IXFV30N50PS N-Channel 500V 30A MOSFET Equivalent & Substitute Parts

Part Overview

The IXFV30N50PS is an N-Channel MOSFET manufactured by IXYS, rated for 500V drain-to-source voltage and 30A continuous drain current in a surface mount PLUS-220SMD package. This device is classified as obsolete, necessitating identification of equivalent substitute components for ongoing design support and procurement requirements. The part operates across a temperature range of -55°C to 150°C and dissipates up to 460W at the case temperature.

Substiute Parts

IXFV30N50PS
IXYSIn Stock: 761IXFV30N50PS Datasheet
IXFV30N50PS
Current Part
APT30F50B
Microchip TechnologyIn Stock: 1133APT30F50B Datasheet
APT30F50B
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Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 500 V
Current - Continuous Drain (Id) @ 25°C 30 A
Rds On (Max) @ Id, Vgs 200 mOhm @ 15A, 10V
Gate Charge (Qg) (Max) @ Vgs 70 nC @ 10V
Power Dissipation (Max) 460 W
Operating Temperature Range -55 to 150 °C
Mounting Type Surface Mount
Package PLUS-220SMD

Substitute Part Grouping Explanation

Substitute parts for the IXFV30N50PS are identified based on electrical parameter equivalence within the following criteria:

Electrical Matching Parameters:

  • Drain-to-Source Voltage (Vdss): 500V minimum
  • Continuous Drain Current (Id): 30A minimum at 25°C
  • Gate-Source Voltage (Vgs): ±30V maximum rating
  • Operating Temperature Range: -55°C to 150°C minimum
  • Technology: N-Channel MOSFET (Metal Oxide)

Functional Equivalence Criteria: Substitute devices must maintain the same voltage and current ratings to ensure direct functional replacement in circuit applications. Secondary parameters including on-resistance, gate charge, and power dissipation are evaluated for performance compatibility but do not disqualify substitution when primary ratings are met.

Package Consideration: The IXFV30N50PS uses a surface mount PLUS-220SMD package. Substitute parts may employ different package types (such as through-hole TO-247) when electrical parameters are equivalent, though board-level integration modifications may be required.

Parameter Comparison

Parameter IXFV30N50PS APT30F50B Unit
Manufacturer IXYS Microchip Technology
FET Type N-Channel N-Channel
Drain to Source Voltage (Vdss) 500 500 V
Current - Continuous Drain (Id) @ 25°C 30 30 A
Drive Voltage (Max Rds On) 10 10 V
Rds On (Max) @ Id, Vgs 200 mOhm @ 15A, 10V 190 mOhm @ 14A, 10V
Vgs(th) (Max) @ Id 5V @ 4mA 5V @ 1mA
Gate Charge (Qg) (Max) @ Vgs 70 115 nC @ 10V
Vgs (Max) ±30 ±30 V
Input Capacitance (Ciss) (Max) @ Vds 4150 4525 pF @ 25V
Power Dissipation (Max) 460 415 W
Operating Temperature Range -55 to 150 -55 to 150 °C
Mounting Type Surface Mount Through Hole
Package / Case PLUS-220SMD TO-247-3
Product Status Obsolete Active

Engineering Selection Recommendations

APT30F50B (Microchip Technology)

The APT30F50B is an active product that meets all primary electrical specifications of the IXFV30N50PS. Both devices share identical Vdss (500V) and Id (30A) ratings, identical Vgs maximum (±30V), and matching operating temperature ranges (-55°C to 150°C).

The APT30F50B demonstrates superior on-resistance performance (190 mOhm versus 200 mOhm) and lower gate charge (70 nC versus 115 nC), resulting in improved switching efficiency. Power dissipation is slightly lower at 415W compared to 460W, which represents acceptable thermal performance for equivalent applications.

The primary design consideration is the package transition from surface mount PLUS-220SMD to through-hole TO-247-3. This substitution requires board-level layout modifications and mechanical mounting changes but does not affect electrical compatibility.

The APT30F50B carries ROHS3 compliance certification and maintains REACH Unaffected status, consistent with the original part's regulatory standing. Active product status ensures long-term availability and supply chain continuity.

Frequently Asked Questions (FAQ)

Q: Can the APT30F50B directly replace the IXFV30N50PS without circuit modifications?

A: The APT30F50B is electrically equivalent and will function identically in circuit operation. However, the package change from PLUS-220SMD (surface mount) to TO-247-3 (through-hole) requires board redesign and mechanical mounting modifications. No schematic changes are necessary.

Q: What are the key electrical parameters that determine substitution compatibility?

A: Substitution compatibility is determined by: (1) Drain-to-Source Voltage rating of 500V minimum, (2) Continuous Drain Current of 30A minimum at 25°C, (3) Gate-Source Voltage maximum of ±30V, and (4) Operating temperature range of -55°C to 150°C. All substitute parts must meet or exceed these specifications.

Q: How do the on-resistance and gate charge differences affect circuit performance?

A: The APT30F50B exhibits lower on-resistance (190 mOhm versus 200 mOhm) and lower gate charge (70 nC versus 115 nC). These characteristics result in reduced conduction losses and faster switching transitions, improving overall circuit efficiency. These differences are beneficial and do not create compatibility issues.

Q: Is the APT30F50B suitable for high-frequency switching applications?

A: The APT30F50B gate charge specification of 70 nC supports high-frequency operation. The lower gate charge compared to alternative devices enables faster switching with reduced driver power requirements, making it suitable for applications requiring rapid switching transitions.

Q: What compliance certifications apply to the APT30F50B?

A: The APT30F50B is ROHS3 compliant and maintains REACH Unaffected status. These certifications align with the original IXFV30N50PS regulatory requirements, ensuring compatibility with environmental and hazardous substance regulations.

Q: Why is the IXFV30N50PS classified as obsolete?

A: Obsolete status indicates the part is no longer manufactured by IXYS and is not available through standard distribution channels. The APT30F50B, classified as active, provides equivalent functionality with assured long-term availability.

Q: Are there thermal management differences between the two packages?

A: The PLUS-220SMD surface mount package and TO-247-3 through-hole package have different thermal characteristics. The TO-247-3 package typically provides superior thermal dissipation through direct mounting to heatsinks. Thermal design calculations should account for the specific package thermal resistance values when transitioning between these devices.

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