IXFX120N65X2 Equivalent & Substitute Parts

Part Overview

The IXFX120N65X2 is an N-Channel MOSFET manufactured by IXYS, part of the HiPerFET™ Ultra X2 series. This device is rated for 650V drain-to-source voltage with 120A continuous drain current and 1250W maximum power dissipation. The component is housed in a PLUS247™-3 package and is designed for high-power switching applications requiring robust thermal performance and high current handling capability.

The IXFX120N65X2 maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified based on matching critical electrical parameters: drain-to-source voltage rating, continuous drain current capability, package compatibility, and operating temperature range. Alternative devices enable design flexibility when primary inventory is unavailable or when application-specific performance characteristics require evaluation.

Substiute Parts

IXFX120N65X2
IXYSIn Stock: 1186IXFX120N65X2 Datasheet
IXFX120N65X2
Current Part
SCT3022ALGC11
Rohm SemiconductorIn Stock: 2812SCT3022ALGC11 Datasheet
SCT3022ALGC11
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Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 650 V
Current - Continuous Drain (Id) @ 25°C 120 A (Tc)
Rds On (Max) @ Id, Vgs 24 mOhm @ 60A, 10V
Power Dissipation (Max) 1250 W (Tc)
Operating Temperature Range -55 to 150 °C (TJ)
Package Type TO-247-3 Variant Through Hole
FET Technology MOSFET (Metal Oxide) N-Channel

Substitute Part Grouping Explanation

Substitute parts for the IXFX120N65X2 are identified based on the following critical electrical and mechanical parameters:

Voltage Rating Compatibility: The substitute device must maintain the 650V drain-to-source voltage (Vdss) rating to ensure safe operation within the same circuit topology and voltage stress conditions.

Current Handling Capability: The substitute must support continuous drain current (Id) at or above the application requirement. The IXFX120N65X2 specifies 120A continuous drain current; substitute devices with lower current ratings require circuit-level current derating analysis.

Package and Mounting: The substitute must use through-hole mounting in a TO-247 variant package to maintain mechanical compatibility with existing PCB layouts and thermal management infrastructure.

Technology Platform: Both MOSFET and SiCFET technologies are acceptable substitutes when electrical parameters align, as both are N-Channel devices with compatible gate drive characteristics and switching performance profiles.

Compliance and Status: All substitute parts must maintain Active product status and RoHS3 compliance to ensure supply chain continuity and regulatory alignment.

Parameter Comparison

Parameter IXFX120N65X2 SCT3022ALGC11 Unit
Manufacturer IXYS Rohm Semiconductor
FET Type N-Channel N-Channel
Technology MOSFET (Metal Oxide) SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss) 650 650 V
Current - Continuous Drain (Id) @ 25°C 120 93 A (Tc)
Rds On (Max) @ Id, Vgs 24 @ 60A, 10V 28.6 @ 36A, 18V mOhm
Power Dissipation (Max) 1250 339 W (Tc)
Operating Temperature (Max) 150 175 °C (TJ)
Package / Case TO-247-3 Variant TO-247-3
Mounting Type Through Hole Through Hole
RoHS Status ROHS3 Compliant ROHS3 Compliant
Product Status Active Active

Engineering Selection Recommendations

Primary Selection Criteria:

The IXFX120N65X2 is the specified component and should be used when available. Both the IXFX120N65X2 and SCT3022ALGC11 maintain Active product status and full RoHS3 compliance, ensuring regulatory and supply chain continuity.

Substitution Considerations:

The SCT3022ALGC11 provides electrical compatibility at the 650V voltage rating and through-hole TO-247-3 package level. However, the following parameter differences require circuit-level evaluation:

The SCT3022ALGC11 delivers 93A continuous drain current compared to the IXFX120N65X2 specification of 120A. Applications requiring the full 120A rating cannot use this substitute without current derating or parallel device configuration.

The SCT3022ALGC11 maximum power dissipation is 339W (Tc) versus 1250W (Tc) for the IXFX120N65X2. Thermal management design must account for this reduced power handling capability.

The SCT3022ALGC11 operates to a maximum junction temperature of 175°C compared to 150°C for the IXFX120N65X2, providing extended thermal margin in high-temperature environments.

Gate drive voltage differs: the IXFX120N65X2 uses 10V drive voltage while the SCT3022ALGC11 requires 18V. Gate driver circuits must be verified for compatibility with the higher drive voltage requirement.

Compliance Alignment:

Both devices are RoHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with identical HTSUS codes (8541.29.0095), ensuring regulatory and export compliance equivalence.

Frequently Asked Questions (FAQ)

Q: Can the SCT3022ALGC11 directly replace the IXFX120N65X2 in all applications?

A: Direct replacement is limited by current and power dissipation ratings. The SCT3022ALGC11 is rated for 93A continuous drain current and 339W maximum power dissipation, compared to 120A and 1250W for the IXFX120N65X2. Applications operating at or near the IXFX120N65X2 maximum ratings require circuit redesign or parallel device configuration to use the SCT3022ALGC11.

Q: Are the packages mechanically compatible?

A: Both devices use TO-247-3 through-hole packages. The IXFX120N65X2 is specified as a TO-247-3 Variant, and the SCT3022ALGC11 uses a standard TO-247N package. Both are compatible with identical PCB footprints and thermal management hardware.

Q: What is the difference between MOSFET and SiCFET technology in this comparison?

A: The IXFX120N65X2 uses traditional MOSFET (Metal Oxide) technology, while the SCT3022ALGC11 uses SiCFET (Silicon Carbide) technology. Both are N-Channel devices with compatible gate drive characteristics. SiCFET technology typically offers lower switching losses and higher temperature capability, as reflected in the SCT3022ALGC11 maximum junction temperature of 175°C versus 150°C for the MOSFET.

Q: What gate drive voltage is required for each device?

A: The IXFX120N65X2 specifies a maximum Rds On at 10V gate drive voltage. The SCT3022ALGC11 specifies a maximum Rds On at 18V gate drive voltage. Gate driver circuits must be capable of delivering the appropriate voltage for each device. The SCT3022ALGC11 requires higher gate drive voltage, which may impact driver circuit design and power consumption.

Q: Are both devices RoHS3 compliant?

A: Yes, both the IXFX120N65X2 and SCT3022ALGC11 are RoHS3 compliant with unlimited moisture sensitivity rating (MSL 1). Both are REACH unaffected and classified under ECCN EAR99.

Q: What is the maximum operating temperature for each device?

A: The IXFX120N65X2 operates to a maximum junction temperature of 150°C. The SCT3022ALGC11 operates to a maximum junction temperature of 175°C, providing 25°C additional thermal margin for high-temperature applications.

Q: How do the on-resistance specifications compare?

A: The IXFX120N65X2 specifies 24 mOhm maximum Rds On at 60A and 10V gate drive. The SCT3022ALGC11 specifies 28.6 mOhm maximum Rds On at 36A and 18V gate drive. The IXFX120N65X2 exhibits lower on-resistance at higher current levels, resulting in lower conduction losses in high-current applications.

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