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IXGR40N60C2D1 Equivalent & Substitute Parts
Part Overview
The IXGR40N60C2D1 is an IGBT (Insulated Gate Bipolar Transistor) rated for 600V collector-emitter breakdown voltage with a maximum collector current of 56A and 170W power dissipation. This device is manufactured by IXYS and packaged in the ISOPLUS247™ through-hole format, part of the HiPerFAST™ series.
The IXGR40N60C2D1 is classified as obsolete. Locating equivalent substitute components is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this IGBT specification.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Collector Emitter Breakdown (Max) | 600 | V |
| Current - Collector (Ic) (Max) | 56 | A |
| Current - Collector Pulsed (Icm) | 200 | A |
| Power - Max | 170 | W |
| Vce(on) (Max) @ Vge, Ic | 2.7V @ 15V, 30A | V |
| Gate Charge | 95 | nC |
| Switching Energy (off) | 200 | µJ |
| Td (on/off) @ 25°C | 18ns/90ns | ns |
| Reverse Recovery Time (trr) | 25 | ns |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Package / Case | TO-247-3 | - |
| Mounting Type | Through Hole | - |
Substitute Part Grouping Explanation
Substitute components for the IXGR40N60C2D1 must satisfy the following electrical and mechanical criteria:
Voltage Rating: Collector-emitter breakdown voltage must be rated at 600V maximum, matching the primary application voltage class.
Current Rating: Collector current (Ic) must be equal to or greater than 56A to ensure the substitute can handle the design current without derating.
Power Dissipation: Maximum power rating must be equal to or greater than 170W to accommodate thermal requirements in the application.
Package Compatibility: The substitute must use the TO-247-3 through-hole package format to ensure mechanical and thermal interface compatibility with existing PCB designs and heat sink mounting arrangements.
Operating Temperature: The substitute must support the full operating temperature range of -55°C to 150°C (junction temperature).
Input Type: Standard input type configuration must be maintained for gate drive circuit compatibility.
The AOK30B60D1 from Alpha & Omega Semiconductor Inc. meets these substitution criteria. This device is rated for 600V, 60A collector current (exceeding the 56A requirement), 208W power dissipation (exceeding the 170W requirement), and is packaged in TO-247-3 format with through-hole mounting. The device supports the required operating temperature range and maintains standard input type configuration.
Parameter Comparison
| Parameter | IXGR40N60C2D1 | AOK30B60D1 | Unit |
|---|---|---|---|
| Manufacturer | IXYS | Alpha & Omega Semiconductor Inc. | - |
| Product Status | Obsolete | Active | - |
| Voltage - Collector Emitter Breakdown (Max) | 600 | 600 | V |
| Current - Collector (Ic) (Max) | 56 | 60 | A |
| Current - Collector Pulsed (Icm) | 200 | 96 | A |
| Power - Max | 170 | 208 | W |
| Vce(on) (Max) @ Vge, Ic | 2.7V @ 15V, 30A | 2.4V @ 15V, 26A | V |
| Gate Charge | 95 | 34 | nC |
| Switching Energy (off) | 200 | 240 | µJ |
| Td (on/off) @ 25°C | 18ns/90ns | 20ns/58ns | ns |
| Reverse Recovery Time (trr) | 25 | 120 | ns |
| Operating Temperature Range | -55 to 150 | -55 to 150 | °C (TJ) |
| Package / Case | TO-247-3 | TO-247-3 | - |
| Mounting Type | Through Hole | Through Hole | - |
| Input Type | Standard | Standard | - |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | - |
| REACH Status | REACH Unaffected | REACH Unaffected | - |
| ECCN | EAR99 | EAR99 | - |
Engineering Selection Recommendations
The AOK30B60D1 is the qualified substitute for the obsolete IXGR40N60C2D1. Selection of this substitute is based on the following engineering factors:
Product Status: The IXGR40N60C2D1 is obsolete, making the AOK30B60D1 (active product status) the appropriate choice for ongoing supply and production support.
Regulatory Compliance: Both devices maintain REACH Unaffected status and EAR99 export classification, ensuring equivalent compliance posture. The AOK30B60D1 carries additional RoHS3 compliance certification, providing enhanced environmental regulatory alignment.
Electrical Equivalence: The AOK30B60D1 meets or exceeds all critical electrical parameters. The 600V voltage rating matches the application requirement. The 60A collector current rating exceeds the 56A specification, providing design margin. The 208W power rating exceeds the 170W requirement, supporting thermal performance.
Package and Mounting: Both devices use identical TO-247-3 through-hole packaging, ensuring direct mechanical and thermal interface compatibility with existing designs without PCB modification.
Temperature Range: Both devices support the full -55°C to 150°C operating temperature range, maintaining thermal design equivalence.
Gate Drive Compatibility: Both devices employ standard input type configuration, ensuring gate drive circuit compatibility without modification.
Frequently Asked Questions (FAQ)
Q: Can the AOK30B60D1 directly replace the IXGR40N60C2D1 in existing designs?
A: Yes. Both devices use the TO-247-3 through-hole package with identical pinout and mounting configuration. The AOK30B60D1 meets or exceeds all critical electrical parameters (voltage, current, power rating, and temperature range), enabling direct substitution without PCB modification.
Q: What are the key differences between these two IGBTs?
A: The AOK30B60D1 provides higher collector current (60A vs. 56A) and power rating (208W vs. 170W). The AOK30B60D1 features lower gate charge (34nC vs. 95nC) and faster turn-off switching time (58ns vs. 90ns), resulting in improved switching performance. The AOK30B60D1 has a higher reverse recovery time (120ns vs. 25ns), which may affect switching losses in specific circuit topologies.
Q: Are there any thermal considerations when substituting these devices?
A: The AOK30B60D1 has a higher power rating (208W vs. 170W), indicating greater thermal capability. Both devices operate across the same temperature range (-55°C to 150°C). Existing heat sink designs for the IXGR40N60C2D1 will accommodate the AOK30B60D1 without modification. Thermal performance may improve due to the higher power rating.
Q: What is the impact of the lower gate charge in the AOK30B60D1?
A: The AOK30B60D1 has significantly lower gate charge (34nC vs. 95nC), requiring less charge to drive the gate. This reduces gate drive circuit power consumption and may allow for faster switching transitions. Gate drive circuits designed for the IXGR40N60C2D1 will operate with the AOK30B60D1 without modification, though the lower gate charge may result in improved efficiency.
Q: Are both devices compliant with current environmental regulations?
A: Yes. Both devices maintain REACH Unaffected status and EAR99 export classification. The AOK30B60D1 carries additional RoHS3 compliance certification, providing enhanced environmental regulatory alignment for new designs.
Q: What is the significance of the different reverse recovery times?
A: The IXGR40N60C2D1 has a reverse recovery time of 25ns, while the AOK30B60D1 has 120ns. This difference affects switching loss characteristics in specific circuit topologies, particularly in hard-switched applications. Circuit simulation or testing may be warranted to evaluate switching loss impact in the specific application.
Q: Can the AOK30B60D1 be used in applications requiring the exact switching characteristics of the IXGR40N60C2D1?
A: The AOK30B60D1 has different switching characteristics, including lower gate charge, faster turn-off time, and higher reverse recovery time. Applications with strict switching performance requirements should evaluate the AOK30B60D1 through circuit simulation or prototype testing to confirm compatibility with the specific application topology and control strategy.
Q: Is the AOK30B60D1 available in the same packaging format?
A: Yes. Both devices use the TO-247-3 through-hole package. The AOK30B60D1 is supplied in tube packaging, while the IXGR40N60C2D1 was supplied in standard packaging. The component itself is mechanically and electrically identical in form factor, ensuring direct PCB compatibility.
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