction losses. Thermal performance depends on package thermal resistance, PCB copper area, and heat dissipation design. The TO-220FP and TO-220-3 packages have different thermal characteristics than ISOPLUS220™; thermal analysis is required for the specific application.
Q: Are there compliance or regulatory differences between these parts?
A: All three devices are ROHS3 Compliant, REACH Unaffected, and classified as EAR99. No compliance barriers exist for substitution. However, product status differs: STF40N60M2 is Active (recommended for new designs), while AOTF42S60L is Not For New Designs (limited future availability).
Q: How do gate charge differences affect gate drive circuit design?
A: The IXKC23N60C5 requires 80nC gate charge at 10V. The STF40N60M2 requires 57nC, and the AOTF42S60L requires 40nC. Lower gate charge reduces switching losses and allows faster switching speeds. Existing gate drive circuits designed for 80nC will operate the substitute parts with improved performance; no circuit redesign is required for compatibility.
Q: What package considerations apply to PCB redesign?
A: The IXKC23N60C5 uses ISOPLUS220™ package; substitutes use TO-220FP or TO-220-3 Full Pack. These packages have different pin spacing, mounting hole locations, and thermal pad configurations. PCB footprint redesign is mandatory. Mechanical clearance, heatsink mounting, and thermal interface materials must be re-evaluated for the new package geometry.
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